公开(公告)号：US08659161B2

公开(公告)日：2014-02-25

申请号：US13165599

申请日：2011-06-21

申请人： Ashok V. Krishnamoorthy ,  Craig A. Stephen ,  John E. Cunningham ,  James G. Mitchell

发明人： Ashok V. Krishnamoorthy ,  Craig A. Stephen ,  John E. Cunningham ,  James G. Mitchell

IPC分类号： H01L23/48

CPC分类号： H01L24/13 ,  H01L23/48 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/10126 ,  H01L2224/131 ,  H01L2224/1319 ,  H01L2224/1357 ,  H01L2224/13609 ,  H01L2224/13611 ,  H01L2224/13655 ,  H01L2224/13671 ,  H01L2224/16105 ,  H01L2224/16145 ,  H01L2224/81097 ,  H01L2224/81141 ,  H01L2224/81193 ,  H01L2224/81194 ,  H01L2224/81815 ,  H01L2224/81855 ,  Y10T428/24479 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/00012 ,  H01L2924/01079 ,  H01L2924/01029 ,  H01L2924/01028 ,  H01L2924/01082 ,  H01L2924/0105

摘要： A chip package includes a substrate having a positive feature, which is defined on a surface of the substrate and which protrudes above a region on the surface proximate to the positive feature. Furthermore, the chip package includes a mechanical reinforcement mechanism defined on the substrate proximate to the positive feature that increases a lateral shear strength of the positive feature relative to the substrate. In this way, the chip package may facilitate increased reliability of a multi-chip module (MCM) that includes the chip package.

摘要翻译： 芯片封装包括具有正特征的衬底，其被限定在衬底的表面上并且突出在接近正特征的表面上的区域上方。 此外，芯片封装包括限定在靠近正特征的基板上的机械加强机构，其增加正特征相对于基板的横向剪切强度。 以这种方式，芯片封装可以有助于增加包括芯片封装的多芯片模块（MCM）的可靠性。

公开(公告)号：US20110281395A1

公开(公告)日：2011-11-17

申请号：US11864369

申请日：2007-09-28

申请人： Ashok V. Krishnamoorthy ,  John E. Cunningham ,  James G. Mitchell

发明人： Ashok V. Krishnamoorthy ,  John E. Cunningham ,  James G. Mitchell

IPC分类号： H01L21/50

CPC分类号： H01L23/48 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/16 ,  H01L2225/06513 ,  H01L2225/06531 ,  H01L2225/06534 ,  H01L2225/06593 ,  H01L2924/01079 ,  H01L2924/10253 ,  H01L2924/00

摘要： Embodiments of a method for assembling a multi-chip module (MCM) are described. During this method, a fluid that includes coupling elements is applied to a surface of a base plate in the MCM. Then, at least some of the coupling elements are positioned into negative features on the surface of the base plate using fluidic assembly. Note that a given coupling element selects a given negative feature using chemical-based selection and/or geometry-based selection. Next, the fluid and excess coupling elements (which reside in regions outside of the negative features on the surface) are removed.

摘要翻译： 描述了用于组装多芯片模块（MCM）的方法的实施例。 在该方法中，包括耦合元件的流体被施加到MCM中的基板的表面。 然后，使用流体组件将至少一些联接元件定位在基板的表面上的负特征中。 注意，给定的耦合元件使用基于化学的选择和/或基于几何的选择来选择给定的负特征。 接下来，去除流体和过量的耦合元件（其位于表面上的负特征之外的区域中）。

公开(公告)号：US08039308B2

公开(公告)日：2011-10-18

申请号：US13006227

申请日：2011-01-13

申请人： James G. Mitchell ,  John E. Cunningham ,  Ashok V. Krishnamoorthy

发明人： James G. Mitchell ,  John E. Cunningham ,  Ashok V. Krishnamoorthy

IPC分类号： H01L21/00

CPC分类号： H01L25/0652 ,  H01L23/10 ,  H01L23/48 ,  H01L24/02 ,  H01L24/16 ,  H01L24/72 ,  H01L24/81 ,  H01L24/95 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/13099 ,  H01L2224/73251 ,  H01L2224/81136 ,  H01L2224/81801 ,  H01L2224/95136 ,  H01L2225/06513 ,  H01L2225/06531 ,  H01L2225/06534 ,  H01L2225/06593 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01058 ,  H01L2924/01067 ,  H01L2924/01074 ,  H01L2924/01076 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10157 ,  H01L2924/10158 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2224/16 ,  H01L2224/72

