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公开(公告)号：US07994432B2
公开(公告)日：2011-08-09
申请号：US12488207
申请日：2009-06-19
IPC分类号： H05K1/16
CPC分类号： H01L21/4857 , H01L21/486 , H01L23/49822 , H01L23/49827 , H01L2224/05568 , H01L2224/05573 , H01L2224/16 , H01L2224/16225 , H01L2224/16235 , H01L2924/00014 , H01L2924/01019 , H01L2924/01046 , H01L2924/01057 , H01L2924/01078 , H01L2924/01079 , H01L2924/15174 , H01L2924/15311 , H01L2924/3011 , H05K1/112 , H05K3/4602 , H05K3/4688 , H05K2201/0187 , H05K2201/10674 , H01L2224/05599
摘要： A circuit wiring board including a wiring substrate, and a heat resistant substrate accommodated in the wiring substrate and having a thermal expansion coefficient in a range between 3 ppm to 10 ppm and including a core substrate and a built-up wiring layer formed over the core substrate, the built-up wiring layer including conductive layers, interlayer resin insulating layers and a via hole conductor connecting the conductive layers through one of the interlayer resin insulating layers.
摘要翻译： 一种电路布线板，包括布线基板和容纳在所述布线基板中的耐热基板，其热膨胀系数在3ppm至10ppm之间的范围内，并且包括芯基板和形成在所述芯上的积层布线层 衬底，包括导电层的积层布线层，层间树脂绝缘层和通过层间树脂绝缘层之一连接导电层的通孔导体。
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公开(公告)号：US20090053910A1
公开(公告)日：2009-02-26
申请号：US12254592
申请日：2008-10-20
IPC分类号： H01R12/02
CPC分类号： H05K3/4015 , H01L21/4853 , H01L23/49811 , H01L24/45 , H01L24/72 , H01L24/78 , H01L24/81 , H01L24/83 , H01L24/90 , H01L2224/05568 , H01L2224/05573 , H01L2224/1134 , H01L2224/131 , H01L2224/451 , H01L2224/45139 , H01L2224/45144 , H01L2224/45147 , H01L2224/78301 , H01L2224/786 , H01L2224/8121 , H01L2224/81815 , H01L2224/838 , H01L2224/851 , H01L2224/85205 , H01L2224/90 , H01L2924/00013 , H01L2924/00014 , H01L2924/0133 , H01L2924/014 , H01L2924/14 , H01L2924/3011 , H05K3/326 , H05K3/341 , H05K2201/10265 , H05K2201/10287 , H05K2203/049 , Y10T29/49135 , Y10T29/49142 , Y10T29/49149 , Y10T29/49153 , H01L2224/13099 , H01L2924/01029 , H01L2924/01047 , H01L2924/01079 , H01L2224/48 , H01L2924/00015 , H01L2224/05599
摘要： A printed circuit board according to the present invention is a printed circuit board (4) including a component mounting pin (1) made of a metal wire to connect with a semiconductor chip (10). The semiconductor chip (10) is a surface mounting type semiconductor chip having an electrode pad on its mounting surface for use in a flip-chip mounting system. The component mounting pin (1) is formed by using wire-bonding technology. This printed circuit board (4) is able to decrease malconnections or disconnection caused by a difference between the coefficients of thermal expansion of the semiconductor chip (10) and the printed circuit board (4).
