公开(公告)号：US20100055840A1

公开(公告)日：2010-03-04

申请号：US12230531

申请日：2008-08-29

申请人： Chung-Er Huang ,  Ming-Tai Kuo

发明人： Chung-Er Huang ,  Ming-Tai Kuo

IPC分类号： H01L21/50 ,  H01L23/48

CPC分类号： H05K1/144 ,  H01L23/49805 ,  H01L2924/0002 ,  H05K1/187 ,  H05K3/284 ,  H05K3/3442 ,  H05K3/403 ,  H05K2203/1316 ,  H01L2924/00

摘要： A packaging structure includes a main substrate having a plurality of circuit lines thereon, and an electronic module having at least one conductive pad at the bottom thereof and having a plurality of conductive lines on the sides thereof. The pad and the conductive circuits are connected electrically to the circuits on the main substrate when the electronic module is disposed on the main substrate. As above-mentioned, one electronic module can be stacked on top of another so that the integrity of the packaging structure is improved.

公开(公告)号：US20090290317A1

公开(公告)日：2009-11-26

申请号：US12468899

申请日：2009-05-20

申请人： Naohiro MASHINO

发明人： Naohiro MASHINO

IPC分类号： H05K7/06 ,  H05K1/18 ,  H05K3/30

CPC分类号： H01L24/16 ,  H01L21/6835 ,  H01L23/145 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49833 ,  H01L23/50 ,  H01L2221/68345 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/19041 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3511 ,  H05K1/0231 ,  H05K1/187 ,  H05K3/205 ,  H05K3/28 ,  H05K3/3473 ,  H05K3/4602 ,  H05K3/4644 ,  H05K2201/0187 ,  H05K2201/09563 ,  H05K2201/10522 ,  H05K2201/10636 ,  Y02P70/611 ,  Y10T29/4913 ,  H01L2224/05599

摘要： A printed circuit board has capacitors, a grounding wiring pattern having a bonding surface on which a semiconductor device is bonded, and a contact surface located opposite from the bonding surface thereof and coupled to first electrodes of the capacitors, and a power supply wiring pattern having a bonding surface on which the semiconductor device is bonded, and a contact surface located opposite from the bonding surface thereof and coupled to second electrodes of the capacitors. The grounding and power supply wiring patterns are alternately arranged in a predetermined direction, and the capacitors are coupled in parallel with respect to the grounding and power supply wiring patterns.

摘要翻译： 印刷电路板具有电容器，具有接合半导体器件的接合面的接地布线图案和与其接合面相对的接触面，并与电容器的第一电极连接，电源布线图形具有 其上结合有半导体器件的接合表面和与其接合表面相对的接触表面，并且连接到电容器的第二电极。 接地和电源布线图案沿预定方向交替布置，并且电容器相对于接地和电源布线图案并联耦合。

公开(公告)号：US20090273910A1

公开(公告)日：2009-11-05

申请号：US12434950

申请日：2009-05-04

申请人： Jurgen Wolf ,  Kai Zoschke ,  Thorsten Fischer ,  Michael Topper ,  Herbert Reichl

发明人： Jurgen Wolf ,  Kai Zoschke ,  Thorsten Fischer ,  Michael Topper ,  Herbert Reichl

IPC分类号： H05K1/18 ,  H05K3/30

CPC分类号： H05K1/187 ,  H01L21/6835 ,  H01L23/49816 ,  H01L23/5387 ,  H01L23/5389 ,  H01L24/24 ,  H01L24/82 ,  H01L2221/68345 ,  H01L2224/24226 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01057 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/15331 ,  H01L2924/351 ,  H05K3/20 ,  H05K3/4644 ,  H05K2201/10674 ,  H05K2203/016 ,  Y10T29/4913 ,  H01L2924/00

摘要： The present invention relates to a functional unit, containing at least one active or passive electronic component, the functional unit being surrounded by at least one flexible dielectric layer and, on the outer side of the functional unit, contacts are provided for contacting the electrical components for further mounting.

