公开(公告)号：US09368424B2

公开(公告)日：2016-06-14

申请号：US11133966

申请日：2005-05-20

申请人： Yasuhiro Shinma ,  Junichi Kasai ,  Kouichi Meguro ,  Masanori Onodera ,  Junji Tanaka

发明人： Yasuhiro Shinma ,  Junichi Kasai ,  Kouichi Meguro ,  Masanori Onodera ,  Junji Tanaka

IPC分类号： H01L21/77 ,  H01L23/31 ,  H01L21/56 ,  H01L25/10 ,  H01L23/29 ,  H01L23/00

CPC分类号： H01L23/3128 ,  H01L21/565 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L25/105 ,  H01L2224/451 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2924/00012

摘要： A method of fabricating a semiconductor device includes the steps of providing a heat-resistant sheet on an interposer so as to cover electrode terminals provided on the interposer, and sealing a semiconductor chip on the interposer sandwiched between molds with a sealing material. The electrode terminals are covered by the heat-resistant resin for protection, and the semiconductor chip is then sealed with resin. It is thus possible to avoid the problem in which contaminations adhere to the electrode terminals. This makes it possible to prevent the occurrence of resin burrs on the interposer and contamination of the electrode pads and to improve the production yield.

摘要翻译： 一种制造半导体器件的方法包括以下步骤：在插入件上设置耐热片，以覆盖设置在插入件上的电极端子，并用密封材料密封夹在模具之间的插入件上的半导体芯片。 电极端子由耐热树脂覆盖以保护，然后用树脂密封半导体芯片。 因此可以避免污染物附着在电极端子上的问题。 这使得可以防止中介层上的树脂毛刺的发生和电极焊盘的污染并提高生产率。

公开(公告)号：US08772953B2

公开(公告)日：2014-07-08

申请号：US12404146

申请日：2009-03-13

申请人： Koji Taya ,  Masanori Onodera ,  Junji Tanaka ,  Kouichi Meguro

发明人： Koji Taya ,  Masanori Onodera ,  Junji Tanaka ,  Kouichi Meguro

IPC分类号： H01L23/48 ,  B29C45/16 ,  H01L23/28 ,  B29C45/02 ,  H01L23/31 ,  H01L25/065 ,  H01L25/00 ,  H01L21/56 ,  H01L23/00 ,  H01L23/552 ,  B29C45/14

CPC分类号： H01L21/56 ,  B29C45/02 ,  B29C45/14655 ,  B29C45/1671 ,  H01L21/565 ,  H01L23/28 ,  H01L23/3128 ,  H01L23/3135 ,  H01L23/552 ,  H01L24/48 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/05599 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/85399 ,  H01L2225/0651 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/3025 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2924/00012

摘要： The present invention include a semiconductor device and a method therefor, the method includes disposing a sheet-shaped resin at a side opposite to the chip mounting portion mounting semiconductor chips to be mounted on the chip mounting portion, and forming a resin sealing portion between the sheet-shaped resin and the chip mounting portion, to seal the semiconductor chips. According to an aspect of the present invention, it is possible to provide a semiconductor device and a fabrication method therefor, by which it is possible to reduce the size of the package and to prevent the generation of an unfilled portion in a resin sealing portion or a filler-removed portion or to prevent the exposure of wire from the resin sealing portion.

摘要翻译： 本发明包括一种半导体器件及其方法，该方法包括在安装半导体芯片的芯片安装部分相对的一侧设置片状树脂以安装在芯片安装部分上，并且在该芯片安装部分之间形成树脂密封部分 片状树脂和芯片安装部，以密封半导体芯片。 根据本发明的一个方面，可以提供一种半导体器件及其制造方法，通过该半导体器件及其制造方法，可以减小封装的尺寸并防止在树脂密封部分中产生未填充部分 填料去除部分或防止电线从树脂密封部分暴露。

公开(公告)号：US08361857B2

公开(公告)日：2013-01-29

申请号：US13323370

申请日：2011-12-12

申请人： Junji Tanaka ,  Koji Taya ,  Masahiko Harayama

发明人： Junji Tanaka ,  Koji Taya ,  Masahiko Harayama

IPC分类号： H01L21/8238

CPC分类号： H01L25/0657 ,  H01L23/481 ,  H01L2224/24145 ,  H01L2224/48091 ,  H01L2225/06513 ,  H01L2225/06527 ,  H01L2225/06551 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15311 ,  H01L2924/00014

摘要： Embodiments of the present invention are directed to provide a semiconductor device including a semiconductor chip formed of a conductive material, a connector terminal around the semiconductor chip, which is formed of a same material for forming the semiconductor chip, an insulating member for electrically insulating the semiconductor chip from the connector terminal, and a first connection member for electrically coupling the semiconductor chip with the connector terminal. Simplified step of manufacturing the connector terminal may further simplify the steps of manufacturing the semiconductor device.

