公开(公告)号：US20200066544A1

公开(公告)日：2020-02-27

申请号：US16667018

申请日：2019-10-29

Applicant: General Electric Company

Inventor： Christopher James Kapusta ,  Raymond Albert Fillion ,  Risto Ilkka Sakari Tuominen ,  Kaustubh Ravindra Nagarkar

IPC: H01L21/48 ,  H01L27/146 ,  H01L23/00 ,  H01L27/14 ,  H01L23/367 ,  H01L23/31 ,  H01L23/14 ,  H01L23/28 ,  H01L21/52 ,  H01L21/56

Abstract: An electronics package includes an insulating substrate, an electrical component having a back surface coupled to a first surface of the insulating substrate, and an insulating structure surrounding at least a portion of a perimeter of the electrical component. A first wiring layer extends from the first surface of the insulating substrate and over a sloped side surface of the insulating structure to electrically couple with at least one contact pad on an active surface of the electrical component. A second wiring layer is formed on a second surface of the insulating substrate and extends through at least one via therein to electrically couple with the first wiring layer.

公开(公告)号：US10541209B2

公开(公告)日：2020-01-21

申请号：US15668553

申请日：2017-08-03

Applicant: General Electric Company

Inventor： Christopher James Kapusta ,  Raymond Albert Fillion ,  Risto Ilkka Sakari Tuominen ,  Kaustubh Ravindra Nagarkar

IPC: H01L21/48 ,  H01L21/56 ,  H01L21/52 ,  H01L23/28 ,  H01L23/552

Abstract: An electronics package includes a support substrate, an electrical component having a first surface coupled to a first surface of the support substrate, and an insulating structure coupled to the first surface of the support substrate and sidewalls of the electrical component. The insulating structure has a sloped outer surface. A conductive layer encapsulates the electrical component and the sloped outer surface of the insulating structure. A first wiring layer is formed on a second surface of the support substrate. The first wiring layer is coupled to the conductive layer through at least one via in the support substrate.

公开(公告)号：USRE47651E1

公开(公告)日：2019-10-15

申请号：US15415549

申请日：2017-01-25

Applicant: General Electric Company

Inventor： James Sabatini ,  Christopher James Kapusta ,  Glenn Forman

IPC: H01L25/00 ,  H01L23/00 ,  H01L25/065 ,  H01L23/538 ,  H01L25/16

Abstract: An electronic package includes a first layer having a first surface, the first layer includes a first device having a first electrical node, and a first contact pad in electrical communication with the first electrical node and positioned within the first surface. The package includes a second layer having a second surface and a third surface, the second layer includes a first conductor positioned within the second surface and a second contact pad positioned within the third surface and in electrical communication with the first conductor. A first anisotropic conducting paste (ACP) is positioned between the first contact pad and the first conductor to electrically connect the first contact pad to the first conductor such that an electrical signal may pass therebetween.

公开(公告)号：US20190043810A1

公开(公告)日：2019-02-07

申请号：US15668553

申请日：2017-08-03

Applicant: General Electric Company

Inventor： Christopher James Kapusta ,  Raymond Albert Fillion ,  Risto Ilkka Sakari Tuominen ,  Kaustubh Ravindra Nagarkar

IPC: H01L23/552 ,  H01L21/52 ,  H01L21/56 ,  H01L21/48

Abstract: An electronics package includes a support substrate, an electrical component having a first surface coupled to a first surface of the support substrate, and an insulating structure coupled to the first surface of the support substrate and sidewalls of the electrical component. The insulating structure has a sloped outer surface. A conductive layer encapsulates the electrical component and the sloped outer surface of the insulating structure. A first wiring layer is formed on a second surface of the support substrate. The first wiring layer is coupled to the conductive layer through at least one via in the support substrate.