摘要翻译： 本发明涉及一种功能单元，其包含至少一个有源或无源电子部件，所述功能单元被至少一个柔性电介质层包围，并且在所述功能单元的外侧设置有用于接触所述电气部件 进一步安装。

公开(公告)号：US07608477B2

公开(公告)日：2009-10-27

申请号：US10560223

申请日：2004-03-26

申请人： Haruhiko Ikeda

发明人： Haruhiko Ikeda

IPC分类号： H01L21/00

CPC分类号： H05K1/187 ,  H01L2924/3511 ,  H05K1/186 ,  H05K3/20 ,  H05K3/4652

摘要： In a process for producing the component-embedded substrate, a first electronic component is connected and fixed onto a first electrode pattern with a conductive bonding material, the first electrode pattern being provided on a first supporting layer. A second supporting layer including a second electrode pattern is press-bonded onto the electronic component-fixed surface of the first supporting layer with a first prepreg therebetween to perform transfer. Then, the first supporting layer and the second supporting layer are separated from the first prepreg. After separation, the first prepreg is cured. A second electronic component is connected and fixed onto the back surface of the second electrode pattern with a conductive bonding material. A third supporting layer including a third electrode pattern is press-bonded onto the second electronic component-fixed surface with a second prepreg therebetween to perform transfer. Then, the third supporting layer is separated from the second prepreg, and the second prepreg is cured. In this manner, the prepregs and electrode patterns are sequentially laminated, thereby reducing the connection resistance between laminated electrode patterns or between an electrode pattern and an electronic component.

摘要翻译： 在制造部件嵌入式基板的工序中，将第一电子部件用导电性接合材料连接固定在第一电极图案上，第一电极图案设置在第一支撑层上。 包括第二电极图案的第二支撑层被压接在第一支撑层的电子部件固定表面上，其间具有第一预浸料以进行转移。 然后，第一支撑层和第二支撑层与第一预浸料坯分离。 分离后，第一个预浸料固化。 第二电子部件用导电接合材料连接固定在第二电极图案的背面上。 包括第三电极图案的第三支撑层被压接在第二电子部件固定表面上，其间具有第二预浸料以进行转印。 然后，第三支撑层与第二预浸料坯分离，第二预浸料固化。 以这种方式，预浸料和电极图案顺序层叠，从而降低层压电极图案之间或电极图案与电子部件之间的连接电阻。

公开(公告)号：US20090242255A1

公开(公告)日：2009-10-01

申请号：US12369115

申请日：2009-02-11

申请人： Hirotaka TANIGUCHI ,  Toshiki Furutani ,  Takeshi Furusawa ,  Takashi Kariya

发明人： Hirotaka TANIGUCHI ,  Toshiki Furutani ,  Takeshi Furusawa ,  Takashi Kariya

IPC分类号： H05K1/16 ,  H01R43/00

CPC分类号： H05K1/187 ,  H01L21/563 ,  H01L21/568 ,  H01L23/3107 ,  H01L23/3135 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81193 ,  H01L2224/83104 ,  H01L2224/92125 ,  H01L2924/01004 ,  H01L2924/01078 ,  H01L2924/01079 ,  H05K3/205 ,  H05K3/428 ,  H05K3/4602 ,  H05K3/4652 ,  H05K2201/10674 ,  H05K2203/063 ,  Y10T29/4913 ,  Y10T29/49133 ,  Y10T29/49139 ,  Y10T29/49146 ,  Y10T29/49147 ,  Y10T29/49155 ,  Y10T29/49169 ,  H01L2924/00012 ,  H01L2924/00

摘要： A method of manufacturing a wiring board with a built-in electronic component includes providing a first base material comprising a support body and a first metal foil detachably adhered on the support body, forming a connection terminal for mounting an electronic component on the first metal foil of the first base material by an additive method, electrically connecting an electronic component and the connection terminal by arranging the electronic component on the first base material such that a surface of the electronic component on which a circuit is formed faces a surface on which the connection terminal is formed, covering the electronic component with an insulative material after the mounting, and detaching the support body and the first metal foil.

摘要翻译： 制造具有内置电子部件的布线基板的方法包括：提供包括支撑体的第一基材和可拆卸地粘附在所述支撑体上的第一金属箔，形成用于将电子部件安装在所述第一金属箔上的连接端子 的第一基材的第一基材的表面，通过将电子部件布置在第一基材上，使得电子部件的形成有电路的表面面对连接到第一基材的表面， 端子形成，在安装之后用绝缘材料覆盖电子部件，并且分离支撑体和第一金属箔。

公开(公告)号：US20090170241A1

公开(公告)日：2009-07-02

申请号：US11964397

申请日：2007-12-26

申请人： Il Kwon Shim ,  Yaojian Lin ,  Seng Guan Chow

发明人： Il Kwon Shim ,  Yaojian Lin ,  Seng Guan Chow

IPC分类号： H01L21/56

CPC分类号： H05K1/185 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/3128 ,  H01L24/16 ,  H01L24/19 ,  H01L24/48 ,  H01L24/73 ,  H01L24/96 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/16225 ,  H01L2224/24137 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/82039 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19107 ,  H01L2924/30105 ,  H01L2924/3025 ,  H01L2924/351 ,  H05K1/187 ,  H05K3/205 ,  H05K3/4644 ,  H05K2201/10674 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor device is made by forming contact pads on a sacrificial carrier. The contact pads may be formed on a pillar. A semiconductor die is mounted to electrically connect to the contact pads with solder bumps or wire bonds. The semiconductor die is encapsulated with molding compound. The sacrificial carrier is removed. A backside interconnect structure has a first conductive layer formed over the molding compound to electrically connect to the contact pads. A first insulating layer is formed over the first conductive layer. A portion of the first insulating layer is removed to expose the first conductive layer. Solder material is deposited in electrical contact with the first conductive layer. The solder material is reflowed to form a solder bump. A wire bond electrically connects to a contact pad. A front-side interconnect structure can be formed through the molding compound to the contact pads.

