Invention Grant
- Patent Title: Semiconductor apparatus with electrically insulated heat sink
- Patent Title (中): 具有电绝缘散热片的半导体装置
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Application No.: US965743Application Date: 1978-12-04
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Publication No.: US4303935APublication Date: 1981-12-01
- Inventor: Istvan Ragaly
- Applicant: Istvan Ragaly
- Applicant Address: DEX Stuttgart
- Assignee: Robert Bosch GmbH
- Current Assignee: Robert Bosch GmbH
- Current Assignee Address: DEX Stuttgart
- Priority: DEX2755404 19771213; DEX2838342 19780209; DEX2838412 19780902
- Main IPC: H01L23/42
- IPC: H01L23/42 ; H01L23/049 ; H01L23/28 ; H01L23/31 ; H01L23/34 ; H01L23/373 ; H01L23/492 ; H01L25/07 ; H02M7/00 ; H01L23/32 ; H01L23/02
Abstract:
A semiconductor element, either a diode or a controlled rectifier, is electrically insulated relative to the heat sink on which it is mounted by either an insulating layer or an insulating diode of high thermal conductivity. A single unit including the heat sink with a plurality of diodes is used as a bridge rectifier in single phase or polyphase circuits.
Public/Granted literature
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Information query
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