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52 条记录 (耗时 0.012 秒)

    ELECTRICAL CONNECTOR HAVING A GROUND CLIP
    1.
    发明申请
    ELECTRICAL CONNECTOR HAVING A GROUND CLIP 有权
    具有接地夹的电气连接器

    公开(公告)号：US20120064743A1

    公开(公告)日：2012-03-15

    申请号：US12880411

    申请日：2010-09-13

    申请人： Jie QIN ,  Steven J. MILLARD ,  David W. HELSTER

    发明人： Jie QIN ,  Steven J. MILLARD ,  David W. HELSTER

    IPC分类号： H01R12/02

    CPC分类号： H01R13/6471 ,  H01R12/724 ,  H01R12/732 ,  H01R31/08

    摘要： An electrical connector includes a housing having a front and a rear opposite the housing with a rear wall at the rear. The housing has a slot open through the front that receives a mating connector therein. The housing has contact openings through the rear wall and a ground clip channel in the rear wall open at the rear. Signal contacts are held in the housing and arranged in pairs. The signal contacts are received in corresponding contact openings and are arranged within the slot to mate with the mating connector. Ground contacts are held in the housing and are arranged between corresponding signal contacts. The ground contacts are received in corresponding contact openings and are arranged within the slot to mate with the mating connector. A ground clip is loaded into the ground clip channel. The ground clip engages the ground contacts to create a ground circuit between the ground contacts engaged by the ground clip.

    摘要翻译： 电连接器包括具有与壳体相对的前后相反的后壳的壳体。 壳体具有通过前部开口的槽，其中容纳配合连接器。 壳体通过后壁具有接触开口，后壁上的接地夹通道在后部开口。 信号触点保持在壳体中并成对布置。 信号触点被接收在相应的接触开口中并且布置在槽内以与配合连接器配合。 接地触点保持在壳体中并且布置在相应的信号触点之间。 接地触头被接收在相应的接触开口中并且布置在槽内以与配合连接器配合。 接地夹被加载到接地夹通道中。 接地夹与接地触头接合，以在由接地夹接合的接地触点之间产生接地电路。

    CONNECTOR SYSTEM HAVING CONTACT OVERLAPPING VIAS
    4.
    发明申请
    CONNECTOR SYSTEM HAVING CONTACT OVERLAPPING VIAS 有权
    具有联系人重叠VIAS的连接器系统

    公开(公告)号：US20110230067A1

    公开(公告)日：2011-09-22

    申请号：US12728879

    申请日：2010-03-22

    申请人： Bruce Allen Champion ,  Steven Jay Millard ,  Bin Lin

    发明人： Bruce Allen Champion ,  Steven Jay Millard ,  Bin Lin

    IPC分类号： H01R12/02

    CPC分类号： H01R12/714 ,  H01R13/2442 ,  H05K1/0243 ,  H05K1/112 ,  H05K1/141 ,  H05K2201/10378

    摘要： An electronic connector system includes an electronic package and an interposer connector assembly. The electronic package has a body with a conductive member disposed on a mating surface of the body. The conductive member is coupled with a conductive via that extends into the body and is oriented along a center axis. The interposer connector assembly includes a substrate with an elongated conductive pad mounted to the substrate and a contact joined to the conductive pad. The contact engages the conductive member when the electronic package mates with the interposer connector assembly such that the center axis extends through the contact.

    摘要翻译： 电子连接器系统包括电子封装和插入器连接器组件。 电子封装具有设置在主体的配合表面上的导电构件的主体。 导电构件与延伸到主体中并沿着中心轴线定向的导电通孔联接。 插入器连接器组件包括具有安装到衬底的细长导电垫的衬底和接合到导电垫的触点。 当电子封装与插入器连接器组件配合使得中心轴线延伸穿过触点时，触头接合导电构件。

    Surface Mounting Structure for Ball Grid Array
    5.
    发明申请
    Surface Mounting Structure for Ball Grid Array 有权
    球形阵列表面安装结构

    公开(公告)号：US20100124830A1

    公开(公告)日：2010-05-20

    申请号：US12358269

    申请日：2009-01-23

    申请人： Yi Yen Chiang

    发明人： Yi Yen Chiang

    IPC分类号： H01R12/02

    CPC分类号： H01L23/49816 ,  H01L23/49838 ,  H01L2924/0002 ,  H05K1/111 ,  H05K3/3452 ,  H05K2201/0979 ,  H05K2201/0989 ,  Y02P70/611 ,  H01L2924/00

    摘要： A surface mounting structure applied to a BGA includes a substrate, a first soldering pad, a first lead, a second lead and a passivation layer. The substrate has a top surface for the first soldering pad to be disposed thereon. The first lead has a first end connected to the first soldering pad and a second end. The second lead has a third end connected to the first soldering pad and a fourth end connected to the second end of the first lead. A well is defined among the first lead, the second lead, and the first soldering pad. The passivation layer covers the top surface of the substrate, and has a first opening corresponding to the top of the first soldering pad to expose the first soldering pad and the well. Chip failure resulting from the warp occurring at four corners in the surface mounting procedure is prevented.