摘要： Embodiments of a multi-chip module (MCM) are described. This MCM includes a first semiconductor die and a second semiconductor die, where a given semiconductor die, which can be the first semiconductor die or the second semiconductor die, includes proximity connectors proximate to a surface of the given semiconductor die. Moreover, the given semiconductor die is configured to communicate signals with the other semiconductor die via proximity communication through one or more of the proximity connectors. Furthermore, the MCM includes an alignment plate and a top plate coupled to the alignment plate. This alignment plate includes a first negative feature configured to accommodate the first semiconductor die and a second negative feature configured to accommodate the second semiconductor die, and the top plate includes a positive feature. Note that the positive feature is coupled to the first semiconductor die, and the positive feature facilitates mechanical positioning of the first semiconductor die.

摘要翻译： 描述了多芯片模块（MCM）的实施例。 该MCM包括第一半导体管芯和第二半导体管芯，其中可以是第一半导体管芯或第二半导体管芯的给定半导体管芯包括靠近给定半导体管芯的表面的接近连接器。 此外，给定的半导体管芯被配置为通过一个或多个接近连接器的接近通信与另一个半导体管芯通信信号。 此外，MCM包括对准板和联接到对准板的顶板。 该对准板包括被配置为容纳第一半导体管芯的第一负特性构件和被配置为容纳第二半导体管芯的第二负特征，并且顶板包括正特征。 注意，正特征耦合到第一半导体管芯，并且正特征有利于第一半导体管芯的机械定位。

公开(公告)号：US20110223778A1

公开(公告)日：2011-09-15

申请号：US12719975

申请日：2010-03-09

申请人： Eugene M. Chow ,  John E. Cunningham ,  James G. Mitchell ,  Ivan Shubin

发明人： Eugene M. Chow ,  John E. Cunningham ,  James G. Mitchell ,  Ivan Shubin

IPC分类号： H01R12/02 ,  B23P11/00 ,  H01R43/16

CPC分类号： H01L23/49811 ,  H01L21/4853 ,  H01L21/6835 ,  H01L23/13 ,  H01L23/147 ,  H01L23/15 ,  H01L23/49827 ,  H01L23/544 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L25/0652 ,  H01L2221/68309 ,  H01L2221/68345 ,  H01L2223/54426 ,  H01L2223/54473 ,  H01L2224/13 ,  H01L2224/13016 ,  H01L2224/131 ,  H01L2224/136 ,  H01L2224/16237 ,  H01L2224/81005 ,  H01L2224/81007 ,  H01L2224/81136 ,  H01L2224/81138 ,  H01L2224/81141 ,  H01L2224/81191 ,  H01L2224/81192 ,  H01L2224/81801 ,  H01L2224/81901 ,  H01L2924/0001 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15156 ,  H01L2924/15787 ,  Y10T29/49165 ,  Y10T29/49204 ,  Y10T29/49895 ,  Y10T29/49947 ,  H01L2924/00012 ,  H01L2224/13099 ,  H01L2924/00

摘要： A multi-level interposer plate and a multi-chip module (MCM) that includes the multi-level interposer plate are described. First surfaces and second surfaces in different regions of the multi-level interposer plate have associated, different thicknesses. Moreover, first micro-spring connectors and second micro-spring connectors are respectively disposed on the first surfaces and the second surfaces. In the MCM, a given one of the first surfaces of the multi-level interposer plate faces a bridge chip in a first layer in an array of chips in the MCM so that first connectors, disposed on the bridge chip, mechanically and electrically couple to the first micro-spring connectors. Similarly, a given one of the second surfaces of the multi-level interposer plate faces an island chip in a second layer in the array of chips so that second connectors, disposed on the island chip, mechanically and electrically couple to the second micro-spring connectors.

