公开(公告)号：US4647266A

公开(公告)日：1987-03-03

申请号：US523817

申请日：1983-08-15

Applicant: George L. Coad ,  Martin A. Hutchinson ,  R. Howard Shaw

Inventor： George L. Coad ,  Martin A. Hutchinson ,  R. Howard Shaw

IPC: C23C14/34 ,  C23C14/56 ,  H01L21/00 ,  H01L21/687 ,  C23C15/00

CPC classification number: H01L21/67109 ,  C23C14/34 ,  C23C14/56 ,  H01L21/68707 ,  Y10S414/138 ,  Y10S414/139

Abstract: An elevator structure is actuated to remove wafers individually out of a storage cassette to an elevated delivery position. The elevator is a lift blade with an arcuate upper end shaped to match the curvature of the wafers, and a groove within this end adapted to match the thickness of a wafer and retain a wafer edgewise. A wafer-holding chuck on a chuck assembly is adapted to receive a wafer from the elevator when the elevator is in the elevated delivery position. The chuck assembly is movable from the delivery position to a remote position where the chuck presents the wafer to a support member. The support member is provided with an aperture and a plurality of deformable wafer-holding clips spaced around the aperture. The chuck assembly includes a pneumatic cylinder capable of contacting a portion of each clip to urge same to an open position. The invention includes an arrangement in which the chuck is mounted on a chuck assembly in the form of a door for sealing an opening in a process chamber.

Abstract translation: 致动电梯结构以将晶片单独地从存储盒中移出到升高的传送位置。 升降机是具有弧形上端的升降机叶片，其形状适于晶片的曲率，并且该端部内的凹槽适于匹配晶片的厚度并沿着边缘保持晶片。 卡盘组件上的晶片保持卡盘适于当电梯处于升高的输送位置时从电梯接收晶片。 卡盘组件可以从输送位置移动到远程位置，其中卡盘将晶片呈现到支撑构件。 支撑构件设置有孔和围绕孔间隔开的多个可变形的晶片保持夹。 卡盘组件包括能够接触每个夹子的一部分以将其推到打开位置的气缸。 本发明包括一种布置，其中卡盘以门的形式安装在卡盘组件上，用于密封处理室中的开口。

公开(公告)号：US4311427A

公开(公告)日：1982-01-19

申请号：US106342

申请日：1979-12-21

Applicant: George L. Coad ,  R. Howard Shaw ,  Martin A. Hutchinson

Inventor： George L. Coad ,  R. Howard Shaw ,  Martin A. Hutchinson

IPC: B65G1/00 ,  B65G1/16 ,  B65G49/07 ,  C23C14/56 ,  H01L21/67 ,  H01L21/677 ,  C23C15/00

CPC classification number: C23C14/56 ,  H01L21/67772 ,  H01L21/67778 ,  Y10S414/136 ,  Y10S414/138 ,  Y10S414/139 ,  Y10S414/14

Abstract: A system for the automated handling and transfer of wafers individually and repetitively to and between processing stations and cassettes. A track-like conveyor engages a cassette holding a plurality of wafers in vertically facing alignment, to move same horizontally past a loading station of a processing chamber. A vertically moveable blade passes between the conveyor tracks and through the cassette to engage a wafer edgewise from below and move same upwardly to the processing chamber entrance. Vacuum means mounted to the door of the chamber entrance engages and holds the wafer during insertion into the chamber by closure of the door. Clip means are mounted within the periphery of an aperture of a vertical support plate just within the chamber entrance, to engage edgewise the wafer and support it within the plate aperture while in the processing chamber. The wafer is removed after processing by operating the foregoing apparatus in reverse order. The processing chamber may be a vacuum chamber, and minimal-volume load lock means therefor are advantageously provided by the system with the aid of a sealing member within the chamber compressible against the wafer support plate and chamber wall while the chamber door is open, to seal off the entrance area from the remainder of the chamber. The wafer support plate is moveable within the processing chamber to various wafer processing stations once the door is closed and the sealing member withdrawn.

