公开(公告)号：US4328512A

公开(公告)日：1982-05-04

申请号：US114835

申请日：1980-01-24

Applicant: Klaus Heyke ,  Gunter Schmidt ,  Istvan Ragaly

Inventor： Klaus Heyke ,  Gunter Schmidt ,  Istvan Ragaly

IPC: H01L23/28 ,  H01L23/049 ,  H01L23/31 ,  H01L23/49 ,  H01L25/07 ,  H02M7/04 ,  H01L23/32 ,  H01L23/02

CPC classification number: H01L24/01 ,  H01L23/049 ,  H01L23/3107 ,  H01L25/074 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01021 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/12036 ,  H01L2924/12043 ,  Y10S257/909

Abstract: To improve the stability and robustness of a rectifier and to protect it against atmospheric influences, two plate-like, series-connected semiconductor diodes are soldered to a common tap electrode between them. An external lead wire is soldered to each of the remaining sides of the diodes. The entire soldered structure is embedded in a single mass of resin or plastic, the ends of the electrodes being configured to serve as anchoring elements in the plastic mass.

Abstract translation: 为了提高整流器的稳定性和鲁棒性并保护整流器免受大气影响，将两个板状串联连接的半导体二极管焊接到它们之间的公共抽头电极。 外部引线焊接到二极管的其余两侧。 整个焊接结构被嵌入在单个树脂或塑料块中，电极的端部构造成用作塑料块中的锚定元件。

公开(公告)号：US4314271A

公开(公告)日：1982-02-02

申请号：US114836

申请日：1980-01-24

Applicant: Klaus Heyke ,  Gunter Schmidt ,  Istvar Ragaly

Inventor： Klaus Heyke ,  Gunter Schmidt ,  Istvar Ragaly

IPC: H01L23/04 ,  H01L23/049 ,  H01L23/48 ,  H01L25/07 ,  H01L23/32 ,  H01L23/02 ,  H01L23/12

CPC classification number: H01L25/074 ,  H01L23/049 ,  H01L24/72 ,  H01L2924/01015 ,  H01L2924/01082 ,  H01L2924/12036 ,  H01L2924/12043 ,  Y10S257/909

Abstract: To improve the stability and robustness of a rectifier and to protect it against atmospheric influences, two semiconductor diodes in the shape of small plates or discs are disposed to hold between them a center electrode. A wire-like lead electrode is held in contact with the remaining side of one diode and the second lead electrode is cup-shaped and its walls surround the diode stack. An inwardly extending lip of the cup-shaped electrode supports a spring which exerts pressure on the enlarged tip of the first lead electrode, thus clamping the entire stack in contact. A cover plate seals the opening of the cup and a resinous mass may be applied over the cover plate to provide a hermetic seal.

Abstract translation: 为了提高整流器的稳定性和鲁棒性并保护其不受大气影响，设置有小板或盘形状的两个半导体二极管，以在其间夹持中心电极。 线状引线电极与一个二极管的剩余侧保持接触，第二引线电极为杯形，其壁围绕二极管叠层。 杯形电极的向内延伸的唇缘支撑弹簧，该弹簧对第一引线电极的扩大的尖端施加压力，从而夹紧整个叠层。 盖板密封杯的开口，并且树脂质量可以施加在盖板上以提供气密密封。

公开(公告)号：US4303935A

公开(公告)日：1981-12-01

申请号：US965743

申请日：1978-12-04

Applicant: Istvan Ragaly

Inventor： Istvan Ragaly

IPC: H01L23/42 ,  H01L23/049 ,  H01L23/28 ,  H01L23/31 ,  H01L23/34 ,  H01L23/373 ,  H01L23/492 ,  H01L25/07 ,  H02M7/00 ,  H01L23/32 ,  H01L23/02

CPC classification number: H01L24/01 ,  H01L23/049 ,  H01L23/3107 ,  H01L23/3135 ,  H01L23/34 ,  H01L23/3737 ,  H01L23/492 ,  H01L25/071 ,  H01L25/072 ,  H01L25/074 ,  H02M7/003 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01033 ,  H01L2924/01057 ,  H01L2924/01058 ,  H01L2924/01074 ,  H01L2924/01076 ,  H01L2924/01077 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/1301 ,  H01L2924/3025 ,  Y10S257/909

Abstract: A semiconductor element, either a diode or a controlled rectifier, is electrically insulated relative to the heat sink on which it is mounted by either an insulating layer or an insulating diode of high thermal conductivity. A single unit including the heat sink with a plurality of diodes is used as a bridge rectifier in single phase or polyphase circuits.

