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公开(公告)号：US11556738B2
公开(公告)日：2023-01-17
申请号：US17060372
申请日：2020-10-01
Applicant: KLA Corporation
Inventor： Etay Lavert , Amnon Manassen , Yossi Simon , Dimitry Sanko , Avner Safrani
IPC: G06N20/00 , G06N5/04 , G06K9/62 , G06F3/0481 , G06T11/00
Abstract: A metrology system includes one or more through-focus imaging metrology sub-systems communicatively coupled to a controller having one or more processors configured to receive a plurality of training images captured at one or more focal positions. The one or more processors may generate a machine learning classifier based on the plurality of training images. The one or more processors may receive one or more target feature selections for one or more target overlay measurements corresponding to one or more target features. The one or more processors may determine one or more target focal positions based on the one or more target feature selections using the machine learning classifier. The one or more processors may receive one or more target images captured at the one or more target focal positions, the target images including the one or more target features of the target specimen, and determine overlay based thereon.
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公开(公告)号：US20220357673A1
公开(公告)日：2022-11-10
申请号：US17488010
申请日：2021-09-28
Applicant: KLA Corporation
Inventor： Stilian Pandev , Min-Yeong Moon , Andrei V. Shchegrov , Jonathan Madsen , Dimitry Sanko , Liran Yerushalmi , Alexander Kuznetsov , Mahendra Dubey
IPC: G03F7/20
Abstract: A self-calibrating overlay metrology system may receive device overlay data from device targets on a sample, determine preliminary device overlay measurements for the device targets including device-scale features using an overlay recipe with the device overlay data as inputs, receive assist overlay data from sets of assist targets on the sample including device-scale features, where a particular set of assist targets includes one or more target pairs formed with two overlay targets having programmed overlay offsets of a selected value with opposite signs along a particular measurement direction. The system may further determine self-calibrating assist overlay measurements for the sets of assist targets based on the assist overlay data, where the self-calibrating assist overlay measurements are linearly proportional to overlay on the sample, and generate corrected overlay measurements for the device targets by adjusting the preliminary device overlay measurements based on the self-calibrating assist overlay measurements.
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公开(公告)号：US11880142B2
公开(公告)日：2024-01-23
申请号：US18118420
申请日：2023-03-07
Applicant: KLA Corporation
Inventor： Stilian Pandev , Min-Yeong Moon , Andrei V. Shchegrov , Jonathan Madsen , Dimitry Sanko , Liran Yerushalmi , Alexander Kuznetsov , Mahendra Dubey
IPC: G03F7/00
CPC classification number: G03F7/70633 , G03F7/70516 , G03F7/70775
Abstract: A self-calibrating overlay metrology system may receive device overlay data for a device targets on a sample from an overlay metrology tool, determine preliminary device overlay measurements for the device targets including device-scale features using an overlay recipe with the device overlay data as inputs, receive assist overlay data for one or more assist targets on the sample including device-scale features from the overlay metrology tool, where at least one of the one or more assist targets has a programmed overlay offset of a selected value along a particular measurement direction, determine self-calibrating assist overlay measurements for the one or more assist targets based on the assist overlay data, where the self-calibrating assist overlay measurements are linearly proportional to overlay on the sample, and generate corrected overlay measurements for the device targets by adjusting the preliminary device overlay measurements based on the self-calibrating assist overlay measurements.
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公开(公告)号：US20230221656A1
公开(公告)日：2023-07-13
申请号：US18118420
申请日：2023-03-07
Applicant: KLA Corporation
Inventor： Stilian Pandev , Min-Yeong Moon , Andrei V. Shchegrov , Jonathan Madsen , Dimitry Sanko , Liran Yerushalmi , Alexander Kuznetsov , Mahendra Dubey
IPC: G03F7/20
CPC classification number: G03F7/70633 , G03F7/70516 , G03F7/70775
Abstract: A self-calibrating overlay metrology system may receive device overlay data for a device targets on a sample from an overlay metrology tool, determine preliminary device overlay measurements for the device targets including device-scale features using an overlay recipe with the device overlay data as inputs, receive assist overlay data for one or more assist targets on the sample including device-scale features from the overlay metrology tool, where at least one of the one or more assist targets has a programmed overlay offset of a selected value along a particular measurement direction, determine self-calibrating assist overlay measurements for the one or more assist targets based on the assist overlay data, where the self-calibrating assist overlay measurements are linearly proportional to overlay on the sample, and generate corrected overlay measurements for the device targets by adjusting the preliminary device overlay measurements based on the self-calibrating assist overlay measurements.
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5.发明公开公开(公告)号：US20240020353A1
公开(公告)日：2024-01-18
申请号：US18097438
申请日：2023-01-16
Applicant: KLA Corporation
Inventor： Etay Lavert , Amnon Manassen , Yossi Simon , Dimitry Sanko , Avner Safrani
IPC: G06F18/40 , G06F3/0481 , G06T11/00 , G06N20/00 , G06N5/04 , G06F18/24 , G06F18/214
CPC classification number: G06F18/40 , G06F3/0481 , G06T11/00 , G06N20/00 , G06N5/04 , G06F18/24 , G06F18/214 , G06T2200/24
Abstract: A metrology system includes one or more through-focus imaging metrology sub-systems communicatively coupled to a controller, where the controller includes one or more processors. The one or more processors may be configured receive a plurality of training images captured at one or more focal positions. The one or more processors may further generate a machine learning classifier based on the plurality of training images captured at one or more focal positions. The one or more processors may further receive one or more target feature selections for one or more target overlay measurements corresponding to one or more target features of a target specimen. The one or more processors may further determine one or more target focal positions based on the one or more target feature selections using the machine learning classifier. The one or more processors may further receive one or more target images captured at the one or more target focal positions, the one or more target images including the one or more target features of the target specimen. The one or more processors may further determine one or more overlay measurements based on the one or more target images.