公开(公告)号：US20180240789A1

公开(公告)日：2018-08-23

申请号：US15956231

申请日：2018-04-18

Applicant: General Electric Company

Inventor： James Sabatini ,  Christopher James Kapusta ,  Glenn Forman

IPC: H01L25/00 ,  H01L23/00 ,  H01L23/538 ,  H01L25/065

CPC classification number: H01L25/50 ,  H01L23/5385 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/82 ,  H01L25/0657 ,  H01L25/16 ,  H01L2224/04105 ,  H01L2224/24137 ,  H01L2224/73267 ,  H01L2224/82039 ,  H01L2224/92144 ,  H01L2225/0652 ,  H01L2225/06524 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/18162 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/00

Abstract: An electronic package includes a first layer having a first surface, the first layer includes a first device having a first electrical node, and a first contact pad in electrical communication with the first electrical node and positioned within the first surface. The package includes a second layer having a second surface and a third surface, the second layer includes a first conductor positioned within the second surface and a second contact pad positioned within the third surface and in electrical communication with the first conductor. A first anisotropic conducting paste (ACP) is positioned between the first contact pad and the first conductor to electrically connect the first contact pad to the first conductor such that an electrical signal may pass therebetween.

公开(公告)号：US20180062618A1

公开(公告)日：2018-03-01

申请号：US15246671

申请日：2016-08-25

Applicant: General Electric Company

Inventor： Kaustubh Ravindra Nagarkar ,  Yongjae Lee ,  Christopher James Kapusta

IPC: H03H9/54 ,  H03H9/64 ,  H03H3/02

CPC classification number: H03H9/54 ,  H01L2224/18 ,  H03H3/02 ,  H03H9/0547 ,  H03H9/1042 ,  H03H9/1071 ,  H03H9/1085 ,  H03H9/64

Abstract: A filter package and method of manufacturing thereof is disclosed. The filter device package includes a first dielectric layer having an acoustic wave filter device attached thereto, the acoustic wave filter device comprising an active area and I/O pads. The filter device package also includes an adhesive positioned between the first dielectric layer and the acoustic wave filter device to secure the layer to the device, vias formed through the first dielectric layer and the adhesive to the I/O pads of the acoustic wave filter device, and metal interconnects formed in the vias and mechanically and electrically coupled to the I/O pads of the acoustic wave filter device to form electrical interconnections thereto, wherein an air cavity is formed in the adhesive between the acoustic wave filter device and the first dielectric layer, in a location adjacent the active area of the acoustic wave filter device.

公开(公告)号：US20170155179A1

公开(公告)日：2017-06-01

申请号：US15429227

申请日：2017-02-10

Applicant: General Electric Company

Inventor： Yongjae Lee ,  Joseph Alfred Iannotti ,  Christopher Fred Keimel ,  Christopher James Kapusta

IPC: H01P1/15 ,  H01L21/52 ,  H01L21/54 ,  H01H55/00 ,  H01H59/00 ,  H01H61/01 ,  H01H57/00 ,  H01L21/48 ,  H01L21/56

CPC classification number: H01P1/15 ,  H01H55/00 ,  H01H57/00 ,  H01H59/0009 ,  H01H61/01 ,  H01H2057/006 ,  H01H2061/006 ,  H01L21/4853 ,  H01L21/52 ,  H01L21/54 ,  H01L21/56 ,  H01L2224/16225 ,  H01L2924/16195 ,  H01P1/127 ,  H01P3/084

Abstract: A radio frequency (RF) die package includes a switch assembly comprising an RF transmission line and a plurality of conductive mounting pads formed on a first substrate. A switching mechanism selectively couples a first portion of the RF transmission line to a second portion of the RF transmission line. An inverted ground plane assembly is coupled to the plurality of conductive mounting pads such that an electromagnetic field generated between the RF transmission line and the inverted ground plane assembly does not permeate the first substrate in a region of the switch assembly proximate the switching mechanism.