摘要翻译： 本发明的实施例是提供一种半导体器件，其包括由导电材料形成的半导体芯片，半导体芯片周围的连接器端子，其由用于形成半导体芯片的相同材料形成;绝缘构件， 半导体芯片，以及用于将半导体芯片与连接器端子电耦合的第一连接构件。 制造连接器端子的简化步骤可以进一步简化制造半导体器件的步骤。

公开(公告)号：US08330263B2

公开(公告)日：2012-12-11

申请号：US12965672

申请日：2010-12-10

申请人： Masanori Onodera ,  Kouichi Meguro ,  Junji Tanaka

发明人： Masanori Onodera ,  Kouichi Meguro ,  Junji Tanaka

IPC分类号： H01L21/44

CPC分类号： H01L25/50 ,  G06F1/183 ,  H01L21/56 ,  H01L21/563 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/3128 ,  H01L23/3135 ,  H01L23/66 ,  H01L24/11 ,  H01L24/48 ,  H01L24/73 ,  H01L24/85 ,  H01L25/0657 ,  H01L25/18 ,  H01L2221/68331 ,  H01L2223/6677 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/48471 ,  H01L2224/48479 ,  H01L2224/73265 ,  H01L2224/85051 ,  H01L2224/85186 ,  H01L2224/85986 ,  H01L2225/0651 ,  H01L2225/0652 ,  H01L2225/06548 ,  H01L2225/06568 ,  H01L2225/06575 ,  H01L2225/06586 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/4554

摘要： Various embodiments of the present invention include a semiconductor device and a fabrication method therefor, the semiconductor device including a first semiconductor chip disposed on a substrate, a first sealing resin sealing the first semiconductor chip, a built-in semiconductor device disposed on the first sealing resin, and a second sealing resin sealing the first sealing resin and the built-in semiconductor device and covering a side surface of the substrate. According to an aspect of the present invention, it is possible to provide a high-quality semiconductor device and a fabrication method therefor, in which downsizing and cost reduction can be realized.

摘要翻译： 本发明的各种实施例包括半导体器件及其制造方法，所述半导体器件包括设置在基板上的第一半导体芯片，密封第一半导体芯片的第一密封树脂，设置在第一密封件上的内置半导体器件 树脂和密封第一密封树脂和内置半导体器件并覆盖基板的侧表面的第二密封树脂。 根据本发明的一个方面，可以提供一种能够实现小型化和降低成本的高品质半导体器件及其制造方法。

公开(公告)号：US08017162B2

公开(公告)日：2011-09-13

申请号：US11585819

申请日：2006-10-25

申请人： Hiroshi Shimoda ,  Shaojie Shan ,  Junji Tanaka ,  Tadashi Okada ,  Hiromichi Murai

发明人： Hiroshi Shimoda ,  Shaojie Shan ,  Junji Tanaka ,  Tadashi Okada ,  Hiromichi Murai

IPC分类号： A61K36/906 ,  A61K31/70

CPC分类号： A61K36/9068 ,  A61K31/7008 ,  A61K2300/00

摘要： This invention provides an anti-inflammatory agent or the like which is safer and less adverse and has the great effectiveness to prevent and treat arthritis, or the like. An anti-inflammatory agent or the like in this invention is characterized by comprising anthocyanidin and gingerol as an active substance. Also, the abovementioned anthocyanidin and gingerol are preferably extracted from red ginger.

