公开(公告)号：US20090174057A1

公开(公告)日：2009-07-09

申请号：US12404146

申请日：2009-03-13

申请人： Koji TAYA ,  Masanori ONODERA ,  Junji TANAKA ,  Kouichi MEGURO

发明人： Koji TAYA ,  Masanori ONODERA ,  Junji TANAKA ,  Kouichi MEGURO

IPC分类号： H01L23/28 ,  H01L21/56

CPC分类号： H01L21/56 ,  B29C45/02 ,  B29C45/14655 ,  B29C45/1671 ,  H01L21/565 ,  H01L23/28 ,  H01L23/3128 ,  H01L23/3135 ,  H01L23/552 ,  H01L24/48 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/05599 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/85399 ,  H01L2225/0651 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/3025 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2924/00012

摘要： The present invention include a semiconductor device and a method therefor, the method includes disposing a sheet-shaped resin at a side opposite to the chip mounting portion mounting semiconductor chips to be mounted on the chip mounting portion, and forming a resin sealing portion between the sheet-shaped resin and the chip mounting portion, to seal the semiconductor chips. According to an aspect of the present invention, it is possible to provide a semiconductor device and a fabrication method therefor, by which it is possible to reduce the size of the package and to prevent the generation of an unfilled portion in a resin sealing portion or a filler-removed portion or to prevent the exposure of wire from the resin sealing portion.

摘要翻译： 本发明包括一种半导体器件及其方法，该方法包括在安装半导体芯片的芯片安装部分相对的一侧设置片状树脂以安装在芯片安装部分上，并且在该芯片安装部分之间形成树脂密封部分 片状树脂和芯片安装部分，以密封半导体芯片。 根据本发明的一个方面，可以提供一种半导体器件及其制造方法，通过该半导体器件及其制造方法，可以减小封装的尺寸并防止在树脂密封部分中产生未填充部分 填料去除部分或防止电线从树脂密封部分暴露。

公开(公告)号：US20090256250A1

公开(公告)日：2009-10-15

申请号：US12491092

申请日：2009-06-24

申请人： Koji TAYA ,  Masanori ONODERA ,  Junji TANAKA ,  Kouichi MEGURO

发明人： Koji TAYA ,  Masanori ONODERA ,  Junji TANAKA ,  Kouichi MEGURO

IPC分类号： H01L23/28 ,  H01L21/56

CPC分类号： H01L21/56 ,  B29C45/02 ,  B29C45/14655 ,  B29C45/1671 ,  H01L21/565 ,  H01L23/28 ,  H01L23/3128 ,  H01L23/3135 ,  H01L23/552 ,  H01L24/48 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/05599 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/85399 ,  H01L2225/0651 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/3025 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2924/00012

摘要： The present invention include a semiconductor device and a method therefor, the method includes disposing a sheet-shaped resin at a side opposite to the chip mounting portion mounting semiconductor chips to be mounted on the chip mounting portion, and forming a resin sealing portion between the sheet-shaped resin and the chip mounting portion, to seal the semiconductor chips. According to an aspect of the present invention, it is possible to provide a semiconductor device and a fabrication method therefor, by which it is possible to reduce the size of the package and to prevent the generation of an unfilled portion in a resin sealing portion or a filler-removed portion or to prevent the exposure of wire from the resin sealing portion.

公开(公告)号：US20110024922A1

公开(公告)日：2011-02-03

申请号：US12900370

申请日：2010-10-07

申请人： Koji TAYA ,  Masanori ONODERA ,  Junji TANAKA ,  Kouichi MEGURO

发明人： Koji TAYA ,  Masanori ONODERA ,  Junji TANAKA ,  Kouichi MEGURO

IPC分类号： H01L23/28 ,  H01L21/50

CPC分类号： H01L21/56 ,  B29C45/02 ,  B29C45/14655 ,  B29C45/1671 ,  H01L21/565 ,  H01L23/28 ,  H01L23/3128 ,  H01L23/3135 ,  H01L23/552 ,  H01L24/48 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/05599 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/85399 ,  H01L2225/0651 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/3025 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2924/00012

摘要： The present invention include a semiconductor device and a method therefor, the method includes disposing a sheet-shaped resin at a side opposite to the chip mounting portion mounting semiconductor chips to be mounted on the chip mounting portion, and forming a resin sealing portion between the sheet-shaped resin and the chip mounting portion, to seal the semiconductor chips. According to an aspect of the present invention, it is possible to provide a semiconductor device and a fabrication method therefor, by which it is possible to reduce the size of the package and to prevent the generation of an unfilled portion in a resin sealing portion or a filler-removed portion or to prevent the exposure of wire from the resin sealing portion.