摘要翻译： 描述了包括多层插入板的多层插入板和多芯片模块（MCM）。 多层插入板的不同区域中的第一表面和第二表面具有相关联的不同厚度。 此外，第一微弹簧连接器和第二微弹簧连接器分别设置在第一表面和第二表面上。 在MCM中，多级插入板的给定的一个第一表面面向MCM中芯片阵列的第一层中的桥式芯片，使得设置在桥式芯片上的第一连接器机械地和电耦合到 第一个微型弹簧连接器。 类似地，多层插入板的给定的一个第二表面面向芯片阵列中的第二层中的岛状芯片，使得设置在岛状芯片上的第二连接器机械地和电耦合到第二微型弹簧 连接器

公开(公告)号：US5577251A

公开(公告)日：1996-11-19

申请号：US554794

申请日：1995-11-07

申请人： Graham Hamilton ,  Michael L. Powell ,  James G. Mitchell ,  Jonathan J. Gibbons

发明人： Graham Hamilton ,  Michael L. Powell ,  James G. Mitchell ,  Jonathan J. Gibbons

IPC分类号： G06F9/46 ,  G06F13/00 ,  G06F15/16 ,  G06F9/42

CPC分类号： G06F9/547 ,  G06F9/548

摘要： The present invention provides an elegant and simple way to provide mechanisms for invocation of objects by client applications and for argument passing between client applications and object implementations, without the client application or the operating system knowing the details of how these mechanisms work. Moreover, these mechanisms functions in a distributed computer environment with similar ease and efficiency, where client applications may be on one computer node and object implementations on another.The invention includes a new type of object, termed a "spring object," which includes a method table, a subcontract mechanism and a data structure which represents the subcontract's local private state.

摘要翻译： 本发明提供了一种优雅和简单的方式来提供用于由客户端应用程序调用对象的机制，以及客户端应用程序和对象实现之间的参数传递，而客户机应用程序或操作系统知道这些机制如何工作的细节。 此外，这些机制在分布式计算机环境中起着相似的容易性和效率的作用，其中客户端应用程序可能在一个计算机节点上，而对象实现在另一个计算机节点上。 本发明包括称为“弹簧对象”的新型对象，其包括方法表，转包机构和表示分包商的本地私有状态的数据结构。

公开(公告)号：US5384003A

公开(公告)日：1995-01-24

申请号：US934556

申请日：1992-08-24

申请人： James G. Mitchell

发明人： James G. Mitchell

IPC分类号： B65H35/00 ,  B65H35/07

CPC分类号： B65H35/0033 ,  B65H2402/412 ,  B65H2402/60 ,  Y10T156/12 ,  Y10T156/1795 ,  Y10T156/18 ,  Y10T83/896

摘要： The mechanism of the dispensing apparatus of the present invention advantageously presents the tape or web material at an application point thereof for easy application of a leading edge of the tape or web material to an object as the dispenser and object are moved relative to one another. After a specific length of tape or web material is applied, the actuation of a single actuation element, by manipulation of a trigger or otherwise, completely severs the previous length of tape that has been applied to the object and then, only after the blade is sufficiently retracted out of the path of the tape or web material, an advancing means drives the tape or web material toward the application point so that it is presented for the next application. The movement of the actuation element from a first position to a second position is transferred to the cutting element for severing the length of tape or web material, and the movement of the actuation element back to its first position is transferred to the cutting element for retraction and, after a time delay, is transferred to the advancing means for advancing the tape or web material to the application point. Thus, after each application and complete cycle of the mechanism of the present invention, the leading edge of the tape is presented for the next application of the tape or web material to the next object.

摘要翻译： 本发明的分配装置的机构有利地在其应用点呈现带或网状材料，以便当分配器和物体相对于彼此移动时，便于将带或网状材料的前缘容易地应用于物体。 在施加了特定长度的胶带或纤维网材料之后，通过操纵触发器或其它方式，单个致动元件的致动完全地切断已施加到物体上的先前长度的带，然后仅在叶片为 充分地缩回到带或网状材料的路径之外，前进装置将胶带或网状材料驱动到应用点，使得它被呈现给下一个应用。 致动元件从第一位置到第二位置的移动被传递到切割元件以切断带或幅材材料的长度，并且致动元件回到其第一位置的移动被传递到切割元件以用于收回 并且经过一段时间延迟之后，转移到用于使胶带或卷筒纸材料推进到应用点的前进装置。 因此，在本发明的机构的每个应用和完成循环之后，提供带的前缘用于下一个将带或纤维网材料应用于下一个物体。

公开(公告)号：US4342390A

公开(公告)日：1982-08-03

申请号：US114167

申请日：1980-01-22

申请人： James G. Mitchell ,  Winalee G. Mitchell

发明人： James G. Mitchell ,  Winalee G. Mitchell

IPC分类号： A61B19/02 ,  A61L2/26 ,  B65D75/28 ,  B65D83/10

CPC分类号： B65D75/28 ,  A61B50/30 ,  A61L2/26 ,  A61B2050/318

摘要： An improved holder and protector (10) for sterilizable instruments is disclosed which comprises two layers (12) of heat fusible, reticulated foam material joined to define a plurality of open-ended pockets (18) for receiving instruments and a cover flap (22) for folding over the instruments and pockets to protect them. A strip (20) of the layers below the pockets is fused to provide a smooth surface on which indicia of the contents of the pockets may be provided, as by manual printing.