Abstract translation: 一种用于自动处理和转移晶片的系统，用于单独和重复地传送到处理站和盒之间和之间。 轨道状输送器与保持垂直面对齐的多个晶片的盒相接合，以使其水平移动通过处理室的装载站。 垂直移动的叶片在输送轨道之间通过并通过盒子从下方沿边缘接合晶片并向上移动到处理室入口。 安装到腔室入口的门的真空装置通过关闭门来插入到腔室中并保持晶片。 夹紧装置安装在刚好在室入口内的垂直支撑板的孔的周边内，以沿边缘接合晶片并将其支撑在板孔内，同时处于处理室中。 通过以相反的顺序操作上述装置，在处理之后移除晶片。 处理室可以是真空室，并且其中最小容积的负载锁定装置有利地由系统借助于腔室内的密封构件提供，同时室室打开时可压缩抵靠晶片支撑板和室壁，至 从室的其余部分密封入口区域。 一旦门关闭并且密封构件被取出，晶片支撑板可在处理室内移动到各种晶片处理站。

公开(公告)号：US5281320A

公开(公告)日：1994-01-25

申请号：US680219

申请日：1991-04-04

Applicant: Frederick T. Turner ,  Martin A. Hutchinson ,  R. Howard Shaw ,  Lawrence T. Lamont, Jr.

Inventor： Frederick T. Turner ,  Martin A. Hutchinson ,  R. Howard Shaw ,  Lawrence T. Lamont, Jr.

IPC: C23C14/34 ,  C23C14/50 ,  C23C14/54 ,  C23C14/56 ,  H01L21/00 ,  H01L21/677 ,  H01L21/687

CPC classification number: H01L21/67751 ,  C23C14/34 ,  C23C14/50 ,  C23C14/541 ,  C23C14/56 ,  H01L21/67098 ,  H01L21/67109 ,  H01L21/68707

Abstract: Semiconductor wafers having patterns of steps and grooves defining microcircuit elements thereon are coated with metallic film by supporting the wafers individually adjacent a respective ring-shaped sputtering source in stationary relationship thereto. To effectuate such individual wafer processing on a continuous basis and preserve the evacuated argon environment, a vacuum chamber sputter coating apparatus is provided which has a number of work stations therein, at least one of which includes said ring-shaped sputtering source. Also included is a load lock, and an intermittently rotting vertical plate-like wafer carrier means therewithin positioned closely adjacent the chamber entrance, and carrying wafers in turn from the load lock to the work stations. The carrier includes apertures each accepting a wafer therewithin in an upright position, with the wafers edgewise resiliently supported by clip means, without the use of any externally-originating supports such as platens. Both surfaces of wafer can be accessed by processing equipment, for example, heating or cooling means at some of the work stations. Only a few wafers inside the chamber are at risk at any one time, and introduction of contaminants, debris, as well as disturbances to the chamber environment minimized.

Abstract translation: 具有限定其上的微电路元件的步骤和凹槽的图案的半导体晶片通过将晶片与静止关系的各个环形溅射源单独地相邻地支撑晶片来涂覆金属膜。 为了连续地实现这种单独的晶片处理并保持抽真空的氩气环境，提供了一种在其中具有多个工位的真空室溅射镀膜装置，其中至少一个包括所述环形溅射源。 还包括一个负载锁定，以及一个间歇性地旋转的垂直板状晶片承载装置，其位于与腔室入口紧密相邻的位置，并将晶片依次从负载锁传送到工作站。 载体包括各自在直立位置接收晶片的孔，其中晶片沿边缘由夹持装置弹性地支撑，而不使用任何外部来源的支撑件例如压板。 晶片的两个表面都可以通过处理设备来访问，例如在某些工作站的加热或冷却装置。 任何时候，室内只有几个晶圆处于危险之中，污染物，碎片以及室内环境的扰动引入最小化。

公开(公告)号：US4548699A

公开(公告)日：1985-10-22

申请号：US611551

申请日：1984-05-17

Applicant: Martin A. Hutchinson ,  R. Howard Shaw ,  George Coad

Inventor： Martin A. Hutchinson ,  R. Howard Shaw ,  George Coad

IPC: B65G47/24 ,  B23Q39/04 ,  C23C14/56 ,  H01L21/66 ,  H01L21/677

CPC classification number: H01L21/67751 ,  C23C14/566 ,  C23C14/568 ,  Y10S414/139

Abstract: The system for rotating the transfer plate of a coating system in a vacuum chamber consists of a transfer plate driver assembly on the outside of the chamber at the axis and a transfer plate rotator assembly inside the chamber. The driver assembly consists of a pneumatic actuator for linear motion, a barrel cam which translates the linear motion into rotary motion with high torque at starting and stopping positions, and a rotary feedthrough all in a structural housing. The rotator assembly comprises a central hub with means for supporting the end walls, a transfer plate hub assembly and a ratchet arm connected to the rotary feedthrough. As the pressure plate assembly is drawn back by the ram, it in turn draws back the transfer plate and engages the ratchet arm with the transfer plate hub. The actuator then rotates the transfer plate. The ram then reverses direction, the ratchet arm disengages and is returned to its initial position.