摘要翻译： 本发明包括一种半导体器件及其方法，该方法包括在安装半导体芯片的芯片安装部分相对的一侧设置片状树脂以安装在芯片安装部分上，并且在该芯片安装部分之间形成树脂密封部分 片状树脂和芯片安装部分，以密封半导体芯片。 根据本发明的一个方面，可以提供一种半导体器件及其制造方法，通过该半导体器件及其制造方法，可以减小封装的尺寸并防止在树脂密封部分中产生未填充部分 填料去除部分或防止电线从树脂密封部分暴露。

公开(公告)号：US20090325346A1

公开(公告)日：2009-12-31

申请号：US12556408

申请日：2009-09-09

申请人： Masataka HOSHINO ,  Junichi KASAI ,  Kouichi MEGURO ,  Ryota FUKUYAMA ,  Yasuhiro SHINMA ,  Koji TAYA ,  Masanori ONODERA ,  Naomi MASUDA

发明人： Masataka HOSHINO ,  Junichi KASAI ,  Kouichi MEGURO ,  Ryota FUKUYAMA ,  Yasuhiro SHINMA ,  Koji TAYA ,  Masanori ONODERA ,  Naomi MASUDA

IPC分类号： H01L21/78

CPC分类号： H01L25/0657 ,  H01L23/3128 ,  H01L23/49575 ,  H01L25/50 ,  H01L2224/02371 ,  H01L2224/05548 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2225/06506 ,  H01L2225/06513 ,  H01L2225/06551 ,  H01L2225/06555 ,  H01L2924/01004 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00

摘要： The present invention provides a semiconductor device that includes: stacked semiconductor chips, each semiconductor chip including a semiconductor substrate and a first insulating layer that is provided on side faces of the semiconductor substrate and has concavities formed on side faces thereof; first metal layers that are provided in center portions of inner side faces of the concavities; and second metal layers that are provided in the concavities and are connected to the first metal layers formed on each semiconductor chip. The present invention also provides a method of manufacturing the semiconductor device.

摘要翻译： 本发明提供一种半导体器件，其包括堆叠的半导体芯片，每个半导体芯片包括半导体衬底和设置在半导体衬底的侧面上且在其侧面上形成有凹部的第一绝缘层; 设置在凹部的内侧面的中心部的第一金属层; 以及第二金属层，其设置在凹部中并连接到形成在每个半导体芯片上的第一金属层。 本发明还提供一种半导体器件的制造方法。

公开(公告)号：US20120025364A1

公开(公告)日：2012-02-02

申请号：US13252714

申请日：2011-10-04

申请人： Masataka HOSHINO ,  Junichi KASAI ,  Kouichi MEGURO ,  Ryota FUKUYAMA ,  Yasuhiro SHINMA ,  Koji TAYA ,  Masanori ONODERA ,  Naomi MASUDA

发明人： Masataka HOSHINO ,  Junichi KASAI ,  Kouichi MEGURO ,  Ryota FUKUYAMA ,  Yasuhiro SHINMA ,  Koji TAYA ,  Masanori ONODERA ,  Naomi MASUDA

IPC分类号： H01L23/02

CPC分类号： H01L25/0657 ,  H01L23/3128 ,  H01L23/49575 ,  H01L25/50 ,  H01L2224/02371 ,  H01L2224/05548 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2225/06506 ,  H01L2225/06513 ,  H01L2225/06551 ,  H01L2225/06555 ,  H01L2924/01004 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00

摘要： The present invention provides a semiconductor device that includes: stacked semiconductor chips, each semiconductor chip including a semiconductor substrate and a first insulating layer that is provided on side faces of the semiconductor substrate and has concavities formed on side faces thereof; first metal layers that are provided in center portions of inner side faces of the concavities; and second metal layers that are provided in the concavities and are connected to the first metal layers formed on each semiconductor chip. The present invention also provides a method of manufacturing the semiconductor device.

摘要翻译： 本发明提供一种半导体器件，其包括堆叠的半导体芯片，每个半导体芯片包括半导体衬底和设置在半导体衬底的侧面上且在其侧面上形成有凹部的第一绝缘层; 设置在凹部的内侧面的中心部的第一金属层; 以及第二金属层，其设置在凹部中并连接到形成在每个半导体芯片上的第一金属层。 本发明还提供一种半导体器件的制造方法。

公开(公告)号：US20090115044A1

公开(公告)日：2009-05-07

申请号：US12110181

申请日：2008-04-25

申请人： Masataka HOSHINO ,  Masahiko HARAYAMA ,  Koji TAYA ,  Naomi MASUDA ,  Masanori ONODERA ,  Ryota FUKUYAMA

发明人： Masataka HOSHINO ,  Masahiko HARAYAMA ,  Koji TAYA ,  Naomi MASUDA ,  Masanori ONODERA ,  Ryota FUKUYAMA

IPC分类号： H01L23/02 ,  H01L21/00 ,  H01L23/482 ,  H01L23/485 ,  H01L21/74

CPC分类号： H01L23/5389 ,  H01L23/3128 ,  H01L24/48 ,  H01L24/73 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： Methods and structures for stack type semiconductor packaging are disclosed. In one embodiment, a semiconductor device includes a semiconductor chip mounted onto a substrate, a first resin molding portion formed on the substrate for sealing the semiconductor chip, and a through metal mounted on the substrate so as to pierce the first resin molding portion around the semiconductor chip. The semiconductor device further comprises an upper metal electrically coupled with the through metal and mounted on the first resin molding portion to extend from the through metal toward the semiconductor chip along an upper surface of the first resin molding portion, where the through metal and the upper metal are formed into an integral structure.

