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    CAMERAS HAVING AN OPTICAL CHANNEL THAT INCLUDES SPATIALLY SEPARATED SENSORS FOR SENSING DIFFERENT PARTS OF THE OPTICAL SPECTRUM
    81.
    发明申请
    CAMERAS HAVING AN OPTICAL CHANNEL THAT INCLUDES SPATIALLY SEPARATED SENSORS FOR SENSING DIFFERENT PARTS OF THE OPTICAL SPECTRUM 审中-公开
    具有光学通道的摄像机，包括用于感测光谱的不同部分的空间分离传感器

    公开(公告)号：US20160292506A1

    公开(公告)日：2016-10-06

    申请号：US15082681

    申请日：2016-03-28

    Applicant: Heptagon Micro Optics Pte. Ltd.

    Inventor： Hartmut Rudmann ,  Kai Engelhardt ,  Yibin Tian

    IPC: G06K9/00 ,  H04N5/378 ,  G06T7/00 ,  H04N5/232 ,  G06K9/20 ,  H04N5/33 ,  H04N9/097

    CPC classification number: G06K9/00604 ,  G06K9/2018 ,  H04N5/2226 ,  H04N5/2258 ,  H04N5/332 ,  H04N9/09 ,  H04N9/097

    Abstract: The present disclosure describes cameras having an optical channel that includes spatially separated sensors for sensing different parts of the optical spectrum. For example, in one aspect, an apparatus includes an image sensor module having an optical channel and including a multitude of spatially separated sensors to receive optical signals in the optical channel. The multitude of spatially separated sensors includes a first sensor operable to sense optical signals in a first spectral range, and a second sensor spatially separated from the first sensor and operable to sense optical signals in a second spectral range different from the first spectral range.

    Abstract translation: 本公开描述了具有光通道的照相机，其包括用于感测光谱的不同部分的空间分离的传感器。 例如，在一个方面，一种装置包括具有光学通道并且包括多个空间分离的传感器以在光学通道中接收光学信号的图像传感器模块。 多个空间分离的传感器包括可操作以感测第一光谱范围的光信号的第一传感器和与第一传感器空间分离的第二传感器，并可操作以在与第一光谱范围不同的第二光谱范围内感测光信号。

    MANUFACTURE OF TRUNCATED LENSES, OF PAIRS OF TRUNCATED LENSES AND OF CORRESPONDING DEVICES
    83.
    发明申请
    MANUFACTURE OF TRUNCATED LENSES, OF PAIRS OF TRUNCATED LENSES AND OF CORRESPONDING DEVICES 审中-公开
    截断镜片的制造，截面镜片和相关器件的制造

    公开(公告)号：US20150217524A1

    公开(公告)日：2015-08-06

    申请号：US14426472

    申请日：2013-09-03

    Applicant: HEPTAGON MICRO OPTICS PTE. LTD.

    Inventor： Hartmut Rudmann ,  Jürgen Soechtig ,  Nicola Spring ,  Alexander Bietesch

    IPC: B29D11/00 ,  B29C33/38 ,  G02B13/00

    CPC classification number: B29D11/00 ,  B29C33/0022 ,  B29C33/3842 ,  B29D11/00365 ,  B29K2995/0094 ,  B29L2011/0016 ,  G02B3/0031 ,  G02B3/0062 ,  G02B13/0085

    Abstract: The invention relates to wafer-level manufacturing of optical devices such as modules comprising micro-lenses. In one aspect, passive optical components such as truncated lenses are manufactured by providing a substrate on which a multitude of precursor optical structures is present; and removing material from each of said multitude of precursor optical structures. Another aspect comprises a method for manufacturing a device comprising a set of at least two passive optical components, said method comprising the steps of using a tool obtained by carrying out the steps of manufacturing a precursor tool having a replication surface; and modifying said replication surface by removing material from said precursor tool. An yet another aspect comprises a method for manufacturing a device comprising a set of at least two passive optical components, wherein the method comprises the step of using a master comprising a replication surface comprising, for each of said passive optical components, a first portion describing a shape corresponding to the shape of at least a portion of the respective passive optical component, wherein the master comprises, in addition, at least one protruding portion protruding from at least one of said first portions of said replication surfaces.