Abstract translation: 半导体元件，二极管或可控整流器，相对于散热器而进行电绝缘，散热器通过绝缘层或高导热系数的绝缘二极管安装在该散热器上。 包括具有多个二极管的散热器的单个单元被用作单相或多相电路中的桥式整流器。

公开(公告)号：US3753052A

公开(公告)日：1973-08-14

申请号：US3753052D

申请日：1972-03-01

Applicant: GEN ELECTRIC

Inventor： ROSSER D

IPC: H01L23/48 ,  H01L25/03 ,  H01L3/00 ,  H01L5/00

CPC classification number: H01L24/72 ,  H01L25/03 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01074 ,  H01L2924/12036 ,  H01L2924/3025 ,  Y10S257/909 ,  H01L2924/00

Abstract: An integrally housed bridge circuit including a plurality of high power semiconductor rectifiers. The rectifiers are disposed within a hermetically sealed insulative housing and are electrically interconnected therein to form a bridge circuit having a pair of A-C terminals and a pair of D-C terminals.

Abstract translation: 包括多个高功率半导体整流器的整体式的桥接电路。 整流器设置在密封绝缘壳体内并与其电连接以形成具有一对A-C端子和一对D-C端子的桥接电路。

公开(公告)号：US3737738A

公开(公告)日：1973-06-05

申请号：US3737738D

申请日：1970-09-22

Applicant: GEN ELECTRIC

Inventor： KOENIG P

IPC: H01L21/48 ,  H01L21/56 ,  H01L23/495 ,  H01L5/00

CPC classification number: H01L24/33 ,  H01L21/4821 ,  H01L21/56 ,  H01L23/49562 ,  H01L23/49572 ,  H01L24/01 ,  H01L24/83 ,  H01L2224/2919 ,  H01L2224/7565 ,  H01L2224/83101 ,  H01L2224/83192 ,  H01L2224/83801 ,  H01L2224/83855 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/12043 ,  H01L2924/1301 ,  H01L2924/3011 ,  Y10S257/909 ,  H01L2924/00

Abstract: Two continuous lead strips are advanced longitudinally to receive a semiconductor element therebetween. The semiconductor element is attached to the strips, the semiconductor element is encapsulated, and the strips are segmented to form a semiconductor device. The strips may be fed in side by side or transverse relation. To form a bridge two strips are fed in side by side relation while two more strips are fed in transverse relation to the first two and in side by side relation to each other.

Abstract translation: 两个连续的引线纵向前进以在其间接纳半导体元件。 将半导体元件附接到条，半导体元件被封装，并且条被分割以形成半导体器件。 条带可以并排或横向地进给。 为了形成桥，两个条带并排地供给，而另外两个条以相对于前两个的横向关系并且彼此并排地进给。

公开(公告)号：US3707766A

公开(公告)日：1973-01-02

申请号：US3707766D

申请日：1971-05-06

Applicant: ITT

Inventor： VEITH A

IPC: H01L25/03 ,  B01J17/00

CPC classification number: H01L25/03 ,  H01L2924/0002 ,  Y10S257/909 ,  Y10T29/49121 ,  H01L2924/00

Abstract: A plurality of rectifier bridges are made simultaneously by placing rectifier components on both sides at the end of comb leads. A T-shaped part is placed in contact with each pair of rectifiers on each side of the comb leads to complete the bridge. Each bridge is encapsulated and the comb leads are severed from the comb support.