摘要翻译： 通过在牺牲载体上形成接触垫来制造半导体器件。 接触垫可以形成在支柱上。 半导体管芯被安装成用焊料凸块或引线接合电连接到接触焊盘。 半导体管芯用模塑料封装。 牺牲载体被去除。 背面互连结构具有形成在模制化合物上的第一导电层以电连接到接触焊盘。 第一绝缘层形成在第一导电层上。 去除第一绝缘层的一部分以露出第一导电层。 焊料与第一导电层电接触沉积。 焊料材料被回流以形成焊料凸块。 导线键合电连接到接触垫。 可以通过模制化合物将前侧互连结构形成到接触垫。

公开(公告)号：US07488895B2

公开(公告)日：2009-02-10

申请号：US10573717

申请日：2004-09-27

申请人： Yoshitake Hayashi ,  Masayoshi Koyama ,  Satoru Yuhaku ,  Kazuo Otani ,  Susumu Matsuoka ,  Yasushi Taniguchi ,  Seiichi Nakatani

发明人： Yoshitake Hayashi ,  Masayoshi Koyama ,  Satoru Yuhaku ,  Kazuo Otani ,  Susumu Matsuoka ,  Yasushi Taniguchi ,  Seiichi Nakatani

IPC分类号： H05K1/03

CPC分类号： H01L23/5389 ,  H01L21/4857 ,  H01L23/49833 ,  H01L23/5385 ,  H01L25/0657 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06551 ,  H01L2225/06555 ,  H01L2225/06572 ,  H01L2225/06582 ,  H01L2924/0002 ,  H05K1/186 ,  H05K1/187 ,  H05K3/20 ,  H05K3/4069 ,  H05K3/4614 ,  H05K3/462 ,  H05K2201/10378 ,  H05K2203/0191 ,  Y10T29/49165 ,  H01L2924/00

摘要： A component built-in module of the present invention includes: a first wiring pattern; an electronic component mounted on the first wiring pattern; a second wiring pattern; an electrical insulating sheet with the electrical component built therein, the electrical insulating sheet being disposed between the first wiring pattern and the second wiring pattern; and a via conductor formed in a via hole penetrating through the electrical insulating sheet, the via conductor connecting electrically the first wiring pattern and the second wiring pattern. A side face of the via conductor defines a continuous line in an axis direction of the via conductor. Thus, a component built-in module having excellent reliability concerning electrical connection can be provided.

摘要翻译： 本发明的组件内置模块包括：第一布线图案; 安装在所述第一布线图案上的电子部件; 第二布线图案; 电气绝缘片，其中内置有电气部件，电绝缘片设置在第一布线图案和第二布线图案之间; 以及形成在穿过所述电绝缘片的通孔中的通孔导体，所述通孔导体电连接所述第一布线图案和所述第二布线图案。 通孔导体的侧面在通孔导体的轴线方向上形成连续的线。 因此，可以提供具有优异的电连接可靠性的组件内置模块。

公开(公告)号：US20080298023A1

公开(公告)日：2008-12-04

申请号：US12127123

申请日：2008-05-27

申请人： Rikiya Okimoto ,  Tsukasa Shiraishi ,  Yukihiro Ishimaru ,  Toshiyuki Kojima

发明人： Rikiya Okimoto ,  Tsukasa Shiraishi ,  Yukihiro Ishimaru ,  Toshiyuki Kojima

IPC分类号： H05K7/20 ,  H05K3/30

CPC分类号： H05K1/183 ,  H01L2224/0554 ,  H01L2224/05548 ,  H01L2224/05573 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/16251 ,  H01L2924/19105 ,  H05K1/186 ,  H05K1/187 ,  H05K3/20 ,  H05K3/4614 ,  H05K2201/0394 ,  H05K2201/10378 ,  H05K2201/10454 ,  H05K2203/063 ,  Y10T29/49137 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： An electronic component-containing module includes an electrically insulating substrate; and a first electronic component and second electronic component embedded in the electrically insulating substrate, wherein the first electronic component protrudes partially from at least one surface of the electrically insulating substrate, and the second electronic component is contained in the electrically insulating substrate.