    Abstract translation: 本发明涉及诸如包括微透镜的模块的光学装置的晶片级制造。 在一个方面，通过提供其上存在多个前体光学结构的基板来制造诸如截头透镜的无源光学部件; 以及从所述多个前驱体光学结构中的每一个去除材料。 另一方面包括一种用于制造包括一组至少两个无源光学部件的装置的方法，所述方法包括以下步骤：使用通过进行制造具有复制表面的前体工具的步骤获得的工具; 以及通过从所述前体工具中去除材料来修饰所述复制表面。 另一方面包括一种用于制造包括一组至少两个无源光学部件的设备的方法，其中该方法包括使用包括复制表面的主设备的步骤，该复制表面包括针对每个所述无源光学部件的描述的第一部分 与相应的无源光学部件的至少一部分的形状相对应的形状，其中所述主机还包括从所述复制表面的所述第一部分中的至少一个突出的至少一个突出部分。

    Optical Module, in particular Opto-Electronic Module, and Method of Manufacturing the Same
    85.
    发明申请
    Optical Module, in particular Opto-Electronic Module, and Method of Manufacturing the Same 审中-公开
    光模块，特别是光电模块及其制造方法

    公开(公告)号：US20150204511A1

    公开(公告)日：2015-07-23

    申请号：US14413887

    申请日：2013-07-09

    Applicant: Heptagon Micro Optics Pte. Ltd.

    Inventor： Hartmut Rudmann ,  Markus Rossi

    IPC: F21V7/00 ,  F21V13/02 ,  G01J1/04 ,  G02B7/182 ,  G01J1/02

    CPC classification number: F21V7/0033 ,  F21V13/02 ,  G01J1/0271 ,  G01J1/0407 ,  G01J3/0205 ,  G01J3/0256 ,  G01J3/0262 ,  G01J3/0264 ,  G01J3/0291 ,  G01J3/1804 ,  G02B5/10 ,  G02B7/003 ,  G02B7/021 ,  G02B7/182 ,  G02B17/023 ,  G02B27/4244 ,  H01L27/14601 ,  H01L31/02325 ,  Y10T29/49826

    Abstract: The optical module (1) comprises—a first member (O) having a first face (F1) which is substantially planar;—a second member (P) having a second face (F2) facing the first face (F1), which is substantially planar and is aligned substantially parallel to the first face;—a third member (S) comprised in the first member (O) or comprised in the second member (P) or distinct from and located between these, which comprises an opening (4);—a mirror element (31′; 31′″) present on the second face (F2); and—an active optical component (26) present on the second face (F2) and electrically connected to the second member (P); wherein at least one of the first and second members comprises one or more transparent portions (t) through which light can pass. The method for manufacturing the optical module (1) comprises the steps of a) providing a first wafer; b) providing a second wafer on which the mirror elements (31′. . . ) are present; c) providing a third wafer, wherein the third wafer is comprised in the first wafer or is comprised in the second wafer or is distinct from these, and wherein the third wafer comprises openings (4); e) forming a wafer stack comprising these wafers; wherein at least one of the first wafer and the second wafer comprises transparent portions (t) through which light can pass.

    Abstract translation: 光学模块（1）包括：具有基本上平面的第一面（F1）的第一构件（O）; - 具有面向第一面（F1）的第二面（F2）的第二构件（P） 基本上平面且基本上平行于第一面排列; - 包括在第一构件（O）中或包含在第二构件（P）中或与之不同的第三构件（S），其包括开口（4） ）; - 存在于所述第二面（F2）上的镜子元件（31'; 31“）; 和存在于所述第二面（F2）上的电连接到所述第二构件（P）的有源光学部件（26）。 其中所述第一和第二构件中的至少一个包括光可以通过的一个或多个透明部分（t）。 制造光学模块（1）的方法包括以下步骤：a）提供第一晶片; b）提供其上存在镜子元件（31'）的第二晶片; c）提供第三晶片，其中所述第三晶片包括在所述第一晶片中或包含在所述第二晶片中或与所述第三晶片不同，并且其中所述第三晶片包括开口（4）; e）形成包括这些晶片的晶片堆叠; 其中所述第一晶片和所述第二晶片中的至少一个包括光可以通过的透明部分（t）。

    Testing of optical devices
    86.
    发明授权
    Testing of optical devices 有权
    光学器件测试

    公开(公告)号：US09013687B2

    公开(公告)日：2015-04-21

    申请号：US14220690

    申请日：2014-03-20

    Applicant: Heptagon Micro Optics Pte. Ltd.

