摘要:
An internal combustion engine includes a cylinder head having a plurality of intake ports; throttle devices including a plurality of respective intake passages equipped with throttle valves therein; a plurality of fuel injection valves for injecting fuel into the corresponding intake passages; a fuel pipe adapted to supply fuel to the fuel injection valves; and a pulsation damper connected to the fuel pipe to damp fuel pressure pulsation. In the engine, a connection pipe coupled to the pulsation damper is formed between a plurality of branch portions with respect a longitudinal direction of the fuel pipe, adapted to deliver fuel from the fuel pipe to the fuel injection valves and the connection pipe is disposed to at least partially overlap the fuel injection valve as viewed from the longitudinal direction of the fuel pipe.
摘要:
An intake air control system of a V-type internal combustion engine having cylinder axes formed in a V-shape with a crankshaft provided therebetween is provided. An operation input shaft driven by an operator's input and an operation input shaft turning angle sensor that detects a turning angle of the operation input shaft are also provided. A throttle body having a throttle valve is formed with an intake passage for each of the cylinders. The operation input shaft is located between valve shafts of an opposing pair of throttle valves that are located on opposing bank portions of the V-type internal combustion engine, when viewed from the direction of the crankshaft. The operation input shaft is disposed separately from the throttle valve shafts and the operation input shaft turning angle sensor is provided at a shaft end of the operation input shaft.
摘要:
An object of the present invention is to allow stress that may be applied to a semiconductor package to be suppressed, when the semiconductor package is mounted on a curved board. In a mount board 1, a semiconductor package 20 is mounted on a curved board 10 including a curved surface on at least a portion thereof. The curved board 10 includes a pedestal portion 13a disposed on a region of the curved surface portion where the semiconductor package 20 is mounted and having an upper surface thereof formed flat, and a plurality of pad portions 15a disposed on the flat surface of the pedestal portion 13a. The pedestal portion 13a is formed of an insulating material. The semiconductor package 20 is mounted on the pad portions 15a.
摘要:
An object of the present invention is to allow stress that may be applied to a semiconductor package to be suppressed, when the semiconductor package is mounted on a curved board. In a mount board 1, a semiconductor package 20 is mounted on a curved board 10 including a curved surface on at least a portion thereof. The curved board 10 includes a pedestal portion 13a disposed on a region of the curved surface portion where the semiconductor package 20 is mounted and having an upper surface thereof formed flat, and a plurality of pad portions 15a disposed on the flat surface of the pedestal portion 13a. The pedestal portion 13a is formed of an insulating material. The semiconductor package 20 is mounted on the pad portions 15a.
摘要:
A lens barrel device that configures a lens barrel supporting an optical system includes: a first lens barrel; a second lens barrel that moves in a direction of an optical axis with respect to the first lens barrel in accordance with rotation of the first lens barrel around the optical axis of the optical system; and a light shielding member that is disposed so as to block a gap between the second lens barrel and the first lens barrel.
摘要:
When a substrate is transferred by a holding arm to a multiple tier wafer boat, contact between the holding arm and the substrate is prevented. When the wafer boat is not subjected to a thermal effect, a normal height position of a ring member is obtained by relatively elevating and lowering a transfer base member with respect to the wafer boat. Before a wafer, which is not yet thermally processed, is transferred to the wafer boat, a height position of the corresponding ring member is obtained. By comparing a difference between the normal height position of the ring member and the height position of the ring member before the wafer is transported, with a threshold value, whether to transfer the wafer by the wafer transfer mechanism to the wafer boat can be judged.