    摘要翻译： 施加到BGA的表面安装结构包括基板，第一焊盘，第一引线，第二引线和钝化层。 基板具有用于第一焊盘的顶表面以设置在其上。 第一引线具有连接到第一焊盘的第一端和第二端。 第二引线具有连接到第一焊盘的第三端和连接到第一引线的第二端的第四端。 在第一引线，第二引线和第一焊盘之间定义了一个阱。 钝化层覆盖基板的顶表面，并且具有对应于第一焊盘顶部的第一开口以露出第一焊盘和阱。 防止了在表面安装过程中在四个角处发生翘曲导致的芯片故障。

    SOCKET CONNECTOR WITH IMPROVED ELECTRICAL CONTACT
    6.
    发明申请
    SOCKET CONNECTOR WITH IMPROVED ELECTRICAL CONTACT 失效
    带改进电接点的插座连接器

    公开(公告)号：US20100035445A1

    公开(公告)日：2010-02-11

    申请号：US12538176

    申请日：2009-08-10

    申请人： JIE-FENG ZHANG

    发明人： JIE-FENG ZHANG

    IPC分类号： H01R12/02

    CPC分类号： H05K7/1084

    摘要： An electrical connector includes an insulative housing (1) and an electrical contact (2) received in the insulative housing. The electrical contact includes a planar main portion (20), a soldering portion (21) extending horizontally from a lower end of the main portion and first and second elastic arms (23, 24) extending from an upper end of the main portion. The first elastic arm has a first connecting portion (232) connecting to the main portion. The second elastic arm has a first curved portion (243) connecting to the main portion, a second curved portion (244) connecting with the first curved portion and a connecting portion (242) vertically extending from the second curved portion. Two contact portions (230, 240) extend respectively and laterally from the first and second connecting portions. A first distance defined between the connecting portions is larger than a second distance defined between the contact portions taken from a side view.

    摘要翻译： 电连接器包括绝缘壳体（1）和容纳在绝缘壳体中的电触点（2）。 电触点包括平面主体部分（20），从主体部分的下端水平延伸的焊接部分（21）和从主体部分的上端延伸的第一和第二弹性臂（23,24）。 第一弹性臂具有连接到主要部分的第一连接部分（232）。 第二弹性臂具有连接到主要部分的第一弯曲部分（243），与第一弯曲部分连接的第二弯曲部分（244）和从第二弯曲部分垂直延伸的连接部分（242）。 两个接触部分（230,240）从第一和第二连接部分别和横向延伸。 限定在连接部分之间的第一距离大于从侧视图取得的接触部分之间限定的第二距离。

    CIRCUIT BOARD
    8.
    发明申请
    CIRCUIT BOARD 审中-公开
    电路板

    公开(公告)号：US20090071702A1

    公开(公告)日：2009-03-19

    申请号：US11869758

    申请日：2007-10-10

    申请人： YU-HSU LIN ,  WANG-JIA CHEN

    发明人： YU-HSU LIN ,  WANG-JIA CHEN

    IPC分类号： H01R12/02

    CPC分类号： H05K1/025 ,  H05K2201/09245 ,  H05K2201/09727

    摘要： A circuit board (10) for reducing a variation in impedance of signal traces thereon includes a first signal plane (30) and a second signal plane (50). The first signal plane includes a first signal trace (31) arranged thereon. The first signal trace has a first width. The second signal plane includes a plurality of second signal traces (51) arranged thereon. An orthographic projection of the first signal trace onto the second signal plane crosses the second signal traces. A width of the first signal trace at positions where the orthographic projection thereof onto the second signal plane at the intersections with the second signal traces transitions to a second width less than the first width of the first signal trace.

    摘要翻译： 用于减少其上的信号迹线的阻抗变化的电路板（10）包括第一信号平面（30）和第二信号平面（50）。 第一信号平面包括布置在其上的第一信号迹线（31）。 第一个信号迹线具有第一个宽度。 第二信号平面包括布置在其上的多个第二信号迹线（51）。 第一信号迹线在第二信号平面上的正交投影与第二信号迹线交叉。 在与第二信号迹线交叉处的第二信号平面上的正交投影转变到小于第一信号迹线的第一宽度的第二宽度的位置处的第一信号迹线的宽度。

    Printed board and method for producing the printed board
    9.
    发明申请
    Printed board and method for producing the printed board 有权
    印刷电路板和印刷电路板的制造方法

    公开(公告)号：US20080080154A1

    公开(公告)日：2008-04-03

    申请号：US11892600

    申请日：2007-08-24

    申请人： Masahiro Tagano ,  Teruyuki Kitahara

    发明人： Masahiro Tagano ,  Teruyuki Kitahara

    IPC分类号： H01R9/22 ,  H01R12/02 ,  H05K1/11 ,  H05K3/00

    CPC分类号： H05K3/3447 ,  H01R12/58 ,  H01R12/707 ,  H05K1/0263 ,  H05K2201/0979 ,  H05K2201/10272 ,  H05K2201/10856 ,  H05K2203/0195 ,  H05K2203/1446 ,  Y10T29/49124 ,  Y10T29/49126

    摘要： A printed board includes a printed board body having a first side, a second side opposing the first side, and a through-hole; a printed conductor disposed on the first side of the printed board body; and a bus bar disposed on the second side of the printed board body, the bus bar including a terminal that extends through the through-hole. The terminal includes a plurality of branched terminal portions at a position corresponding to an interior of the through-hole, and at least one of the branched terminal portions is bent and attached to the printed conductor.

    摘要翻译： 印刷电路板包括具有第一侧，与第一侧相对的第二侧和通孔的印刷电路板主体; 布置在所述印刷电路板主体的第一侧上的印刷导体; 以及布置在印刷电路板主体的第二侧上的母线，母线包括延伸穿过通孔的端子。 端子在与通孔内部相对应的位置处包括多个分支端子部分，并且至少一个分支端子部分弯曲并附着到印刷导体。