摘要翻译： 根据本发明的印刷电路板是印刷电路板（4），包括由金属线制成的元件安装销（1），以与半导体芯片（10）连接。 半导体芯片（10）是表面安装型半导体芯片，其在其安装表面上具有用于倒装芯片安装系统的电极焊盘。 元件安装销（1）通过引线接合技术形成。 该印刷电路板（4）能够减少由半导体芯片（10）和印刷电路板（4）的热膨胀系数之间的差异引起的误连接或断开。
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公开(公告)号：US20070256858A1
公开(公告)日：2007-11-08
申请号：US11415117
申请日：2006-05-02
IPC分类号： H05K1/16
CPC分类号： H01L21/4857 , H01L21/486 , H01L23/49822 , H01L23/49827 , H01L2224/05568 , H01L2224/05573 , H01L2224/16 , H01L2224/16225 , H01L2224/16235 , H01L2924/00014 , H01L2924/01019 , H01L2924/01046 , H01L2924/01057 , H01L2924/01078 , H01L2924/01079 , H01L2924/15174 , H01L2924/15311 , H01L2924/3011 , H05K1/112 , H05K3/4602 , H05K3/4688 , H05K2201/0187 , H05K2201/10674 , H01L2224/05599
摘要： This invention provides a multilayer printed wiring board which achieves fine pitches. A heat resistant substrate is incorporated in a multilayer printed wiring board and interlayer resin insulation layer and conductive layer are placed alternately on the heat resistant substrate. A built-up wiring board in which respective conductive layers are connected by via hole is formed. A via hole is formed on the surface of a mirror-processed Si substrate by using a heat resistant substrate composed of Si substrate so that finer wiring than a resin substrate having unevenness in its surface can be formed, whereby achieving fine pitches. Further, by forming the wiring on a mirror processed surface, dispersion of wiring decreases thereby decreasing dispersion of impedance.
摘要翻译： 本发明提供一种实现细小间距的多层印刷线路板。 在多层印刷线路板和层间树脂绝缘层中并入耐热基板，并将导电层交替放置在耐热基板上。 形成各导电层通过通孔连接的叠层布线板。 通过使用由Si衬底构成的耐热衬底，在镜面处理的Si衬底的表面上形成通孔，从而可以形成比其表面不均匀的树脂衬底更细的布线，从而实现细小的间距。 此外，通过在镜面处理表面上形成布线，布线的分散减小，从而减小阻抗的分散。
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4.发明申请公开(公告)号：US20070256297A1
公开(公告)日：2007-11-08
申请号：US11566847
申请日：2006-12-05
CPC分类号： H05K3/4092 , H05K2201/0311 , H05K2203/308 , Y10T29/49124 , Y10T29/49155 , Y10T29/49156
摘要： The present invention is to provide a method of manufacturing a printed wiring board with a component mounting pin to connect a printed wiring board and an electronic component A method of manufacturing a printed wiring board (1) with a component mounting pin (18) at a stage to form a component mounting surface after layers of a predetermined number were formed includes the steps of forming a conductive land (11) on the component mounting surface, covering the component mounting surface with an insulating layer (12) except the conductive land (11) of the component mounting surface, partly forming near the conductive land (11) of the upper surface of the insulating layer (12) a sacrificial layer (14) which can be removed in the subsequent process, forming conductive layers (16, 17) on the upper surfaces of the conductive land (11) and the sacrificial layer (14) with a plating process to pattern the conductive layers (16, 17), forming the component mounting pin (18) elongated from the conductive land (11) by partly removing the sacrificial layer (14) located under the patterned conductive layers (16, 17) and erecting the component mounting pin (18).