摘要翻译： 公开了一种用于可灭菌仪器的改进的保持器和保护器（10），其包括两层（12）热熔网状泡沫材料，其被连接以限定用于接收器械的多个开放式口袋（18）和盖舌（22） 用于折叠仪器和口袋以保护它们。 口袋下面的层条（20）被熔化以提供平滑的表面，通过手动印刷可以在其上提供口袋内容物的标记。

公开(公告)号：US09281268B2

公开(公告)日：2016-03-08

申请号：US13517591

申请日：2012-06-13

申请人： Eugene M. Chow ,  John E. Cunningham ,  James G. Mitchell ,  Ivan Shubin

发明人： Eugene M. Chow ,  John E. Cunningham ,  James G. Mitchell ,  Ivan Shubin

IPC分类号： H05K3/20 ,  H01L23/498 ,  H01L21/48 ,  H01L21/683 ,  H01L23/13 ,  H01L23/14 ,  H01L23/544 ,  H01L23/00 ,  H01L25/065 ,  H01L23/15

CPC分类号： H01L23/49811 ,  H01L21/4853 ,  H01L21/6835 ,  H01L23/13 ,  H01L23/147 ,  H01L23/15 ,  H01L23/49827 ,  H01L23/544 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L25/0652 ,  H01L2221/68309 ,  H01L2221/68345 ,  H01L2223/54426 ,  H01L2223/54473 ,  H01L2224/13 ,  H01L2224/13016 ,  H01L2224/131 ,  H01L2224/136 ,  H01L2224/16237 ,  H01L2224/81005 ,  H01L2224/81007 ,  H01L2224/81136 ,  H01L2224/81138 ,  H01L2224/81141 ,  H01L2224/81191 ,  H01L2224/81192 ,  H01L2224/81801 ,  H01L2224/81901 ,  H01L2924/0001 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15156 ,  H01L2924/15787 ,  Y10T29/49165 ,  Y10T29/49204 ,  Y10T29/49895 ,  Y10T29/49947 ,  H01L2924/00012 ,  H01L2224/13099 ,  H01L2924/00

摘要： A multi-level interposer plate and a multi-chip module (MCM) that includes the multi-level interposer plate are described. First surfaces and second surfaces in different regions of the multi-level interposer plate have associated, different thicknesses. Moreover, first micro-spring connectors and second micro-spring connectors are respectively disposed on the first surfaces and the second surfaces. In the MCM, a given one of the first surfaces of the multi-level interposer plate faces a bridge chip in a first layer in an array of chips in the MCM so that first connectors, disposed on the bridge chip, mechanically and electrically couple to the first micro-spring connectors. Similarly, a given one of the second surfaces of the multi-level interposer plate faces an island chip in a second layer in the array of chips so that second connectors, disposed on the island chip, mechanically and electrically couple to the second micro-spring connectors.

摘要翻译： 描述了包括多层插入板的多层插入板和多芯片模块（MCM）。 多层插入板的不同区域中的第一表面和第二表面具有相关联的不同厚度。 此外，第一微弹簧连接器和第二微弹簧连接器分别设置在第一表面和第二表面上。 在MCM中，多级插入板的给定的一个第一表面面向MCM中芯片阵列的第一层中的桥式芯片，使得设置在桥式芯片上的第一连接器机械地和电耦合到 第一个微型弹簧连接器。 类似地，多层插入板的给定的一个第二表面面向芯片阵列中的第二层中的岛状芯片，使得设置在岛状芯片上的第二连接器机械地和电耦合到第二微型弹簧 连接器