    Inventor： Hartmut Rudmann ,  Matthias Gloor

    IPC: G01M1/00 ,  G01M11/00 ,  G01R31/28 ,  G01D18/00 ,  G01N21/55 ,  G01S17/02 ,  G01S7/497

    CPC classification number: G01M11/00 ,  G01D18/00 ,  G01N21/55 ,  G01R31/282 ,  G01S7/497 ,  G01S17/026

    Abstract: The present disclosure describes techniques for testing optical devices in a manner that, in some implementations, simulates the environment in which the devices will be used when they are integrated into the end-product or system. For example, one aspect includes providing a transparent sheet that is positioned near the optical device in a manner that simulates at least some aspects of the environment when the device is incorporated into the end-product or system. The testing can be performed, for example, while the optical devices are in production or at some other time prior to their being integrated into an end-product or system.

    Abstract translation: 本公开描述了以下方式测试光学设备的技术：在一些实现中，模拟当设备将被集成到终端产品或系统中时将被使用的环境。 例如，一个方面包括提供一种位于光学装置附近的透明片材，以便在该装置被结合到最终产品或系统中时模拟环境的至少一些方面。 例如，可以在光学装置正在生产中或在将其集成到最终产品或系统之前的某个其他时间进行测试。

    Opto-electronic module
    87.
    发明授权
    Opto-electronic module 有权
    光电模块

    公开(公告)号：US08975108B2

    公开(公告)日：2015-03-10

    申请号：US14303968

    申请日：2014-06-13

    Applicant: Heptagon Micro Optics Pte. Ltd.

    Inventor： Hartmut Rudmann ,  Alexander Bietsch ,  Susanne Westenhöfer ,  Simon Gubser

    IPC: H01L21/00 ,  H01L31/167 ,  H01L31/12 ,  G01S7/481 ,  H01L31/0232 ,  H01L31/173 ,  G01S17/02

    CPC classification number: H01L31/167 ,  G01S7/4813 ,  G01S17/026 ,  H01L31/02325 ,  H01L31/02327 ,  H01L31/12 ,  H01L31/173

    Abstract: An optical proximity sensor module includes a substrate, a light emitter mounted on a first surface of the substrate, the light emitter being operable to emit light at a first wavelength, and a light detector mounted on the first surface of the substrate, the light detector being operable to detect light at the first wavelength. The module includes an optics member disposed substantially parallel to the substrate, and a separation member disposed between the substrate and the optics member. The separation member may surround the light emitter and the light detector, and may include a wall portion that extends from the substrate to the optics member and that separates the light emitter and the light detector from one another. The separation member may be composed, for example, of a non-transparent polymer material containing a pigment, such as carbon black.

    Abstract translation: 光学接近传感器模块包括基板，安装在基板的第一表面上的光发射器，所述发光器可操作以发射第一波长的光;以及光检测器，安装在基板的第一表面上，光检测器 可操作以检测第一波长的光。 该模块包括基本上平行于基板设置的光学部件，以及设置在基板和光学部件之间的分离部件。 分离构件可以围绕光发射器和光检测器，并且可以包括从基板延伸到光学构件并将光发射器和光检测器彼此分离的壁部分。 分离构件可以由例如碳黑等含有颜料的不透明聚合物材料构成。

    METHOD FOR MANUFACTURING PASSIVE OPTICAL COMPONENTS, AND DEVICES COMPRISING THE SAME
    89.
    发明申请
    METHOD FOR MANUFACTURING PASSIVE OPTICAL COMPONENTS, AND DEVICES COMPRISING THE SAME 有权
    用于制造被动光学元件的方法，以及包括其的装置

    公开(公告)号：US20140347747A1

    公开(公告)日：2014-11-27

    申请号：US14288755

    申请日：2014-05-28

    Applicant: Heptagon Micro Optics Pte. Ltd.