公开(公告)号：US4756815A

公开(公告)日：1988-07-12

申请号：US106343

申请日：1979-12-21

Applicant: Frederick T. Turner ,  Martin A. Hutchinson ,  R. Howard Shaw ,  Lawrence T. Lamont, Jr.

Inventor： Frederick T. Turner ,  Martin A. Hutchinson ,  R. Howard Shaw ,  Lawrence T. Lamont, Jr.

IPC: B65G49/07 ,  C23C14/34 ,  C23C14/50 ,  C23C14/54 ,  C23C14/56 ,  H01L21/00 ,  H01L21/02 ,  H01L21/203 ,  H01L21/285 ,  H01L21/31 ,  H01L21/3205 ,  H01L21/67 ,  H01L21/677 ,  H01L21/687 ,  C23C14/36

CPC classification number: H01L21/67748 ,  C23C14/34 ,  C23C14/50 ,  C23C14/541 ,  C23C14/56 ,  H01L21/67109 ,  H01L21/67751 ,  H01L21/68707

Abstract: Semiconductor wafers having patterns of steps and grooves defining microcircuit elements thereon are coated with metallic film by supporting the wafers individually adjacent a respective ring-shaped sputtering source in stationary relationship thereto. Within a short deposition time of approximately one minute, good uniformity of deposition across the main wafer plane is obtained by maintaining source-to-wafer spacing less than the diameter of the source, and an effective source diameter (D.sub.s) larger than the diameter of wafer (D.sub.w) with the coating being performed within an argon environment of 2 to 20 microns pressure. Good step coverage across all surfaces of steps and grooves is likewise obtained, and is further enhanced by confining the source-to-wafer spacing ranges to certain values within about 0.4 D.sub.s to 0.9 D.sub.s and the wafer diameter to certain values up to about 0.7 D.sub.s. To effectuate such individual wafer processing on a continuous basis and preserve the evacuated argon environment, a vacuum chamber sputter coating apparatus is provided which has a number of work stations therein, at least one of which includes said ring-shaped sputtering source. Also included is a load lock; and an intermittently rotating vertical plate-like wafer carrier means therewithin positioned closely adjacent the chamber entrance, and carrying wafers in turn from the load lock to the work stations. The carrier includes apertures each accepting a wafer therewithin in an upright position, with the wafers edgewise resiliently supported by clip means, without the use of any externally-originating supports such as platens. A closure member within the chamber is movable against the plate opposite the chamber entrance to close off the plate aperture from the chamber environment during loading and unloading of a wafer, and a door is provided to close the chamber opening and thus complete a thin low-volume load lock. The door is also provided with vacuum means to grasp a wafer presented vertically by a blade-like elevator which cooperates with a cassette and conveyor moving the cassette along a horizontal path below the chamber entrance. The cassette holds wafers vertically, and the blade passes therethrough to lift individual wafers edgewise to the door vacuum means. Closure of the door inserts the wafer into the clip means within the carrier and chamber, and the reverse operation extracts a wafer previously coated at a sputtering work station. Both surfaces of the wafer can be accessed by processing equipment, for example, heating or cooling means at some of the work stations. Only a few wafers inside the chamber are at risk at any one time, and introduction of contaminants, debris, as well as disturbances to the chamber environment are minimized.

公开(公告)号：US4338521A

公开(公告)日：1982-07-06

申请号：US148261

申请日：1980-05-09

Applicant: R. Howard Shaw ,  Charles C. Morehouse

Inventor： R. Howard Shaw ,  Charles C. Morehouse

IPC: A61B6/03 ,  G01T1/164 ,  G01T1/20

CPC classification number: G01T1/2018 ,  G01T1/1644 ,  A61B6/4411

Abstract: A modular radiation detector array which allows improved spatial resolution and facilitates installation and replacement for repair. Each module includes two detachably assembled portions with one portion including a plurality of spaced plates for collimating radiation. The second portion includes a printed circuit board, a semiconductor diode array chip mounted on the printed circuit board, and a plurality of scintillator crystals mounted on the semiconductor chip with each crystal overlying a diode. Signals from the diodes are applied to signal processing means by a cable which is readily connected to and disconnected from the diode array.

