Abstract:
A light-emitting device includes a circuit substrate including at least a pair of electrodes, an LED element electrically mounted on the circuit substrate, a phosphor plate disposed on an upper surface of the LED element, a diffuser plate disposed on an upper surface of the phosphor plate, and a white resin disposed on an upper surface of the circuit substrate and covering a peripheral side surface of the LED element, a peripheral side surface of the phosphor plate, and a peripheral side surface of the diffuser plate. The present invention makes it possible to obtain a planar light-emitting surface even with a plurality of LEDs, and also, a problem of color-ring occurrence caused by a phosphor may be less represented.
Abstract:
In a semiconductor memory device using a variable resistive element made of a metal oxide for storing information, a voltage amplitude of a writing voltage pulse for changing the variable resistive element to a high resistance state is set within a voltage range in which the resistance value of the high resistance state after the change increases with time. The voltage amplitude is set within the voltage range in which the resistance value of the high resistance state after the change increases toward a predetermined peak with increase in voltage amplitude. When a data error is detected by the ECC circuit, it is estimated that the data that should be in the low resistance state changes to the high resistance state, and the variable resistive elements of all memory cells from which the error is detected are written to the low resistance state to correct the error bit.
Abstract:
A nonvolatile semiconductor memory device includes a bit voltage adjusting circuit which, for each bit line, fixes potentials of a selected bit line and a non-selected bit line to a predetermined potential to perform a memory operation and a data voltage adjusting circuit which, for each data line, fixes potentials of a selected data line and a non-selected data line to a predetermined potential to perform a memory operation. Each of the voltage adjusting circuits includes an operational amplifier and a transistor, a voltage required for a memory operation is input to the non-inverted input terminal of the operational amplifier, and the inverted input terminal of the operational amplifier is connected to the bit line or the data line, so that the potential of the bit line or the data line is fixed to a potential of the non-inverted input terminal of the operational amplifier.
Abstract:
Provided is a semiconductor memory device that is capable of stably programming with desirable controllability to a desired electric resistance state in a random access programming action and is provided with a variable resistance element. Regardless of a resistance state of a variable resistance element of a memory cell that is a target of a writing action (erasing and programming actions), an erasing voltage pulse for bringing the resistance state of the variable resistance element to an erased state having a lowest resistance value is applied. Thereafter, a programming voltage pulse for bringing the resistance state of the variable resistance element to a desired programmed state is applied to the variable resistance element of the programming action target memory cell. By always applying the programming voltage pulse after having applied the erasing voltage pulse, a plurality of programming voltage pulses being sequentially applied can be avoided.
Abstract:
A resistance control method for a nonvolatile variable resistive element in a nonvolatile semiconductor memory device is provided. The device includes a memory cell array in which unit memory cells having nonvolatile variable resistive elements and transistors are arranged in a matrix. The memory cells that are targets of a memory operation are selected by first selection lines (word lines), second selection lines (bit lines) and third selection lines (source lines). The method includes steps of selecting one or more first selection lines, selecting a plurality of second selection lines, and applying a compensated voltage in which a change in potential of the third selection lines caused by current flowing into the third selection lines through the second selection lines is compensated in a voltage that is necessary for the memory operation, such that the voltage necessary for the memory operation is applied to all of the selected memory cells.
Abstract:
After the periphery of the magnetic sensitive element is surrounded by an elastic member, the magnetic sensitive element is mold-formed with resin material. Soft epoxy or gel resin is employed as the elastic member, poured in an element-mounting space and solidified. The magnetic sensitive element is surrounded by silicone rubber. Such construction allows the magnetic sensitive element not to be affected by vibration and allows the elastic member to absorb the stress which is created due to the thermal deformation of the molded resin.
Abstract:
A side surface light emitting unit illuminates, from its side surfaces, one or more objects to be illuminated which are arranged to extend in one direction on a flat surface. The side surface light emitting unit is provided with a light guide body arranged along the side surface of the objects to be illuminated, for projecting light to the side surfaces of the objects, and an LED arranged at least on one end of the light guide body. In the side surface light emitting unit, the upper surface and the lower surface, excluding the side surfaces facing the objects, are blocked from light. The objects to be illuminated, such as key switches, can be brightly illuminated by unintermittent continuous outgoing light, along the arrangement direction of the objects from one end.
Abstract:
Provided is a nonvolatile semiconductor memory device capable of performing a writing action for a memory cell at high speed. The device comprises: a memory cell array having a first sub-bank and a second sub-bank each having a plurality of nonvolatile memory cells arranged in a form of a matrix; a row decoder shared by the first sub-bank and the second sub-bank; a first column decoder and a second column decoder provided in the first sub-bank and the second sub-bank, respectively; and a control circuit arranged to execute alternately a first action cycle to perform a programming action in the first sub-bank and a reading action for a programming verifying action in the second sub-bank and a second action cycle to perform the reading action for the programming verifying action in the first sub-bank and the programming action in the second sub-bank.
Abstract:
A variable resistive element comprising a configuration that an area of an electrically contributing region of a variable resistor body is finer than that constrained by an upper electrode or a lower electrode and its manufacturing method are provided. A bump electrode material is formed on a lower electrode arranged on a base substrate. The bump electrode material is contacted to a variable resistor body at a surface different from a contact surface to the lower electrode. The variable resistor body is contacted to an upper electrode at a surface different from a contact surface to the bump electrode material. Thus, a cross point region between the bump electrode material (the variable resistor body) and the upper electrode becomes an electrically contributing region of the variable resistor body, and then an area thereof can be reduced compared with that of the region regarding the conventional variable resistive element.
Abstract:
Provided are a variable resistive element having a configuration that the area of an electrically contributing region in a variable resistor body is smaller than the area defined by an upper electrode or a lower electrode, and a method for manufacturing the variable resistive element. The cross section of a current path, in which an electric current flows through between the two electrodes via the variable resistor body at the time of applying the voltage pulse to between the two electrodes, is formed with a line width of narrower than that of any of the two electrodes and of smaller than a minimum work dimension regarding manufacturing processes, so that its area can be made smaller than that of the electrically contributing region in the variable resistive element of the prior art.