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Patent Agency Ranking
公开(公告)号：US20220412734A1
公开(公告)日：2022-12-29
申请号：US17473742
申请日：2021-09-13
Applicant: KLA Corporation
Inventor： Stilian Pandev , Min-Yeong Moon , Andrei V. Shchegrov , Jonathan Madsen , Dimitry Sanko , Liran Yerushalmi , Alexander Kuznetsov , Mahendra Dubey
IPC: G01B21/24
Abstract: An overlay metrology system may receive overlay data for in-die overlay targets within various fields on a skew training sample from one or more overlay metrology tools, wherein the in-die overlay targets within the fields have a range programmed overlay offsets, wherein the fields are fabricated with a range of programmed skew offsets. The system may further generate asymmetric target signals for the in-die overlay targets using an asymmetric function providing a value of zero when physical overlay is zero and a sign indicative of a direction of physical overlay. The system may further generate corrected overlay offsets for the in-die overlay targets on the asymmetric target signals, generate self-calibrated overlay offsets for the in-die overlay targets based on the programmed overlay offsets and the corrected overlay offsets, generate a trained overlay recipe, and generate overlay measurements for in-die overlay targets on additional samples using the trained overlay recipe.
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公开(公告)号：US20220108128A1
公开(公告)日：2022-04-07
申请号：US17060372
申请日：2020-10-01
Applicant: KLA Corporation
Inventor： Etay Lavert , Amnon Manassen , Yossi Simon , Dimitry Sanko , Avner Safrani
IPC: G06K9/62 , G06F3/0481 , G06T11/00 , G06N20/00 , G06N5/04
Abstract: A metrology system includes one or more through-focus imaging metrology sub-systems communicatively coupled to a controller having one or more processors configured receive a plurality of training images captured at one or more focal positions. The one or more processors may generate a machine learning classifier based on the plurality of training images. The one or more processors may receive one or more target feature selections for one or more target overlay measurements corresponding to one or more target features. The one or more processors may determine one or more target focal positions based on the one or more target feature selections using the machine learning classifier. The one or more processors may receive one or more target images captured at the one or more target focal positions, the target images including the one or more target features of the target specimen, and determine overlay based thereon.
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8.发明申请公开(公告)号：US20250146961A1
公开(公告)日：2025-05-08
申请号：US18430350
申请日：2024-02-01
Applicant: KLA Corporation
Inventor： Daniel James Haxton , Christopher Liman , InKyo Kim , Boxue Chen , Hyowon Park , Thaddeus Gerard Dziura , Nakyoon Kim , Houssam Chouaib , Anderson Chou , Dimitry Sanko
Abstract: Methods and systems for determining random variation in one or more structures on a specimen are provided. One method includes determining characteristic(s) of output generated by an output acquisition subsystem for structure(s) formed on a specimen and simulating the characteristic(s) of the output with initial parameter values for the structure(s). The method also includes determining parameter values of the structure(s) formed on the specimen as the initial parameter values that resulted in the simulated characteristic(s) that best match the determined characteristic(s). The determined parameter values are responsive to random variation in parameter(s) of the structure(s) on the specimen.
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公开(公告)号：US12181271B2
公开(公告)日：2024-12-31
申请号：US17674809
申请日：2022-02-17
Applicant: KLA CORPORATION
Inventor： Min-Yeong Moon , Stilian Pandev , Dimitry Sanko
Abstract: A metrology module includes an estimation model that is configured to provide an estimation of independent overlay with tool induced shift on received wafers based on only one azimuth angle spectra. The estimation model can use at least one machine learning algorithm. The estimation model can be derived by the machine learning algorithm applied to calculated training data based on a first training sample set from initial metrology measurements and an additional tool induced shift training sample.
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公开(公告)号：US11921825B2
公开(公告)日：2024-03-05
申请号：US18097438
申请日：2023-01-16
Applicant: KLA Corporation
Inventor： Etay Lavert , Amnon Manassen , Yossi Simon , Dimitry Sanko , Avner Safrani
IPC: G06N20/00 , G06F3/0481 , G06F18/214 , G06F18/24 , G06F18/40 , G06N5/04 , G06T11/00
CPC classification number: G06F18/40 , G06F3/0481 , G06F18/214 , G06F18/24 , G06N5/04 , G06N20/00 , G06T11/00 , G06T2200/24
Abstract: A metrology system includes one or more through-focus imaging metrology sub-systems communicatively coupled to a controller having one or more processors configured to receive a plurality of training images captured at one or more focal positions. The one or more processors may generate a machine learning classifier based on the plurality of training images. The one or more processors may receive one or more target feature selections for one or more target overlay measurements corresponding to one or more target features. The one or more processors may determine one or more target focal positions based on the one or more target feature selections using the machine learning classifier. The one or more processors may receive one or more target images captured at the one or more target focal positions, the target images including the one or more target features of the target specimen, and determine overlay based thereon.
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