摘要翻译： 本发明提供了一种更安全，更不利且具有预防和治疗关节炎的有效性的抗炎剂等。 本发明的抗炎剂等的特征在于，含有花色素和姜油作为活性物质。 此外，上述花色素和姜油优选从红姜中提取。

公开(公告)号：US07846829B2

公开(公告)日：2010-12-07

申请号：US12196210

申请日：2008-08-21

申请人： Junji Tanaka ,  Masahiko Harayama ,  Masanori Onodera

发明人： Junji Tanaka ,  Masahiko Harayama ,  Masanori Onodera

IPC分类号： H01L21/44 ,  H01L23/52 ,  H01L23/48 ,  H01L29/40 ,  H01L23/485 ,  H01L23/498

CPC分类号： H05K3/38 ,  H01L23/49811 ,  H01L23/49838 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L25/105 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48225 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/85201 ,  H01L2225/06568 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/20752 ,  H05K2201/094 ,  H05K2201/09472 ,  H05K2201/1025 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A semiconductor device is provided that includes a semiconductor chip, a plurality of solder bumps that electrically couple the semiconductor chip to the outside, and a metal bump being provided on the surface of each first solder bump which is at least a part of the plurality of solder bumps and being made of a metal having a melting point higher than that of the first solder bump. The wettability of the first solder bump is improved as each metal bump serves as a core when the corresponding first solder bump melts. Thus, the connection reliability of the first solder bump can be improved.

摘要翻译： 提供了一种半导体器件，其包括半导体芯片，将半导体芯片电耦合到外部的多个焊料凸块以及设置在每个第一焊料凸块的表面上的金属凸块，该第一焊料凸块是至少部分多个 焊料凸起并且由熔点高于第一焊料凸点的金属制成。 当相应的第一焊料凸块熔化时，每个金属凸块用作芯时，第一焊料凸块的润湿性得到改善。 因此，可以提高第一焊料凸块的连接可靠性。

公开(公告)号：US20100102424A1

公开(公告)日：2010-04-29

申请号：US12624117

申请日：2009-11-23

申请人： Masanori ONODERA ,  Kouichi MEGURO ,  Junji TANAKA

发明人： Masanori ONODERA ,  Kouichi MEGURO ,  Junji TANAKA

IPC分类号： H01L23/538 ,  G06K19/07

CPC分类号： H01L25/50 ,  G06F1/183 ,  H01L21/56 ,  H01L21/563 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/3128 ,  H01L23/3135 ,  H01L23/66 ,  H01L24/11 ,  H01L24/48 ,  H01L24/73 ,  H01L24/85 ,  H01L25/0657 ,  H01L25/18 ,  H01L2221/68331 ,  H01L2223/6677 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/48471 ,  H01L2224/48479 ,  H01L2224/73265 ,  H01L2224/85051 ,  H01L2224/85186 ,  H01L2224/85986 ,  H01L2225/0651 ,  H01L2225/0652 ,  H01L2225/06548 ,  H01L2225/06568 ,  H01L2225/06575 ,  H01L2225/06586 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/4554

摘要： The present invention provides a semiconductor device and a fabrication method therefor, the semiconductor device including a first semiconductor chip disposed on a substrate, a first sealing resin sealing the first semiconductor chip, a built-in semiconductor device disposed on the first sealing resin, and a second sealing resin sealing the first sealing resin and the built-in semiconductor device and covering a side surface of the substrate. According to an aspect of the present invention, it is possible to provide a high-quality semiconductor device and a fabrication method therefor, in which downsizing and cost reduction can be realized.

摘要翻译： 本发明提供一种半导体器件及其制造方法，所述半导体器件包括设置在基板上的第一半导体芯片，密封第一半导体芯片的第一密封树脂，设置在第一密封树脂上的内置半导体器件，以及 密封第一密封树脂和内置半导体器件并覆盖基板的侧表面的第二密封树脂。 根据本发明的一个方面，可以提供一种能够实现小型化和降低成本的高品质半导体器件及其制造方法。

公开(公告)号：US07642637B2

公开(公告)日：2010-01-05

申请号：US11894828

申请日：2007-08-22

申请人： Masanori Onodera ,  Junichi Kasai ,  Kouichi Meguro ,  Junji Tanaka ,  Yasuhiro Shinma ,  Koji Taya

发明人： Masanori Onodera ,  Junichi Kasai ,  Kouichi Meguro ,  Junji Tanaka ,  Yasuhiro Shinma ,  Koji Taya

IPC分类号： H01L23/02

CPC分类号： H01L25/50 ,  H01L25/105 ,  H01L2221/68318 ,  H01L2224/16 ,  H01L2225/06586 ,  H01L2225/06596 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15331

摘要： A carrier for a stacked type semiconductor device includes a lower carrier having a first accommodating portion that accommodates a first semiconductor device, and an upper carrier having a second accommodating portion that accommodates a second semiconductor device stacked on the first semiconductor device so as to be placed in position on the first semiconductor device. It is thus possible to eliminate an additional device used for stacking the semiconductor device, and thereby reduce the cost.