Abstract translation: 模块化辐射探测器阵列，可提高空间分辨率，便于安装和更换。 每个模块包括两个可拆卸地组装的部分，其中一个部分包括用于准直辐射的多个隔开的板。 第二部分包括安装在印刷电路板上的印刷电路板，半导体二极管阵列芯片和安装在半导体芯片上的多个闪烁体晶体，每个晶体覆盖二极管。 来自二极管的信号通过容易地连接到二极管阵列并与二极管阵列断开的电缆施加到信号处理装置。

公开(公告)号：US4779877A

公开(公告)日：1988-10-25

申请号：US154537

申请日：1988-02-12

Applicant: R. Howard Shaw

Inventor： R. Howard Shaw

IPC: H01L21/687 ,  B23B5/22

CPC classification number: H01L21/68728 ,  Y10T279/1224 ,  Y10T279/1283 ,  Y10T279/18

Abstract: An assembly is provided for supporting semiconductor wafers individually within a support while permitting processing of both faces of a wafer as well as facilitating rapid insertion and removal of wafers into the support. Each assembly includes a wire clip having an arcuate tip used to grasp the wafer. The wire clip can be moved in two planes by actuating mechanisms, thereby moving the clip out of the plane of wafer processing and facilitating loading in the wafer processing plane.

Abstract translation: 提供了一种用于将半导体晶片单独支撑在支撑体内的组件，同时允许晶片的两个面的处理以及促进将晶片快速插入和移除到支撑体中。 每个组件包括具有用于抓住晶片的弓形顶端的线夹。 线夹可以通过致动机构在两个平面中移动，从而将夹子移动离开晶片处理平面，并有助于在晶片处理平面中加载。

公开(公告)号：US4306731A

公开(公告)日：1981-12-22

申请号：US106179

申请日：1979-12-21

Applicant: R. Howard Shaw

Inventor： R. Howard Shaw

IPC: H01L21/683 ,  H01L21/67 ,  H01L21/677 ,  H01L21/687 ,  B23B5/22

CPC classification number: H01L21/68728 ,  H01L21/67778 ,  Y10S269/903 ,  Y10S414/136 ,  Y10S414/138 ,  Y10S414/139 ,  Y10S414/14 ,  Y10T279/1224 ,  Y10T279/1283 ,  Y10T279/18

Abstract: An assembly is provided for protectively supporting semiconductor wafers individually within a support while permitting processing of both faces of the wafer, as well as facilitating rapid insertion and removal of wafers into the support, and movement of wafers between processing stations. The assembly includes a plate-like support through which is defined an aperture of diameter larger than the wafer, and a plurality of clips mounted within the periphery of the aperture and the plane thereof and resiliently gripping edgewise a wafer inserted into the aperture and supporting same within the plane of the aperture. Each clip extends centrally inwardly of the aperture and terminates in an arcuate portion within which the edge of the wafer is retained, and defines a flat portion generally parallel to the aperture plane. The support assembly is advantageously positioned within a processing chamber, and the support plate preferably includes a plurality of apertures and associated clips, as well as being movable within the chamber to various processing stations. Extendable pins associated with the processing chamber are provided to depress the flat portion of the clips during wafer insertion and removal to obviate any possibility of abrasion. Simple automated equipment is usable to effect wafer insertion and removal, and a thin load lock of small volume is easily defined by sandwiching the support between suitable sealing members.

Abstract translation: 提供了一种用于在支撑体内单独地保护性地支撑半导体晶片的组件，同时允许晶片的两个面的处理，以及促进晶片快速插入和移除到支撑体中以及在处理站之间移动晶片。 组件包括板状支撑件，通过该板状支撑件限定直径大于晶片的孔径，以及多个夹子，其安装在孔口及其平面的周边内，并且沿箭头方向夹紧插入孔中的晶片并支撑其 在光圈的平面内。 每个夹子在孔的中心向内延伸并且终止于弧形部分，晶片的边缘保持在该弧形部分内，并限定大致平行于孔平面的平坦部分。 支撑组件有利地定位在处理室内，并且支撑板优选地包括多个孔和相关联的夹子，并且可在腔室内移动到各个处理站。 提供与处理室相关联的可扩展销以在晶片插入和移除期间按压夹子的平坦部分以消除任何磨损的可能性。 简单的自动化设备可用于影响晶片插入和移除，并且通过将支撑件夹在合适的密封构件之间容易地限定小体积的薄的负载锁定。