摘要:
Unidirectional and bidirectional bipolar logic transmission gates have an input, an output, a gate control, supply and common terminals. The unilateral transmission gate circuit includes first and second switching transistors and associated first and second source tranisistors. The transistors each have collector, base and emitter electrodes, said first source transistor emitter being connected to said supply terminal. The collector of the first switching transistor is connected to the base of the second switching transistor and defines a gate logic node. The base of the first switching transistor is connected to the first input terminal and the collector of the second switching transistor is connected to the output terminal with both switching transistor emitters being connected to the common terminal. Gate switching means is connected between said gate logic node and said gate control input, said means being responsive to first and second logic levels at said gate control input for driving said gate logic node to first and second states causing the transmission gate to assume open and closed states from input to output. A bidirectional bipolar logic transmission gate includes an additional gate logic node and gate switching means simultaneously drives said gate logic node and additional gate logic node to first and second states causing the transmission gate to assume bilateral open and closed states between said first and second input and output terminals.
摘要:
Logic circuitry provides predetermined logic outputs in response to logical combinations of inputs. The circuitry includes a plurality of input devices for receiving logic inputs and capable of assuming conduction states in response to the logic levels of said inputs. At least one output device is connected to two or more input devices. Means having predetermined logic levels is provided connected intermediate the input and output devices for controlling the conduction state of the output devices as a function of the input devices and the predetermined logic levels.
摘要:
A collector-up binary structure of the type having spaced semiconductor regions forming a plurality of active devices for interconnection as a binary circuit is disclosed. The structure includes a semiconductor body of one conductivity having a planar surface, and spaced first, second, third and fourth transistors formed in said body. Fifth, sixth, seventh and eighth transistors are included, said fifth and sixth transistors being formed in the base regions of said second transistor and said seventh and eighth transistors being formed in the base region of said fourth transistor. Lead means provides ohmic contact to each of the respective regions of the respective transistors and interconnecting means is provided for connecting the plurality of active devices as a binary circuit. A structure further including ninth and tenth source transistors is also disclosed.
摘要:
A semiconductor structure, and method for fabrication, including a semiconductor body of one conductivity type having a major surface. A layer of opposite conductivity material is formed on said surface, said layer having an upper planar surface generally parallel to said major surface. Spaced first and second collector regions are carried by said layer. A third one conductivity region is formed in said layer spaced from said first and second region and extending to an exposed surface of said layer. A fourth region of opposite conductivity type is formed within said third region and extends to an exposed surface of said layer. The layer, third and forth regions form the respective regions of an opposite conductivity--one conductivity--opposite conductivity type source transistor. Additionally, the body, the layer and the first and second regions form the respective regions of a one conductivity--opposite conductivity--one conductivity switching transistor wherein said first and second regions form multiple collectors.
摘要:
A semiconductor memory cell, and a method for fabrication, including a one conductivity semiconductor body having a major surface and an opposite conductivity layer formed on said major surface said layer having a planar surface. Means extend from said planar surface through said layer to contact said body for isolating portions of said layer into first and second device regions. First and second device regions each include a one conductivity region formed in said device region extending to said planar surface, an opposite conductivity region formed within said one conductivity regions extending to said surface, and a metal-to-semiconductor contact carried by said device region at said planar surface. Lead means include means for ohmic interconnection of opposite conductivity regions formed in said first and second device regions, means for interconnecting said first device region and said one conductivity region formed in said second device region. Lead means further includes means for interconnection of said second device region and said one conductivity region formed in said first device region. Additional lead means is provided for coupling said metal-to-semiconductor contacts, said semiconductor body and said interconnected opposite conductivity regions with external circuitry.
摘要:
A high density semiconductor structure and method is disclosed including a semiconductor body of one conductivity having a substantially planar surface. A first region of one conductivity is formed in the body and extends to the surface. A layer of opposite conductivity is interposed between the first region and the body said layer having relatively thin and uniform walls which extend to separate the first region from the body. At least one opposite conductivity region is formed entirely within the first region and extends to the surface. An opposite conductivity region is formed in the body and overlaps a portion of the layer. Lead means are provided for contacting each of the respctive regions and the body. The collector-up injection logic structure thus formed requires little or no surface area for the injection source transistor.
摘要:
A decode driver useful in decoders for memory circuits. A plurality of transistors are connected in series between a first reference potential terminal and an output terminal. A second plurality of transistors are connected in parallel between a second reference potential terminal and the output terminal. Each of the transistors receives an input which functions to turn the transistors either on or off. The coding of the inputs determines whether the transistors to which the respective inputs are connected are turned on or off which in turn controls whether or not the output terminal is coupled to the first reference potential terminal or the second reference potential terminal.
摘要:
In a method of configuring an integrated circuit provided in a semiconductor body having a surface and spaced semiconductor circuits formed in the body, intercoupling means are formed in the body adjacent each of said circuits, and connected to said circuits. A plurality of conductive paths are formed between said intercoupling means and carried by the body. Each intercoupling means includes a plurality of semiconductor regions formed in the semiconductor body, said regions in combination capable of assuming a first low impedance condition and a second high impedance condition to thereby selectively couple each of said circuits to selected conductive paths or decouple each of said circuits from said conductive paths. In a specific embodiment of the invention a massive monolithic integrated circuit is configured using intercoupling means in combination with small scale random access memory semiconductor circuits. A static MOS random access memory having a 2,048 word capacity, with 9 bits/word and an 11 bit address is provided.
摘要:
A collector-up binary structure of the type having spaced semiconductor regions forming a plurality of active devices for interconnection as a binary circuit is disclosed. The structure includes a semiconductor body of one conductivity having a planar surface, and spaced first, second, third and fourth transistors formed in said body. Fifth, sixth, seventh and eighth transistors are included, said fifth and sixth transistors being formed in the base regions of said second transistor and said seventh and eighth transistors being formed in the base region of said fourth transistor. Lead means provides ohmic contact to each of the respective regions of the respective transistors and interconnecting means is provided for connecting the plurality of active devices as a binary circuit. A structure further including ninth and tenth source transistors is also disclosed.