摘要翻译： 含电子元件的模块包括电绝缘基板; 以及嵌入在所述电绝缘基板中的第一电子部件和第二电子部件，其中，所述第一电子部件从所述电绝缘基板的至少一个表面部分突出，并且所述第二电子部件容纳在所述电绝缘基板中。

公开(公告)号：US20080196930A1

公开(公告)日：2008-08-21

申请号：US11917711

申请日：2006-06-15

申请人： Risto Tuominen ,  Antti Iihola ,  Petteri Palm

发明人： Risto Tuominen ,  Antti Iihola ,  Petteri Palm

IPC分类号： H05K1/16 ,  H05K1/00 ,  H05K1/11 ,  H05K3/42 ,  H05K3/46

CPC分类号： H01L23/5389 ,  H01L24/19 ,  H01L24/24 ,  H01L24/82 ,  H01L2224/04105 ,  H01L2224/32245 ,  H01L2224/82039 ,  H01L2224/82047 ,  H01L2224/83005 ,  H01L2224/83192 ,  H01L2224/92144 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/1461 ,  H05K1/183 ,  H05K1/186 ,  H05K1/187 ,  H05K3/0017 ,  H05K3/20 ,  H05K3/321 ,  H05K3/4069 ,  H05K3/423 ,  H05K2201/0394 ,  H05K2201/0969 ,  H05K2201/10674 ,  H05K2203/0554 ,  H05K2203/0733 ,  H05K2203/1438 ,  Y10T29/49124 ,  Y10T29/4913 ,  Y10T29/49146 ,  Y10T29/49158 ,  H01L2924/00

摘要： This publication discloses a method for manufacturing a circuit-board structure. According to the method, a conductor pattern (13) is made, and contact openings are made in it for a component's (16) electrical contacts. After this, the component (16) is attached relative to the conductor pattern (13), in such a way that the contact areas or contact bumps of the component lie next to the contact openings. After this, an electrically conductive material is introduced to the contact openings, in order to form electrical contacts between the conductor pattern (13) and the component (16).

摘要翻译： 该出版物公开了一种制造电路板结构的方法。 根据该方法，制造导体图案（13），并且在其中形成用于组件（16）电触点的接触开口。 之后，组件（16）相对于导体图案（13）被附接，使得部件的接触区域或接触凸块靠近接触开口。 之后，将导电材料引入到接触开口中，以便在导体图案（13）和部件（16）之间形成电接触。

公开(公告)号：US20080142255A1

公开(公告)日：2008-06-19

申请号：US12033455

申请日：2008-02-19

申请人： Yasushi Inagaki ,  Motoo Asai ,  Dongdong Wang ,  Hideo Yabashi ,  Seiji Shirai

发明人： Yasushi Inagaki ,  Motoo Asai ,  Dongdong Wang ,  Hideo Yabashi ,  Seiji Shirai

IPC分类号： H05K1/16

CPC分类号： H05K1/181 ,  H01L21/4857 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/50 ,  H01L23/642 ,  H01L23/645 ,  H01L24/16 ,  H01L24/17 ,  H01L25/16 ,  H01L25/162 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/82039 ,  H01L2224/82047 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01025 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01043 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01051 ,  H01L2924/01052 ,  H01L2924/01058 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3511 ,  H05K1/0231 ,  H05K1/185 ,  H05K1/186 ,  H05K1/187 ,  H05K3/4602 ,  H05K3/4611 ,  H05K2201/0187 ,  H05K2201/09509 ,  H05K2201/09536 ,  H05K2201/10636 ,  H05K2201/10674 ,  H05K2203/063 ,  Y02P70/611 ,  Y10T29/435 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49146 ,  Y10T29/49155 ,  Y10T29/49165 ,  H01L2924/00 ,  H01L2224/05599

摘要： A chip capacitor 20 is provided in a core substrate 30 of a printed circuit board 10. This makes it possible to shorten a distance between an IC chip 90 and the chip capacitor 20 and to reduce loop inductance. Since the core substrate 30 id constituted by provided a first resin substrate 30a, a second resin substrate 30b and a third resin substrate 30c in a multilayer manner, the core substrate 30 can obtain sufficient strength.

摘要翻译： 片状电容器20设置在印刷电路板10的芯基板30中。 这使得可以缩短IC芯片90和芯片电容器20之间的距离并减小环路电感。 由于通过以多层方式设置第一树脂基板30a，第二树脂基板30b和第三树脂基板30c构成的芯基板30d，因此芯基板30可以获得足够的强度。