摘要翻译： 公开了堆叠型半导体封装的方法和结构。 在一个实施例中，半导体器件包括安装在基板上的半导体芯片，形成在用于密封半导体芯片的基板上的第一树脂模塑部分和安装在基板上的贯穿金属，以便穿过第一树脂模制部分 半导体芯片 所述半导体器件还包括与所述贯通金属电耦合并且安装在所述第一树脂模制部分上的上金属，以沿着所述第一树脂模塑部分的上表面从所述贯穿金属向所述半导体芯片延伸，其中所述通孔金属和所述上部 金属形成为一体结构。

公开(公告)号：US20120083096A1

公开(公告)日：2012-04-05

申请号：US13323370

申请日：2011-12-12

申请人： Junji TANAKA ,  Koji TAYA ,  Masahiko HARAYAMA

发明人： Junji TANAKA ,  Koji TAYA ,  Masahiko HARAYAMA

IPC分类号： H01L21/762

CPC分类号： H01L25/0657 ,  H01L23/481 ,  H01L2224/24145 ,  H01L2224/48091 ,  H01L2225/06513 ,  H01L2225/06527 ,  H01L2225/06551 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15311 ,  H01L2924/00014

摘要： Embodiments of the present invention are directed to provide a semiconductor device including a semiconductor chip formed of a conductive material, a connector terminal around the semiconductor chip, which is formed of a same material for forming the semiconductor chip, an insulating member for electrically insulating the semiconductor chip from the connector terminal, and a first connection member for electrically coupling the semiconductor chip with the connector terminal Simplified step of manufacturing the connector terminal may further simplify the steps of manufacturing the semiconductor device.

摘要翻译： 本发明的实施例是提供一种半导体器件，其包括由导电材料形成的半导体芯片，半导体芯片周围的连接器端子，其由用于形成半导体芯片的相同材料形成;绝缘构件， 半导体芯片，以及用于将半导体芯片与连接器端子电耦合的第一连接构件，制造连接器端子的简化步骤可进一步简化制造半导体器件的步骤。

公开(公告)号：US20090321958A1

公开(公告)日：2009-12-31

申请号：US12341863

申请日：2008-12-22

申请人： Junji TANAKA ,  Koji TAYA ,  Masahiko HARAYAMA

发明人： Junji TANAKA ,  Koji TAYA ,  Masahiko HARAYAMA

IPC分类号： H01L21/768 ,  H01L23/52 ,  H01L25/11

CPC分类号： H01L25/0657 ,  H01L23/481 ,  H01L2224/24145 ,  H01L2224/48091 ,  H01L2225/06513 ,  H01L2225/06527 ,  H01L2225/06551 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15311 ,  H01L2924/00014

摘要： Embodiments of the present invention are directed to provide a semiconductor device including a semiconductor chip formed of a conductive material, a connector terminal around the semiconductor chip, which is formed of a same material for forming the semiconductor chip, an insulating member for electrically insulating the semiconductor chip from the connector terminal, and a first connection member for electrically coupling the semiconductor chip with the connector terminal. Simplified step of manufacturing the connector terminal may further simplify the steps of manufacturing the semiconductor device.

摘要翻译： 本发明的实施例是提供一种半导体器件，其包括由导电材料形成的半导体芯片，半导体芯片周围的连接器端子，其由用于形成半导体芯片的相同材料形成;绝缘构件， 半导体芯片，以及用于将半导体芯片与连接器端子电耦合的第一连接构件。 制造连接器端子的简化步骤可以进一步简化制造半导体器件的步骤。

公开(公告)号：US20090200684A1

公开(公告)日：2009-08-13

申请号：US12343348

申请日：2008-12-23

申请人： Naomi MASUDA ,  Koji TAYA

发明人： Naomi MASUDA ,  Koji TAYA

IPC分类号： H01L23/48 ,  H01L21/60

CPC分类号： H01L24/17 ,  H01L21/563 ,  H01L21/6836 ,  H01L21/78 ,  H01L24/32 ,  H01L24/83 ,  H01L29/0657 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/83192 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/10155 ,  H01L2924/10157 ,  H01L2924/10158 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/00 ,  H01L2224/05599

摘要： The semiconductor device according to the present invention has a planar semiconductor chip having projecting connection terminals provided on one surface thereof. A shelf is provided where a peripheral edge of a surface of the semiconductor chip opposite one surface thereof onto which connection terminals are provided is removed. This makes it possible to secure a larger volume of the fillet portion of the underfill, thereby helping improve the function of preventing the rising up of the excess underfill by providing a shelf in the semiconductor chip.

摘要翻译： 根据本发明的半导体器件具有在其一个表面上设置有突出连接端子的平面半导体芯片。 提供了一种搁板，其中半导体芯片的与设置有连接端子的其一个表面相对的表面的周边边缘被去除。 这使得可以确保底部填充物的较大体积的圆角部分，从而通过在半导体芯片中提供搁板来帮助改进防止多余底部填充物上升的功能。