摘要翻译： 本发明是提供一种制造印刷电路板的方法，其具有用于连接印刷线路板和电子部件的部件安装销。一种制造印刷电路板（1）的方法，所述印刷电路板（1）具有元件安装销（18） 在形成预定数量的层之后形成部件安装表面的步骤包括以下步骤：在部件安装表面上形成导电焊盘（11），用除了导电焊盘（11）之外的绝缘层（12）覆盖部件安装表面 ），部分地形成在绝缘层（12）的上表面的导电焊盘（11）附近的牺牲层（14），其可以在随后的工艺中去除，形成导电层（16,17） 在导电焊盘（11）和牺牲层（14）的上表面上以电镀工艺对导电层（16,17）进行图案化，形成部件安装销（ 18）通过部分去除位于图案化导电层（16,17）下方的牺牲层（14）并且架设元件安装销（18）而从导电焊盘（11）延伸。
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公开(公告)号：US07891089B2
公开(公告)日：2011-02-22
申请号：US12254608
申请日：2008-10-20
IPC分类号： H05K3/30
CPC分类号： H05K3/4015 , H01L21/4853 , H01L23/49811 , H01L24/45 , H01L24/72 , H01L24/78 , H01L24/81 , H01L24/83 , H01L24/90 , H01L2224/05568 , H01L2224/05573 , H01L2224/1134 , H01L2224/131 , H01L2224/451 , H01L2224/45139 , H01L2224/45144 , H01L2224/45147 , H01L2224/78301 , H01L2224/786 , H01L2224/8121 , H01L2224/81815 , H01L2224/838 , H01L2224/851 , H01L2224/85205 , H01L2224/90 , H01L2924/00013 , H01L2924/00014 , H01L2924/0133 , H01L2924/014 , H01L2924/14 , H01L2924/3011 , H05K3/326 , H05K3/341 , H05K2201/10265 , H05K2201/10287 , H05K2203/049 , Y10T29/49135 , Y10T29/49142 , Y10T29/49149 , Y10T29/49153 , H01L2224/13099 , H01L2924/01029 , H01L2924/01047 , H01L2924/01079 , H01L2224/48 , H01L2924/00015 , H01L2224/05599
摘要： A printed circuit board according to the present invention is a printed circuit board (4) including a component mounting pin (1) made of a metal wire to connect with a semiconductor chip (10). The semiconductor chip (10) is a surface mounting type semiconductor chip having an electrode pad on its mounting surface for use in a flip-chip mounting system. The component mounting pin (1) is formed by using wire-bonding technology. This printed circuit board (4) is able to decrease malconnections or disconnection caused by a difference between the coefficients of thermal expansion of the semiconductor chip (10) and the printed circuit board (4).
摘要翻译： 根据本发明的印刷电路板是印刷电路板（4），包括由金属线制成的元件安装销（1），以与半导体芯片（10）连接。 半导体芯片（10）是表面安装型半导体芯片，其在其安装表面上具有用于倒装芯片安装系统的电极焊盘。 元件安装销（1）通过引线接合技术形成。 该印刷电路板（4）能够减少由半导体芯片（10）和印刷电路板（4）的热膨胀系数之间的差异引起的误连接或断开。
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公开(公告)号：US07731504B2
公开(公告)日：2010-06-08
申请号：US12254592
申请日：2008-10-20
IPC分类号： H01R9/00
CPC分类号： H05K3/4015 , H01L21/4853 , H01L23/49811 , H01L24/45 , H01L24/72 , H01L24/78 , H01L24/81 , H01L24/83 , H01L24/90 , H01L2224/05568 , H01L2224/05573 , H01L2224/1134 , H01L2224/131 , H01L2224/451 , H01L2224/45139 , H01L2224/45144 , H01L2224/45147 , H01L2224/78301 , H01L2224/786 , H01L2224/8121 , H01L2224/81815 , H01L2224/838 , H01L2224/851 , H01L2224/85205 , H01L2224/90 , H01L2924/00013 , H01L2924/00014 , H01L2924/0133 , H01L2924/014 , H01L2924/14 , H01L2924/3011 , H05K3/326 , H05K3/341 , H05K2201/10265 , H05K2201/10287 , H05K2203/049 , Y10T29/49135 , Y10T29/49142 , Y10T29/49149 , Y10T29/49153 , H01L2224/13099 , H01L2924/01029 , H01L2924/01047 , H01L2924/01079 , H01L2224/48 , H01L2924/00015 , H01L2224/05599
摘要： A printed circuit board according to the present invention is a printed circuit board (4) including a component mounting pin (1) made of a metal wire to connect with a semiconductor chip (10). The semiconductor chip (10) is a surface mounting type semiconductor chip having an electrode pad on its mounting surface for use in a flip-chip mounting system. The component mounting pin (1) is formed by using wire-bonding technology. This printed circuit board (4) is able to decrease malconnections or disconnection caused by a difference between the coefficients of thermal expansion of the semiconductor chip (10) and the printed circuit board (4).