公开(公告)号：US09666516B2

公开(公告)日：2017-05-30

申请号：US14556258

申请日：2014-12-01

Applicant: General Electric Company

Inventor： Scott Smith ,  Christopher James Kapusta ,  Glenn Alan Forman ,  Eric Patrick Davis

IPC: H01L23/00 ,  H01L23/498 ,  H01L25/065 ,  H01L21/48 ,  H01L21/288 ,  H01L21/66

CPC classification number: H01L23/49827 ,  H01L21/2885 ,  H01L21/486 ,  H01L22/12 ,  H01L22/14 ,  H01L22/22 ,  H01L23/49838 ,  H01L24/24 ,  H01L24/29 ,  H01L24/82 ,  H01L24/83 ,  H01L24/97 ,  H01L25/0655 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/16227 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/82031 ,  H01L2224/82039 ,  H01L2224/82047 ,  H01L2224/82106 ,  H01L2224/82138 ,  H01L2224/83129 ,  H01L2224/8314 ,  H01L2224/83192 ,  H01L2224/92144 ,  H01L2224/97 ,  H01L2225/1035 ,  H01L2225/1058 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01028 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15724 ,  H01L2924/15738 ,  H01L2924/15747 ,  H01L2924/15763 ,  H01L2924/3025 ,  H01L2224/83 ,  H01L2224/82

Abstract: An electronic package and a method of making the same in provided. The electronic package includes a dielectric layer and a conformal masking layer disposed on at least a portion of the dielectric layer. The electronic package further includes a routing layer disposed on at least a portion of the masking layer and a micro-via disposed at least in part in the conformal masking layer and the routing layer. Further, at least a portion of the routing layer forms a conformal electrically conductive layer in at least a portion of the micro-via. Also, the conformal masking layer is configured to define a size of the micro-via. The electronic package further includes a semiconductor die operatively coupled to the micro-via.

公开(公告)号：US09642566B2

公开(公告)日：2017-05-09

申请号：US14045809

申请日：2013-10-04

Applicant: General Electric Company

Inventor： Christopher James Kapusta ,  Eric Patrick Davis ,  Jason Harris Karp

IPC: G01L1/04 ,  A61B5/1455

CPC classification number: A61B5/14552 ,  A61B2562/046 ,  A61B2562/12 ,  Y10T29/49004 ,  Y10T29/49126

Abstract: A flexible embedded sensor array includes a first substrate, an electrically conductive pad disposed on at least a portion of the first substrate, and a plurality of sensors disposed on at least a portion of electrically conductive pads. Further, the flexible embedded sensor array includes an electrically non-conductive adhesive material disposed in proximity to one or more of the plurality of sensors, a second substrate, and an electrical contact disposed between at least a portion of the sensor and at least a portion of the second substrate.

公开(公告)号：US20170062889A1

公开(公告)日：2017-03-02

申请号：US14839464

申请日：2015-08-28

Applicant: General Electric Company

Inventor： Yongjae Lee ,  Joseph Alfred Iannotti ,  Christopher Fred Keimel ,  Christopher James Kapusta

IPC: H01P1/12 ,  H01H49/00 ,  H01P11/00 ,  H01H59/00

CPC classification number: H01P1/127 ,  B81B7/007 ,  H01H49/00 ,  H01H59/0009 ,  H01P11/00

Abstract: A radio frequency (RF) microelectromechanical system (MEMS) package includes a first mounting substrate, a signal line formed on a top surface of the first mounting substrate, the signal line comprising a MEMS device selectively electrically coupling a first portion of the signal line to a second portion of the signal line, and a ground assembly coupled to the first mounting substrate. The ground assembly includes a second mounting substrate, a ground plane formed on a bottom surface of the second mounting substrate, and at least one electrical interconnect extending through a thickness of the second mounting substrate to contact the ground plane, wherein the ground plane is spaced apart from the signal line.

Abstract translation: 射频（RF）微机电系统（MEMS）封装包括第一安装衬底，形成在第一安装衬底的顶表面上的信号线，该信号线包括选择性地电耦合信号线的第一部分到 信号线的第二部分，以及耦合到第一安装基板的接地组件。 接地组件包括第二安装基板，形成在第二安装基板的底表面上的接地平面以及延伸穿过第二安装基板的厚度以接触接地平面的至少一个电互连，其中接地平面间隔开 除了信号线。