Abstract translation: 通过在梳头末端的两侧放置整流器部件来同时制造多个整流器桥。 T型部件与梳状导线的每一侧上的每对整流器接触以完成桥。 每个桥被封装，并且梳子引线从梳子支架上被切断。

公开(公告)号：US3706129A

公开(公告)日：1972-12-19

申请号：US3706129D

申请日：1970-07-27

Applicant: GEN ELECTRIC

Inventor： MCCANN JOSEPH A

IPC: H01L21/78 ,  H01L23/31 ,  H01L23/36 ,  H01L25/07 ,  H01L27/00 ,  B01J17/00

CPC classification number: H01L23/3157 ,  H01L21/78 ,  H01L23/3178 ,  H01L23/36 ,  H01L25/072 ,  H01L27/00 ,  H01L2924/0002 ,  H01L2924/10157 ,  H01L2924/3011 ,  Y10S148/028 ,  Y10S257/909 ,  Y10S438/98 ,  H01L2924/00

Abstract: A wafer is diffused along opposite surfaces with bands of alternating conductivity type so that a band on one major surface is aligned with a band of an opposite conductivity type on the opposite major surface. Grooves are formed to separate bands along one major surface while grooves are formed at substantially right angles on the opposite major surface. The wafer may then be sub-divided along the grooves to form integrated rectifier units formed of unitary semiconductive elements. Contacts associated with one major surface may be utilized to provide a thermally conductive path to a thermally conductive, electrically insulative surface of a substrate. The contacts and a passivant associated with the semiconductive element together encapsulate the semiconductive element.

Abstract translation: 晶圆沿着具有交替导电类型的带的相对表面扩散，使得一个主表面上的带与相对主表面上的相反导电类型的带对准。 凹槽形成为沿着一个主表面分离带，同时在相对的主表面上以大致直角形成凹槽。 然后可以沿着沟槽对晶片进行细分，以形成由整体半导电元件形成的集成整流单元。 可以使用与一个主表面相关联的触点来提供到基板的导热电绝缘表面的导热路径。 触点和与半导体元件相关联的钝化剂一起封装半导体元件。

公开(公告)号：US3566959A

公开(公告)日：1971-03-02

申请号：US3566959D

申请日：1969-07-17

Applicant: CONTROLLED POWER CORP

Inventor： KOLTUNIAK MICHAEL A ,  MITCHELL CLAYBOURNE JR ,  PLANTHOLT ROBERT G

IPC: F28F1/16 ,  H01L23/40 ,  F28F7/00

CPC classification number: F28F1/16 ,  F28D2021/0029 ,  F28F2215/10 ,  H01L23/4006 ,  H01L2023/4031 ,  H01L2023/405 ,  H01L2924/0002 ,  Y10S257/909 ,  H01L2924/00

Abstract: An extruded aluminum heat sink for semiconductor rectifiers and having substantially identical right- and left-hand fin sections joined by an integral transverse horizontal web so that the heat sink is symmetrical about a vertical plane through the web. Each fin section has a relatively thick trunk portion that is tapered in thickness in a direction laterally outwardly from the web. A plurality of integral fins are disposed angularly to the trunk portion and project upwardly and downwardly therefrom so that the tips of the fins define a rectangular transverse configuration. Integral with each fin section adjacent the web is a mounting leg that projects downwardly and has an outwardly turned flange at its lower end for mounting the heat sink on a support such as a copper bus bar.

公开(公告)号：US3536133A

公开(公告)日：1970-10-27

申请号：US3536133D

申请日：1968-05-01

Applicant: ASEA AB

Inventor： MATTSSON HUGO ,  MELLGREN GUNNAR

IPC: H01L23/473 ,  H01L25/03 ,  F28F7/00 ,  H01L1/12

CPC classification number: H01L23/473 ,  H01L25/03 ,  H01L2924/0002 ,  Y10S257/909 ,  H01L2924/00

公开(公告)号：US3462655A

公开(公告)日：1969-08-19

申请号：US3462655D

申请日：1967-12-01

Applicant: INT RECTIFIER CORP

Inventor： COBLENZ ABRAHAM G

IPC: H01L21/00 ,  H01L23/31 ,  H01L27/00 ,  H01L5/02

CPC classification number: H01L23/3157 ,  H01L21/00 ,  H01L27/00 ,  H01L2924/0002 ,  Y10S257/909 ,  H01L2924/00