公开(公告)号：US20250137920A1

公开(公告)日：2025-05-01

申请号：US18919048

申请日：2024-10-17

Applicant: KLA Corporation

Inventor： Amnon Manassen ,  Peter Paquet ,  Yingpin Wu ,  Fang-Jyun Yeh ,  Suryanarayanan Ganesan ,  Jordan Pio ,  Shankar Krishnan ,  Taher Kagalwala ,  Derrick A. Shaughnessy ,  Yan Zhang ,  Stilian Pandev ,  Min-Yeong Moon

IPC: G01N21/21 ,  G01N21/95

Abstract: A metrology system may include a spectroscopic metrology sub-system and a controller, the controller including one or more processors configured to execute program instructions configured to cause the one or more processors to: generate a tool-induced shift (TIS) model of a training sample by the metrology sub-system comprising: receiving training data from metrology measurements of the training sample, the training data comprising spectral data associated with at least one off-diagonal Mueller matrix element generated by one or more first measurements of the training sample at a first azimuthal angle and one or more second measurements of the training sample at a second azimuthal angle, deriving overlay spectra data and TIS spectra data from the training data, decomposing the overlay spectra data and the TIS spectra data, and inferring a TIS signature for the training sample; and to remove the TIS signature from a test sample.

公开(公告)号：US20250093786A1

公开(公告)日：2025-03-20

申请号：US18368795

申请日：2023-09-15

Applicant: KLA Corporation

Inventor： Yonatan Vaknin ,  Amnon Manassen ,  Andrew V. Hill

IPC: G03F7/00

Abstract: A measurement system may include an illumination source configured to generate one or more illumination beams and one or more objective lenses. One or more of the objective lenses may be configured as illumination objective lenses to direct illumination from the illumination source to one or more targets on a sample. One or more of the objective lenses may be configured as collection objective lenses, where each of the collection objective lenses is configured to collect a selected diffraction order of the illumination from the sample. The system may further include one or more detectors, each configured to image the sample based on at least one of the selected diffraction orders from at least one of the collection objective lenses and a controller to generate measurements of the one or more targets on the sample based on one or more images from the detectors.

公开(公告)号：US12222199B2

公开(公告)日：2025-02-11

申请号：US17254253

申请日：2020-11-05

Applicant: KLA Corporation

Inventor： Roie Volkovich ,  Nachshon Rothman ,  Yossi Simon ,  Anna Golotsvan ,  Vladimir Levinski ,  Nireekshan K. Reddy ,  Amnon Manassen ,  Daria Negri ,  Yuri Paskover

IPC: G01B11/27 ,  H01L21/66 ,  H01L21/68 ,  G03F7/00

Abstract: A system for use with a misregistration metrology tool (MMT), the system including a database including a plurality of process variation (PV) categories and a corresponding plurality of parameter sets and a process variation accommodation engine (PVAE) including a measurement site process variation category associator (MSPVCA) operative to associate a measurement site being measured by the MMT, at least partially based on an MMT output relating to the measurement site, with a measurement site process variation category (MSPVC), the MSPVC being one of the plurality of PV categories, a measurement site parameter set retriever (MSPSR) operative to retrieve a measurement site parameter set (MSPS) corresponding to the MSPVC and a measurement site parameter set communicator (MSPSC) operative to communicate the MSPS to the MMT.

公开(公告)号：US12170215B2

公开(公告)日：2024-12-17

申请号：US16762107

申请日：2020-04-05

Applicant: KLA Corporation

Inventor： Vladimir Levinski ,  Daria Negri ,  Amnon Manassen

IPC: H01L21/67 ,  H01L21/66

Abstract: A method for correcting misregistration measurements of a semiconductor wafer for errors therein arising from tilt of the wafer including measuring, for at least one location on a wafer, a difference between a Tool Induced Shift (TIS) of a metrology device in a first illumination arrangement with respect to the wafer wherein a surface of the wafer is generally orthogonally illuminated by an illumination source of the metrology device and a TIS of the metrology device in a second illumination arrangement with respect to the wafer, wherein the surface is obliquely illuminated by the illumination source, and correcting a misregistration measurement measured by the metrology device at the at least one location for errors therein arising from tilt of the wafer at the location by subtracting from the misregistration measurement a weighted value of the difference between the TIS in the first and second illumination arrangements.

公开(公告)号：US12131959B2

公开(公告)日：2024-10-29

申请号：US17469280

申请日：2021-09-08

Applicant: KLA Corporation

Inventor： Liran Yerushalmi ,  Daria Negri ,  Ohad Bachar ,  Yossi Simon ,  Amnon Manassen ,  Nir Ben David ,  Yoram Uziel ,  Etay Lavert

IPC: H01L21/66 ,  G05B19/418

CPC classification number: H01L22/12 ,  G05B19/41875 ,  G05B2219/45031

Abstract: A system and method for generating a quality parameter value of a semiconductor device wafer (SDW), during fabrication thereof, the method including designating a plurality of measurement site sets (MSSs) on the SDW, each of the MSSs including a first measurement-orientation site (FMS) and a second measurement-orientation site (SMS), the FMS and the SMS being different measurement sites on the SDW, generating a first measurement-orientation quality parameter dataset (FMQPD) by measuring features formed within each the FMS of at least one of the MSSs in a first measurement orientation, generating a second measurement-orientation quality parameter dataset (SMQPD) by measuring features formed within each the SMS of the at least one of the MSSs in a second measurement orientation and generating at least one tool-induced-shift (TIS)-ameliorated quality parameter value (TAQPV), at least partially based on the FMQPD and the SMQPD.