摘要翻译： 叠层型半导体器件的载体包括具有容纳第一半导体器件的第一容纳部分的下载体和具有第二容纳部分的上载体，所述第二容纳部分容纳堆叠在第一半导体器件上的第二半导体器件以便放置 在第一半导体器件上的位置。 因此，可以消除用于堆叠半导体器件的附加装置，从而降低成本。

公开(公告)号：US20090256250A1

公开(公告)日：2009-10-15

申请号：US12491092

申请日：2009-06-24

申请人： Koji TAYA ,  Masanori ONODERA ,  Junji TANAKA ,  Kouichi MEGURO

发明人： Koji TAYA ,  Masanori ONODERA ,  Junji TANAKA ,  Kouichi MEGURO

IPC分类号： H01L23/28 ,  H01L21/56

CPC分类号： H01L21/56 ,  B29C45/02 ,  B29C45/14655 ,  B29C45/1671 ,  H01L21/565 ,  H01L23/28 ,  H01L23/3128 ,  H01L23/3135 ,  H01L23/552 ,  H01L24/48 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/05599 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/85399 ,  H01L2225/0651 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/3025 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2924/00012

摘要： The present invention include a semiconductor device and a method therefor, the method includes disposing a sheet-shaped resin at a side opposite to the chip mounting portion mounting semiconductor chips to be mounted on the chip mounting portion, and forming a resin sealing portion between the sheet-shaped resin and the chip mounting portion, to seal the semiconductor chips. According to an aspect of the present invention, it is possible to provide a semiconductor device and a fabrication method therefor, by which it is possible to reduce the size of the package and to prevent the generation of an unfilled portion in a resin sealing portion or a filler-removed portion or to prevent the exposure of wire from the resin sealing portion.

公开(公告)号：US20080274591A1

公开(公告)日：2008-11-06

申请号：US12166293

申请日：2008-07-01

申请人： Koji Taya ,  Kouichi Meguro ,  Junichi Kasai ,  Yasuhiro Shinma ,  Masanori Onodera ,  Junji Tanaka ,  Murugasan Manikam Achari

发明人： Koji Taya ,  Kouichi Meguro ,  Junichi Kasai ,  Yasuhiro Shinma ,  Masanori Onodera ,  Junji Tanaka ,  Murugasan Manikam Achari

IPC分类号： H01L21/60

CPC分类号： H01L21/6835 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/16 ,  H01L2225/06593 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2224/0401

摘要： A carrier for a stacked-type semiconductor device includes an accommodating section for accommodating stacked semiconductor devices, guide portions guiding the stacked semiconductor devices, and grooves through which a fluid may flow to the accommodating section and to sides of the stacked semiconductor devices. These grooves facilitate the flow of gas or liquid on the sides of the accommodating sections, and it is thus expected that the flow of hot wind during the reflow process and cleaning liquid during the cleaning process can be facilitated. This improves the production yield and the cleaning effects. Holes for connecting the accommodating section to the outside may be provided at corners of the accommodating section. Gas may be guided from the lower side of the accommodating section, so that heat can be efficiently applied to the semiconductor devices and bonding failures therebetween can be reduced. Further, grooves connecting adjacent holes may be provided for accommodating sections adjacent to each other.

摘要翻译： 叠层型半导体器件的载体包括用于容纳堆叠的半导体器件的容纳部分，引导堆叠的半导体器件的引导部分和流体可以通过该沟槽流动到容纳部分和堆叠的半导体器件的侧面的沟槽。 这些凹槽有助于容纳部分侧面上的气体或液体的流动，因此预期在清洗过程中回流过程中的热风和清洗液体的流动可以被方便。 这提高了产量和清洁效果。 用于将容纳部分连接到外部的孔可以设置在容纳部分的角部。 气体可以从容纳部分的下侧引导，使得可以有效地将热量施加到半导体器件，并且可以减少它们之间的接合故障。 此外，可以设置连接相邻孔的槽，用于容纳彼此相邻的部分。