Abstract:
On transistors P1, P2, N1 and N2 constituting an NAND gate, a interconnection pattern W of metal having high melting point and aluminum interconnection patterns Al1 and Al2 are stacked. A local line LL for connecting transistors P1, P2, N1 and N2 to each other is formed by the interconnection pattern W of metal having high melting point, signal lines SL and SL′ for signal input/output between the NAND gate and the outside are formed by aluminum interconnection pattern Al1, and power supply lines VL and VL′ for applying power supply potentials Vcc and Vss to the NAND gate are formed by the aluminum interconnection pattern Al2. As compared with the prior art in which the local line LL is formed by the aluminum interconnection pattern Al1, the degree of freedom in layout can be improved and the layout area can be reduced.
Abstract:
In a semiconductor device and a method of manufacturing the same, an isolating and insulating film is provided at an end neighboring to a second impurity region with a groove extended to a semiconductor substrate. This removes a crystal defect existed at the end of the isolating and insulating film, and thus prevents leak of a current at this portion from a storage node. Consequently, provision of the groove at the edge portion of the isolating oxide film neighboring to the impurity region removes a crystal defect at this region, and thus eliminates a possibility of leak of a current.
Abstract:
Each of divided bit line pairs is selectively connected to a sub-input/output line pair through transfer gates. A register is connected to the sub-input/output line pair. Data is transferred through the sub-input/output line pair between the register and a selected bit line pair. A sense amplifier is connected to each of the bit line pairs. Sense amplifiers are independently driven by separate sense amplifier activating signals. Therefore, even if data is transferred to the selected bit line pair from the register, fluctuations in potential on the bit line pair caused in such a case does not affect a sense amplifier activating signal connected to a non-selected bit line pair. As a result, data stored in the non-selected memory cell is prevented from being destroyed.
Abstract:
In a dynamic RAM of a CSL system, a memory array is divided into a plurality of memory array portions, and bit line pairs provided in the respective memory array portions are connected to their corresponding I/O line pairs simultaneously in response to a CSL output. In such an RAM, only the I/O line pair of a memory array portion to be accessed is precharged to the level of V.sub.CC -V.sub.th, while the I/O line pair of a memory array portion not to be accessed is precharged to the level of 1/2.multidot.V.sub.CC which is the same level as the bit line pairs. This makes it possible to achieve a faster data reading operation and also prevent unnecessary currents from flowing between the bit line pairs and the I/O line pair in the unaccessed memory array portion.
Abstract:
A semiconductor memory device comprises a DRAM memory cell array comprising a plurality of dynamic type memory cells arranged in a plurality of rows and columns, and an SRAM memory cell array comprising static type memory cells arranged in a plurality of rows and columns. The DRAM memory cell array is divided into a plurality of blocks each comprising a plurality of columns. The SRAM memory cell array is divided into a plurality of blocks each comprising a plurality of columns, corresponding to the plurality of blocks in the DRAM memory cell array. The SRAM memory cell array is used as a cache memory. At the time of cache hit, data is accessed to the SRAM memory cell array. At the time of cache miss, data is accessed to the DRAM memory cell array. On this occasion, data corresponding to one row in each of the blocks in the DRAM memory cell array is transferred to one row in the corresponding block in the SRAM memory cell array.
Abstract:
In a block access memory in which the memory cell array is divided into a plurality of blocks and data input/output is carried out by block unit, each block is divided into a plurality of subblocks, and the timing of activating the word line and the timing of activating the sense amplifier are made different for each subblock in the block in which the selected word line is included, whereby the peak current associated with the bit line charge/discharge at the time of activating the sense amplifiers is reduced.
Abstract:
A dynamic random access memory amplifier arrangement includes a sense amplifier band shared between two different memory blocks. In this memory, only sense amplifiers related to a selected memory block are activated. The memory comprises a circuit for boosting a control signal voltage to a switching unit for connecting the selected memory block to the sense amplifiers up to a level higher than a power supply voltage Vcc during the activation of the sense amplifiers, and a circuit for separating a memory block paired with the selected memory block from the activated sense amplifiers during the sensing operation. The memory further comprises a circuit for generating a control signal of the power supply voltage Vcc and connecting all the memory blocks to the corresponding sense amplifiers in a stand-by state wherein a row address strobe signal is inactive. With this arrangement, a highly reliable memory consuming less power can be achieved which ensures data writing and/or rewriting at a full Vcc level.
Abstract:
In an active mode, a transistor 61 or 63 is turned on, so that a reference voltage generator circuit 1 and an internal voltage correcting circuit 2 are activated. Consequently, an internal voltage V.sub.INT which is stepped down is applied to an internal main circuit 7. Conversely, in a standby mode, a transistor 61 or 63 is turned off, so that the reference voltage generator circuit 1 and the internal voltage correcting circuit 2 are inactivated. Consequently, the current does not flow in the reference voltage generator circuit 1 and the internal voltage correcting circuit 2, resulting in reduction of a consumption power. Simultaneously, a transistor 62 or 64 is turned on, so that a source voltage Ext.Vcc is directly applied to the internal main circuit 7 through the transistor 62 or 23. Thereby, operation conditions of logic circuits in the internal main circuit 7 are maintained.
Abstract:
An address decoding circuit for a functional block comprises branch portions serially connected with each other, in which a selecting signal is outputted on one of two output portions in accordance with the first bit information of an address signal when a selecting signal is applied to the first stage branch portion. The second stage output portion, to which the selecting signal is applied, outputs a selecting signal on one of two output portions in response to the second bit information of the address signal, in accordance with the selecting signal. Thereafter, each branch portion of the third to last stages outputs a selecting signal on one of two output portions in response to respective contents of the third bit to last bit of the address signal in accordance with the selecting signal applied from the preceding stage. By this selecting signal, a memory cell as a functional block portion is selected and is activated.
Abstract:
A semiconductor memory device having a storage region constituted with the arrangement of a plurality of memory cells on a main surface of a semiconductor substrate. Each memory cell includes a switching element and a passive element for signal retention connected to the switching element, for retaining the electric charges transferred from the switching element. The passive element includes a central electrode having a generally columnar shape provided protruded on the main surface in a first direction away from the main surface, and the fins constituted with a conductor extending in the first direction and protruded from the outer periphery of the central electrode. Owing to the existence of the fins, the surface area of a signal storage electrode of the passive element is increased. In other words, the quantity of electric charges to be stored is increased.