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    PLASMA PROCESSING APPARATUS
    82.
    发明公开
    PLASMA PROCESSING APPARATUS 审中-公开

    公开(公告)号：US20230207282A1

    公开(公告)日：2023-06-29

    申请号：US18085583

    申请日：2022-12-21

    Applicant: Tokyo Electron Limited

    Inventor： Shusei KATO

    IPC: H01J37/32

    CPC classification number: H01J37/32642 ,  H01J2237/024 ,  H01J2237/334

    Abstract: There is a plasma processing apparatus, comprising: a plasma processing chamber; a substrate support having a ring supporting surface; an insulating ring disposed on the ring supporting surface, the insulating ring having at least three through holes, each of the through holes having upper and lower hole portions, the lower hole portion having a flaring shape; a conductive ring supported by the insulating ring, the conductive ring having at least three grooves on a lower surface, the grooves corresponding to the through holes; at least three lift pins disposed below the ring supporting surface, the lift pins corresponding to the grooves, each of the lift pins having upper and lower supporting portions, the upper supporting portion being configured to support the conductive ring, the lower supporting portion configured to support the insulating ring; and at least one actuator configured to vertically move the pins.

    ELECTRON GUN, ELECTRON GUN COMPONENT, ELECTRON BEAM APPLICATION DEVICE, AND POSITIONING METHOD
    83.
    发明公开
    ELECTRON GUN, ELECTRON GUN COMPONENT, ELECTRON BEAM APPLICATION DEVICE, AND POSITIONING METHOD 审中-公开

    公开(公告)号：US20230207249A1

    公开(公告)日：2023-06-29

    申请号：US17996213

    申请日：2021-08-20

    Applicant: PHOTO ELECTRON SOUL INC.

    Inventor： Tomohiro Nishitani

    IPC: H01J37/073

    CPC classification number: H01J37/073 ,  H01J2237/06333 ,  H01J2237/06375 ,  H01J2237/024

    Abstract: Provided are an electron gun, an electron gun component, an electron beam applicator, and an alignment method that can align the emission axis of an electron beam with the optical axis of the electron optical system of the counterpart device even when misalignment of a mounted position of the electron gun being mounted to the counterpart device is larger. The electron gun includes: a light source; a vacuum chamber; a photocathode that emits an electron beam in response to receiving light from the light source; an electrode kit; and an electrode kit drive device, the electrode kit includes a photocathode supporting part, and an anode arranged spaced apart from the photocathode supporting part, the photocathode is placed on the photocathode supporting part, and the electrode kit drive device moves the electrode kit in an X-Y plane, where one direction is defined as an X direction, a direction orthogonal to the X direction is defined as a Y direction, and a plane including the X direction and the Y direction is defined as the X-Y plane.

    SUBSTRATE TREATING APPARATUS
    85.
    发明申请
    SUBSTRATE TREATING APPARATUS 审中-公开

    公开(公告)号：US20180358211A1

    公开(公告)日：2018-12-13

    申请号：US16002978

    申请日：2018-06-07

    Applicant: SEMES CO., LTD.

    Inventor： Sangmin MUN

    IPC: H01J37/32 ,  H01L21/67

    CPC classification number: H01J37/32642 ,  H01J37/32651 ,  H01J37/32715 ,  H01J2237/024 ,  H01J2237/334 ,  H01L21/67069

    Abstract: Disclosed is a substrate treating apparatus. The substrate treating apparatus includes a chuck configured to support a substrate in a treatment space of a chamber into which a process gas is supplied, and a ring assembly surrounding the chuck, and the ring assembly includes an inner ring located such that a portion of the inner ring surrounds an outer side of the substrate supported by the chuck, an outer ring located to surround the inner ring, and a driver configured to move the outer ring upwards and downwards.

    Charged Particle Beam Apparatus
    88.
    发明申请
    Charged Particle Beam Apparatus 审中-公开

    公开(公告)号：US20180138010A1

    公开(公告)日：2018-05-17

    申请号：US15869460

    申请日：2018-01-12

    Applicant: Hitachi High-Technologies Corporation

    Inventor： Muneyuki FUKUDA ,  Yoshinori MOMONOI ,  Akihiro MIURA ,  Fumihiro SASAJIMA ,  Hiroaki MITO

    IPC: H01J37/22 ,  H01J37/28

    CPC classification number: H01J37/22 ,  H01J37/21 ,  H01J37/28 ,  H01J2237/024 ,  H01J2237/216 ,  H01J2237/2817

    Abstract: A charged particle beam device is provided that performs proper beam adjustment while suppressing a decrease in MAM time, with a simple configuration without adding a lens, a sensor, or the like. The charged particle beam device includes: an optical element which adjusts a charged particle beam emitted from a charged particle source; an adjustment element which adjusts an incidence condition of the charged particle beam with respect to the optical element; and a control device which controls the adjustment element, wherein the control device determines a difference between a first feature amount indicating a state of the optical element based on the condition setting of the optical element, and a second feature amount indicating a state where the optical element reaches based on the condition setting and executes adjustment by the adjustment element when the difference is greater than or equal to a predetermined value.

    MULTI MODE SYSTEM WITH A DISPERSION X-RAY DETECTOR
    89.
    发明申请
    MULTI MODE SYSTEM WITH A DISPERSION X-RAY DETECTOR 审中-公开

    公开(公告)号：US20180012728A1

    公开(公告)日：2018-01-11

    申请号：US15703925

    申请日：2017-09-13

    Applicant: APPLIED MATERIALS ISRAEL LTD.

    Inventor： Alon Litman ,  Efim Vinnitsky

    IPC: H01J37/244 ,  H01J37/28 ,  H01J37/20 ,  H01J37/285

    CPC classification number: H01J37/244 ,  H01J37/20 ,  H01J37/28 ,  H01J37/285 ,  H01J2237/024 ,  H01J2237/2445 ,  H01J2237/2807

    Abstract: A method for evaluating a specimen, the method can include positioning an energy dispersive X-ray (EDX) detector at a first position; scanning a flat surface of the specimen by a charged particle beam that exits from a charged particle beam optics tip and propagates through an aperture of an EDX detector tip; detecting, by the EDX detector, x-ray photons emitted from the flat surface as a result of the scanning of the flat surface with the charged particle beam; after a completion of the scanning of the flat surface, positioning the EDX detector at a second position in which a distance between the EDX detector tip and a plane of the flat surface exceeds a distance between the plane of the flat surface and the charged particle beam optics tip; and wherein a projection of the EDX detector on the plane of the flat surface virtually falls on the flat surface when the EDX detector is positioned at the first position and when the EDX detector is positioned at the second position.

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