摘要翻译： 根据本发明的印刷电路板是印刷电路板（4），包括由金属线制成的元件安装销（1），以与半导体芯片（10）连接。 半导体芯片（10）是表面安装型半导体芯片，其在其安装表面上具有用于倒装芯片安装系统的电极焊盘。 元件安装销（1）通过引线接合技术形成。 该印刷电路板（4）能够减少由半导体芯片（10）和印刷电路板（4）的热膨胀系数之间的差异引起的误连接或断开。
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公开(公告)号：US20070190819A1
公开(公告)日：2007-08-16
申请号：US11566862
申请日：2006-12-05
IPC分类号： H05K1/00
CPC分类号： H05K3/4015 , H01L21/4853 , H01L23/49811 , H01L24/45 , H01L24/72 , H01L24/78 , H01L24/81 , H01L24/83 , H01L24/90 , H01L2224/05568 , H01L2224/05573 , H01L2224/1134 , H01L2224/131 , H01L2224/451 , H01L2224/45139 , H01L2224/45144 , H01L2224/45147 , H01L2224/78301 , H01L2224/786 , H01L2224/8121 , H01L2224/81815 , H01L2224/838 , H01L2224/851 , H01L2224/85205 , H01L2224/90 , H01L2924/00013 , H01L2924/00014 , H01L2924/0133 , H01L2924/014 , H01L2924/14 , H01L2924/3011 , H05K3/326 , H05K3/341 , H05K2201/10265 , H05K2201/10287 , H05K2203/049 , Y10T29/49135 , Y10T29/49142 , Y10T29/49149 , Y10T29/49153 , H01L2224/13099 , H01L2924/01029 , H01L2924/01047 , H01L2924/01079 , H01L2224/48 , H01L2924/00015 , H01L2224/05599
摘要： A printed circuit board according to the present invention is a printed circuit board (4) including a component mounting pin (1) made of a metal wire to connect with a semiconductor chip (10). The semiconductor chip (10) is a surface mounting type semiconductor chip having an electrode pad on its mounting surface for use in a flip-chip mounting system. The component mounting pin (1) is formed by using wire-bonding technology. This printed circuit board (4) is able to decrease malconnections or disconnection caused by a difference between the coefficients of thermal expansion of the semiconductor chip (10) and the printed circuit board (4).
摘要翻译： 根据本发明的印刷电路板是印刷电路板（4），包括由金属线制成的元件安装销（1），以与半导体芯片（10）连接。 半导体芯片（10）是表面安装型半导体芯片，其在其安装表面上具有用于倒装芯片安装系统的电极焊盘。 元件安装销（1）通过引线接合技术形成。 该印刷电路板（4）能够减少由半导体芯片（10）和印刷电路板（4）的热膨胀系数之间的差异引起的误连接或断开。
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公开(公告)号：US08507806B2
公开(公告)日：2013-08-13
申请号：US12488224
申请日：2009-06-19
IPC分类号： H05K1/16
CPC分类号： H01L21/4857 , H01L21/486 , H01L23/49822 , H01L23/49827 , H01L2224/05568 , H01L2224/05573 , H01L2224/16 , H01L2224/16225 , H01L2224/16235 , H01L2924/00014 , H01L2924/01019 , H01L2924/01046 , H01L2924/01057 , H01L2924/01078 , H01L2924/01079 , H01L2924/15174 , H01L2924/15311 , H01L2924/3011 , H05K1/112 , H05K3/4602 , H05K3/4688 , H05K2201/0187 , H05K2201/10674 , H01L2224/05599
摘要： A circuit wiring board including a wiring substrate, and a heat resistant substrate accommodated in the wiring substrate and including a core substrate and a through hole conductor formed in the core substrate, the core substrate having a first surface and a second surface on an opposite side of the first surface, the through hole conductor providing electrical connection through the core substrate between the first surface and the second surface of the core substrate.
