摘要:
An object of the present invention is to allow stress that may be applied to a semiconductor package to be suppressed, when the semiconductor package is mounted on a curved board. In a mount board 1, a semiconductor package 20 is mounted on a curved board 10 including a curved surface on at least a portion thereof. The curved board 10 includes a pedestal portion 13a disposed on a region of the curved surface portion where the semiconductor package 20 is mounted and having an upper surface thereof formed flat, and a plurality of pad portions 15a disposed on the flat surface of the pedestal portion 13a. The pedestal portion 13a is formed of an insulating material. The semiconductor package 20 is mounted on the pad portions 15a.
摘要:
An information terminal includes: a front side casing member including in turn a section for clamping on each of two opposite top and bottom sides or on each of two opposite left and right sides of the information terminal when seen from a front side of the terminal, the sections for clamping extending along directions of the opposite sides; a back side casing member including another section for clamping corresponding to the section for clamping of a front side casing member, the back side casing member accommodating an inner structure of the information terminal in conjunction with the front side casing member; a pair of frame members, each frame member holding the section for clamping of the front side casing member and the other section for clamping of the back side casing member together in a clamped state; a first lock mechanism that, after thrusting the frame members onto the section for clamping and the other section for clamping, performs locking when the frame members are slid in a direction along the opposite sides; and a second lock mechanism that suppresses movement of the frame members following the locking.
摘要:
The present invention is relates to a mobile electronic apparatus including a packaging structure configured to evade destruction of a display part against an impact applied from outside. In a mobile electronic apparatus (1), if an impact is applied from a direction (B), a casing composed by a casing section (51), a bottom cover (20) and a cover (60) become deformed. If the casing is deformed, a hollow section (100) is deformed at the same time. A key rubber (30) becomes deformed to follow the portions becoming deformed. By the key rubber (30) becoming deformed, the impact applied from outside may be absorbed, and impact exerted to LCD module is reduced.
摘要:
Electronic components on a printed wiring board can be protected from the impact force of a fall, whereby the electrical and mechanical reliability of the electronic apparatus components can be greatly improved, and moreover, smaller size, lighter weight, higher functionality, and greater multifunctionality can be achieved. The composite multilayer wiring board of the present invention includes a plurality of intermediate layers each interposed between a plurality of printed wiring boards, at least one of the plurality of intermediate layers being composed of a resin material having a dilatancy characteristic.
摘要:
A lens barrel device that configures a lens barrel supporting an optical system includes: a first lens barrel; a second lens barrel that moves in a direction of an optical axis with respect to the first lens barrel in accordance with rotation of the first lens barrel around the optical axis of the optical system; and a light shielding member that is disposed so as to block a gap between the second lens barrel and the first lens barrel.
摘要:
An internal combustion engine includes a cylinder head having a plurality of intake ports; throttle devices including a plurality of respective intake passages equipped with throttle valves therein; a plurality of fuel injection valves for injecting fuel into the corresponding intake passages; a fuel pipe adapted to supply fuel to the fuel injection valves; and a pulsation damper connected to the fuel pipe to damp fuel pressure pulsation. In the engine, a connection pipe coupled to the pulsation damper is formed between a plurality of branch portions with respect a longitudinal direction of the fuel pipe, adapted to deliver fuel from the fuel pipe to the fuel injection valves and the connection pipe is disposed to at least partially overlap the fuel injection valve as viewed from the longitudinal direction of the fuel pipe.
摘要:
An object of the present invention is to prevent occurrence of an electrical fault such as signal disconnection due to exfoliation between a via and a printed circuit board, via crack, or the like, caused by various stresses that may arise when the printed circuit board is curved. The printed circuit board includes a first wiring layer 11, an electrical insulating base material 12 formed on the first wiring layer 11 and including a via base hole 12a that leads to the first wiring layer 11, and a second wiring layer 16 that is formed on the electrical insulating base material 12 and is electrically connected to the first wiring layer 11 through the via base hole 12a. In a region of the second wiring layer 16 disposed at least in the vicinity of the via base hole 12a, a stress relieving portion 17 is formed which relieves bending stress, tensile stress, compressive stress, and shear stress that may arise when the electrical insulating base material 12 is curved.
摘要:
An internal combustion engine includes a cylinder head having a plurality of intake ports; throttle devices including a plurality of respective intake passages equipped with throttle valves therein; a plurality of fuel injection valves for injecting fuel into the corresponding intake passages; a fuel pipe adapted to supply fuel to the fuel injection valves; and a pulsation damper connected to the fuel pipe to damp fuel pressure pulsation. In the engine, a connection pipe coupled to the pulsation damper is formed between a plurality of branch portions with respect a longitudinal direction of the fuel pipe, adapted to deliver fuel from the fuel pipe to the fuel injection valves and the connection pipe is disposed to at least partially overlap the fuel injection valve as viewed from the longitudinal direction of the fuel pipe.
摘要:
The present invention relates to a holding material for a catalytic converter including a catalyst carrier, a metal casing for receiving the catalyst carrier, and the holding material wound around the catalyst carrier and interposed in a gap between the catalyst carrier and the metal casing, the holding material having a plurality of high-density sites which are spaced apart from one another in the holding material, each site having a higher density than sites of the holding material in which the higher density sites are not provided.