    Inventor： Hartmut Rudmann ,  Susanne Westenhöfer ,  Bojan Tesanovic

    IPC: B29D11/00 ,  G02B3/00 ,  G02B13/00 ,  G02B5/20

    CPC classification number: G02B3/0031 ,  B29D11/00307 ,  B29D11/00375 ,  B29D11/0074 ,  B29D11/00932 ,  B29K2063/00 ,  B29L2011/00 ,  G02B3/00 ,  G02B5/20 ,  G02B13/0085 ,  H01L25/167 ,  H01L27/14618 ,  H01L27/14625 ,  H01L27/14685 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: A device comprises at least one optics member (O) comprising at least one transparent portion (t) and at least one blocking portion (b). The at least one transparent portion (t) is made of one or more materials substantially transparent for light of at least a specific spectral range, referred to as transparent materials, and the at least one blocking portion (b) is made of one or more materials substantially non-transparent for light of the specific spectral range, referred to as non-transparent materials. The transparent portion (t) comprises at least one passive optical component (L). The at least one passive optical component (L) comprises a transparent element (6) having two opposing approximately flat surfaces substantially perpendicular to a vertical direction in a distance approximately equal to a thickness of the at least one blocking portion (b) measured along the vertical direction, and, attached to the transparent element (6), at least one optical structure (5).

    Abstract translation: 一种装置包括至少一个包括至少一个透明部分（t）和至少一个阻挡部分（b）的光学元件（O）。 所述至少一个透明部分（t）由对于至少一个特定光谱范围的光基本上透明的一种或多种材料制成，称为透明材料，并且所述至少一个阻挡部分（b）由一个或多个 对于特定光谱范围的光而言，材料基本上不透明，被称为不透明材料。 透明部分（t）包括至少一个无源光学部件（L）。 所述至少一个无源光学部件（L）包括透明元件（6），所述透明元件（6）具有大致垂直于垂直方向的两个相对的大致平坦表面，所述近似平面大致等于所述至少一个阻挡部分（b）的厚度， 至少一个光学结构（5），连接到透明元件（6）。

    Opto-electronic module
    90.
    发明授权
    Opto-electronic module 有权
    光电模块

    公开(公告)号：US08791489B2

    公开(公告)日：2014-07-29

    申请号：US13827264

    申请日：2013-03-14

    Applicant: Heptagon Micro Optics Pte. Ltd.

    Inventor： Hartmut Rudmann ,  Alexander Bietsch ,  Susanne Westenhoefer ,  Simon Gubser

    IPC: H01L33/00 ,  H01L31/12

    CPC classification number: H01L31/167 ,  G01S7/4813 ,  G01S17/026 ,  H01L31/02325 ,  H01L31/02327 ,  H01L31/12 ,  H01L31/173

    Abstract: An optical proximity sensor module includes a substrate, a light emitter mounted on a first surface of the substrate, the light emitter being operable to emit light at a first wavelength, and a light detector mounted on the first surface of the substrate, the light detector being operable to detect light at the first wavelength. The module includes an optics member disposed substantially parallel to the substrate, and a separation member disposed between the substrate and the optics member. The separation member may surround the light emitter and the light detector, and may include a wall portion that extends from the substrate to the optics member and that separates the light emitter and the light detector from one another. The separation member may be composed, for example, of a non-transparent polymer material containing a pigment, such as carbon black.

    Abstract translation: 光学接近传感器模块包括基板，安装在基板的第一表面上的光发射器，该光发射器可操作以发射第一波长的光;以及光检测器，安装在基板的第一表面上，光检测器 可操作以检测第一波长的光。 该模块包括基本上平行于基板设置的光学部件，以及设置在基板和光学部件之间的分离部件。 分离构件可以围绕光发射器和光检测器，并且可以包括从基板延伸到光学构件并将光发射器和光检测器彼此分离的壁部分。 分离构件可以由例如碳黑等含有颜料的不透明聚合物材料构成。

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