摘要翻译： 一种电路布线板，包括布线基板和容纳在所述布线基板中的耐热基板，所述布线基板包括形成在所述芯基板中的芯基板和通孔导体，所述芯基板具有第一表面和位于相对侧的第二表面 所述通孔导体在所述芯基板的所述第一表面和所述第二表面之间提供通过所述芯基板的电连接。
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公开(公告)号：US08008583B2
公开(公告)日：2011-08-30
申请号：US12330147
申请日：2008-12-08
IPC分类号： H05K1/16
CPC分类号： H01L21/4857 , H01L21/486 , H01L23/49822 , H01L23/49827 , H01L2224/05568 , H01L2224/05573 , H01L2224/16 , H01L2224/16225 , H01L2224/16235 , H01L2924/00014 , H01L2924/01019 , H01L2924/01046 , H01L2924/01057 , H01L2924/01078 , H01L2924/01079 , H01L2924/15174 , H01L2924/15311 , H01L2924/3011 , H05K1/112 , H05K3/4602 , H05K3/4688 , H05K2201/0187 , H05K2201/10674 , H01L2224/05599
摘要： This invention provides a multilayer printed wiring board which achieves fine pitches. A heat resistant substrate is incorporated in a multilayer printed wiring board and interlayer resin insulation layer and conductive layer are placed alternately on the heat resistant substrate. A built-up wiring board in which respective conductive layers are connected by via hole is formed. A via hole is formed on the surface of a mirror-processed Si substrate by using a heat resistant substrate composed of Si substrate so that finer wiring than a resin substrate having unevenness in its surface can be formed, whereby achieving fine pitches. Further, by forming the wiring on a mirror processed surface, dispersion of wiring decreases thereby decreasing dispersion of impedance.
摘要翻译： 本发明提供一种实现细小间距的多层印刷线路板。 在多层印刷线路板和层间树脂绝缘层中并入耐热基板，并将导电层交替放置在耐热基板上。 形成各导电层通过通孔连接的叠层布线板。 通过使用由Si衬底构成的耐热衬底，在镜面处理的Si衬底的表面上形成通孔，从而可以形成比其表面不均匀的树脂衬底更细的布线，从而实现细小的间距。 此外，通过在镜面处理表面上形成布线，布线的分散减小，从而减小阻抗的分散。
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公开(公告)号：US20110063806A1
公开(公告)日：2011-03-17
申请号：US12952759
申请日：2010-11-23
IPC分类号： H05K1/18
CPC分类号： H01L21/4857 , H01L21/486 , H01L23/49822 , H01L23/49827 , H01L2224/05568 , H01L2224/05573 , H01L2224/16 , H01L2224/16225 , H01L2224/16235 , H01L2924/00014 , H01L2924/01019 , H01L2924/01046 , H01L2924/01057 , H01L2924/01078 , H01L2924/01079 , H01L2924/15174 , H01L2924/15311 , H01L2924/3011 , H05K1/112 , H05K3/4602 , H05K3/4688 , H05K2201/0187 , H05K2201/10674 , H01L2224/05599
摘要： A circuit wiring board including a wiring substrate, multiple electronic components provided on a surface of the wiring substrate, and a heat resistant substrate accommodated in the wiring substrate and having a core substrate and a built-up wiring layer formed over the core substrate. The built-up wiring layer includes a conductive layer and an interlayer resin insulating layer, and the electronic components are electrically connected to the conductive layer of the built-up wiring layer.
摘要翻译： 一种电路布线板，包括布线基板，设置在所述布线基板的表面上的多个电子部件和容纳在所述布线基板中的耐热基板，并且具有形成在所述芯基板上的芯基板和积层布线层。 叠层布线层包括导电层和层间树脂绝缘层，并且电子部件电连接到组合布线层的导电层。
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