公开(公告)号：US11921825B2

公开(公告)日：2024-03-05

申请号：US18097438

申请日：2023-01-16

Applicant: KLA Corporation

Inventor： Etay Lavert ,  Amnon Manassen ,  Yossi Simon ,  Dimitry Sanko ,  Avner Safrani

IPC: G06N20/00 ,  G06F3/0481 ,  G06F18/214 ,  G06F18/24 ,  G06F18/40 ,  G06N5/04 ,  G06T11/00

CPC classification number: G06F18/40 ,  G06F3/0481 ,  G06F18/214 ,  G06F18/24 ,  G06N5/04 ,  G06N20/00 ,  G06T11/00 ,  G06T2200/24

Abstract: A metrology system includes one or more through-focus imaging metrology sub-systems communicatively coupled to a controller having one or more processors configured to receive a plurality of training images captured at one or more focal positions. The one or more processors may generate a machine learning classifier based on the plurality of training images. The one or more processors may receive one or more target feature selections for one or more target overlay measurements corresponding to one or more target features. The one or more processors may determine one or more target focal positions based on the one or more target feature selections using the machine learning classifier. The one or more processors may receive one or more target images captured at the one or more target focal positions, the target images including the one or more target features of the target specimen, and determine overlay based thereon.

公开(公告)号：US20240035810A1

公开(公告)日：2024-02-01

申请号：US17878415

申请日：2022-08-01

Applicant: KLA Corporation

Inventor： Amnon Manassen ,  Yoav Grauer ,  Shlomo Eisenbach ,  Stephen Hiebert ,  Avner Safrani ,  Roel Gronheid

IPC: G01B11/24 ,  G01B17/06 ,  G01B11/06 ,  G01N21/95

CPC classification number: G01B11/2441 ,  G01B17/06 ,  G01B11/0608 ,  G01N21/9505

Abstract: Systems and methods for generating volumetric data are disclosed. Such systems and methods may include scanning a sample at a plurality of focal planes located along a depth direction of the sample. Such systems and methods may include generating, via a detector of a metrology sub-system, a plurality of images of a volumetric field of view of the sample at the plurality of focal planes. Such systems and methods may include aggregating the plurality of images to generate volumetric data of the volumetric field of view of the sample. The metrology sub-system may include a Linnik interferometer.

公开(公告)号：US11880141B2

公开(公告)日：2024-01-23

申请号：US17673131

申请日：2022-02-16

Applicant: KLA CORPORATION

Inventor： Daria Negri ,  Amnon Manassen ,  Gilad Laredo

IPC: G03F7/20 ,  G03F7/00 ,  G06T7/00

CPC classification number: G03F7/70633 ,  G03F7/70641 ,  G03F7/70683 ,  G06T7/0004 ,  G06T2207/30148

Abstract: A method of measuring misregistration in the manufacture of semiconductor device wafers including providing a multilayered semiconductor device wafer including at least a first layer and a second layer including at least one misregistration measurement target including a first periodic structure formed together with the first layer having a first pitch and a second periodic structure formed together with the second layer having a second pitch, imaging the first layer and the second layer at a depth of focus and using light having at least one first wavelength that causes images of both the first layer and the second layer to appear in at least one plane within the depth of focus and quantifying offset in the at least one plane between the images of the first layer and the second layer, thereby to calculate misregistration of the first layer and the second layer.

公开(公告)号：US20230359129A1

公开(公告)日：2023-11-09

申请号：US17210793

申请日：2021-03-24

Applicant: KLA Corporation

Inventor： Jonathan Madsen ,  Andrei V. Shchegrov ,  Amnon Manassen ,  Andrew V. Hill ,  Yossi Simon ,  Gilad Laredo ,  Yoram Uziel

IPC: G03F7/20 ,  H01J37/304 ,  G03F9/00 ,  H01J37/317

CPC classification number: G03F7/70633 ,  H01J37/3045 ,  G03F9/7084 ,  H01J37/3177 ,  H01J2237/31764

Abstract: A multi-column metrology tool may include two or more measurement columns distributed along a column direction, where the two or more measurement columns simultaneously probe two or more measurement regions on a sample including metrology targets. A measurement column may include an illumination sub-system to direct illumination to the sample, a collection sub-system including a collection lens to collect measurement signals from the sample and direct it to one or more detectors, and a column-positioning sub-system to adjust a position of the collection lens. A measurement region of a measurement column may be defined by a field of view of the collection lens and a range of the positioning system in the lateral plane. The tool may further include a sample-positioning sub-system to scan the sample along a scan path different than the column direction to position metrology targets within the measurement regions of the measurement columns for measurements.

公开(公告)号：US11800212B1

公开(公告)日：2023-10-24

申请号：US17716757

申请日：2022-04-08

Applicant: KLA Corporation

Inventor： Yonatan Vaknin ,  Andrew V. Hill ,  Amnon Manassen

IPC: H04N23/56 ,  G03F7/00 ,  G01N21/956

CPC classification number: H04N23/56 ,  G01N21/956 ,  G03F7/70633 ,  G03F7/70653 ,  G03F7/706849 ,  G03F7/706851

Abstract: An optical metrology system may include an overlay metrology tool for characterizing an overlay target on a sample, where the overlay target includes first-direction periodic features in a first set of layers of the sample, and second-direction periodic features in a second set of layers of the sample. The overlay metrology tool may simultaneously illuminate the overlay target with first illumination beams and second illumination beams and may further generate images of the overlay target based on diffraction of the first illumination beams and the second illumination beams by the overlay target, where diffraction orders of the first illumination beams contribute to resolved image formation of only the first-direction periodic features, and where diffraction orders of the second illumination beams contribute to resolved image formation of only the second-direction periodic features. The system may further generate overlay measurements along the first and second measurement directions based on the images.