Abstract:
Provided are a polyester polymerization catalyst with which the generation of foreign materials caused by the catalyst or mold pollution at the time of molding are reduced and polyesters having remarkably superior thermal stability and color tone can be obtained.Provided is a polyester polymerization catalyst produced by the reaction of a titanium compound and a mannitol in a molar ratio of titanium atom to mannitol of from 1:1 to 1:3. A method for producing a polyester employs the polyester polymerization catalyst.
Abstract:
The present invention provides apparatus, methods, and systems for fabricating memory structures methods of forming pillars for memory cells using sequential sidewall patterning. The invention includes forming first features from a first template layer disposed above a memory layer stack; forming first sidewall spacers adjacent the first features; forming second features that extend in a first direction in a mask layer by using the first sidewall spacers as a hardmask; depositing a second template layer on the mask layer; forming third features from the second template layer; forming second sidewall spacers adjacent the third features; and forming fourth features that extend in a second direction in the mask layer by using the second sidewall spacers as a hardmask. Numerous additional aspects are disclosed.
Abstract:
The present invention provides apparatus, methods, and systems for fabricating memory structures methods of forming pillars for memory cells using sequential sidewall patterning. The invention includes forming first features from a first template layer disposed above a memory layer stack; forming first sidewall spacers adjacent the first features; forming second features that extend in a first direction in a mask layer by using the first sidewall spacers as a hardmask; depositing a second template layer on the mask layer; forming third features from the second template layer; forming second sidewall spacers adjacent the third features; and forming fourth features that extend in a second direction in the mask layer by using the second sidewall spacers as a hardmask. Numerous additional aspects are disclosed.
Abstract:
One or more diffusion barriers are formed around one or more conductors in a three dimensional or 3D memory cell. The diffusion barriers allow the conductors to comprise very low resistivity materials, such as copper, that may otherwise out diffuse into surrounding areas, particularly at elevated processing temperatures. Utilizing lower resistivity materials allows device dimension to be reduced by mitigating increases in resistance that occur when the size of the conductors is reduced. As such, more cells can be produced over a given area, thus increasing the density and storage capacity of a resulting memory array.
Abstract:
In some aspects, a method of fabricating a memory cell is provided that includes (1) fabricating a first conductor above a substrate; (2) fabricating a carbon nano-tube (CNT) material above the first conductor; (3) depositing a dielectric material onto a top surface of the CNT material; (4) planarizing the dielectric material to expose at least a portion of the CNT material; (5) fabricating a diode above the first conductor; and (6) fabricating a second conductor above the CNT material and the diode. Numerous other aspects are provided.
Abstract:
A semiconductor wafer assembly includes a base of dielectric. A layer of silicon is deposited thereover. A metal hard mask is deposited over the silicon. A dielectric hard mask is deposited over the metal hard mask. Photoresist is deposited over the dielectric hard mask, whereby a plurality of sacrificial columns is formed from the layer of metal hard mask through the photoresist such that the sacrificial columns extend out from the silicon layer. An interface layer is disposed between the layer of conductive material and the layer of hard mask to enhance adhesion between each of the plurality of sacrificial columns and the layer of conductive material to optimize the formation of junction diodes out of the silicon by preventing the plurality of sacrificial columns from being detached from the layer of silicon prematurely due to the sacrificial columns peeling or falling off.
Abstract:
A patterned disk medium includes a disk-shaped flat substrate including a first surface and a second surface located an opposite side of the first surface. First servo pattern areas including portions provided with magnetic members and portions provided with no magnetic members are provided on the first surface. Second servo pattern areas including portions provided with magnetic members and portions provided with no magnetic members are provided on the second surface. The magnetic members of the first and second servo pattern areas are magnetized in a direction perpendicular to the first and second surfaces. The magnetic polarity of the surfaces of the magnetic members of the second pattern areas differs from that of the surfaces of the magnetic members of the first pattern areas.
Abstract:
According to one embodiment, a case of a magnetic disk device has a sheet-shaped base with an open upper surface formed of a soft magnetic material, and a sheet-shaped top cover with an open upper surface formed of a soft magnetic material and attached to the base. A disk-shaped recording medium arranged in the case comprises a substrate, a soft magnetic backing layer formed on the substrate, and a magnetic recording layer formed by being overlapped on the soft magnetic backing layer and having perpendicular magnetic anisotropy. The base is formed in a thickness of 0.5 mm or more and the top cover is formed in a thickness of 0.25 mm or more, respectively. The base and the top cover have a relative permeability of 700 or more and a saturation flux density of 1.4 (T) or more.
Abstract:
In one embodiment, a target alignment surface disposed on a target support mechanically engages a darkspace shield alignment surface disposed on a darkspace shield as the target is lodged into a chamber body. The respective alignment surfaces are shaped and positioned so that the darkspace shield is physically moved to a desired aligned position as the alignment surfaces engage each other. In this manner a darkspace shield may be directly aligned to a target within a semiconductor fabrication chamber to provide a suitable darkspace gap between the target and the darkspace shield.
Abstract:
A magnetic disk includes a flat disk-shaped substrate having a center hole and a recording region formed on an obverse and/or reverse surface of the substrate and patterned depending on the presence of a magnetic material. The recording region has a data region pattern and a plurality of servo region patterns formed substantially in circular arcs which radially extend from the center hole side of the substrate to an outer peripheral edge portion thereof and divide the data region pattern in a plurality of parts in the circumferential direction of the substrate. Each servo region pattern has a radius larger than that of the outmost periphery of the substrate and a center of the circular arc on a circular path concentric with the substrate. The data region pattern and each of the servo region patterns have different magnetic occupancies and different optical reflection factors.