公开(公告)号：US20110018120A1

公开(公告)日：2011-01-27

申请号：US12507349

申请日：2009-07-22

申请人： Robert J. Drost ,  James G. Mitchell ,  David C. Douglas

发明人： Robert J. Drost ,  James G. Mitchell ,  David C. Douglas

IPC分类号： H01L23/538

CPC分类号： H01L25/0657 ,  H01L23/3121 ,  H01L23/642 ,  H01L23/645 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/48 ,  H01L24/72 ,  H01L24/90 ,  H01L25/0652 ,  H01L29/0657 ,  H01L2223/6638 ,  H01L2224/13099 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48137 ,  H01L2224/48157 ,  H01L2225/06527 ,  H01L2225/06551 ,  H01L2225/06555 ,  H01L2225/06562 ,  H01L2225/06572 ,  H01L2225/06575 ,  H01L2225/06589 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01055 ,  H01L2924/01058 ,  H01L2924/01067 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15311 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19104 ,  H01L2924/19106 ,  H01L2924/19107 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A chip package is described. This chip package includes a stack of semiconductor dies or chips that are offset from each other, thereby defining a terrace with exposed pads. A high-bandwidth ramp component, which is positioned approximately parallel to the terrace, electrically couples to the exposed pads. For example, the ramp component may be electrically coupled to the semiconductor dies using: microsprings, an anisotropic film, and/or solder. Consequently, the electrical contacts may have a conductive, a capacitive or, in general, a complex impedance. Furthermore, the chips and/or the ramp component may be positioned relative to each other using a ball-and-pit alignment technique. By removing the need for costly and area-consuming through-silicon vias (TSVs) in the semiconductor dies, the chip package facilitates chips to be stacked in a manner that provides high bandwidth and low cost.

摘要翻译： 描述了芯片封装。 该芯片封装包括彼此偏移的半导体管芯或芯片堆叠，由此限定具有暴露焊盘的露台。 位于大致平行于平台的高带宽斜坡部件电耦合到暴露的焊盘。 例如，斜坡部件可以使用：微弹簧，各向异性膜和/或焊料电耦合到半导体管芯。 因此，电触点可以具有导电性，电容性或通常的复阻抗。 此外，芯片和/或斜面部件可以使用球 - 坑对准技术相对于彼此定位。 通过消除对半导体管芯中昂贵且耗费大量的硅通孔（TSV）的需求，芯片封装便于以提供高带宽和低成本的方式堆叠芯片。

公开(公告)号：US20100266240A1

公开(公告)日：2010-10-21

申请号：US11962419

申请日：2007-12-21

申请人： Ashok V. Krishnamoorthy ,  James G. Mitchell ,  John E. Cunningham ,  Brian W. O'Krafka

发明人： Ashok V. Krishnamoorthy ,  James G. Mitchell ,  John E. Cunningham ,  Brian W. O'Krafka

IPC分类号： G02B6/34 ,  G02B6/42

CPC分类号： G02B6/43 ,  G02B6/12009 ,  H01L23/48 ,  H01L25/0652 ,  H01L25/0657 ,  H01L2225/06513 ,  H01L2225/06531 ,  H01L2225/06534 ,  H01L2924/0002 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/00

摘要： Embodiments of a system are described. This system includes an array of chip modules (CMs) and a baseplate, where the baseplate is configured to communicate data signals via optical communication. Moreover, the array includes first CMs mechanically coupled to first alignment features on the baseplate, and adjacent second CMs mechanically coupled to second alignment features on the baseplate. In this array, a given first CM is electrically coupled to a given set of electrical proximity connectors. Additionally, the array includes bridge components, wherein a given bridge component is electrically coupled to the second SCM and another set of electrical proximity connectors, which is electrically coupled to the set of electrical proximity connectors, thereby facilitating communication of other data signals between adjacent first CMs and second CMs via electrical proximity communication. Moreover, the given bridge component is optically coupled to the baseplate, thereby facilitating optical communication of the data signals between CMs via the baseplate.

摘要翻译： 描述系统的实施例。 该系统包括芯片模块（CM）和基板阵列，其中基板配置为通过光通信传送数据信号。 此外，阵列包括机械耦合到基板上的第一对准特征的第一CM，以及与基板上的第二对准特征机械耦合的相邻的第二CM。 在该阵列中，给定的第一CM电耦合到给定的一组电接近连接器。 另外，阵列包括桥组件，其中给定的桥组件电耦合到第二SCM和另一组电接近连接器，其被电耦合到该组电接近连接器，由此有助于在相邻的第一SCM之间的其它数据信号的通信 CM和第二CM通过电气接近通信。 而且，给定的桥式组件光耦合到基板，从而有助于通过基板在CM之间的数据信号的光通信。