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1.发明公开公开(公告)号：US20240230437A1
公开(公告)日：2024-07-11
申请号：US18151513
申请日：2023-01-09
Applicant: General Electric Company
Inventor： Bradley Alan Bauer , Brendon Matthew Leeker , Joseph Alfred Iannotti , Glen Peter Koste , Jason Case
IPC: G01L3/10
CPC classification number: G01L3/10
Abstract: A method for measuring shaft deflection in a turbomachine includes communicating one or more signals from a controller to a plurality of sensing devices positioned on a shaft of a turbomachine across an airgap defined between a rotating antenna positioned around the shaft and a stationary antenna aligned with the rotating antenna in a radial direction to excite the plurality of sensing devices; receiving a parameter of the shaft in a plurality of circumferentially spaced locations from the excited plurality of sensing devices; determining a magnitude of a deflection in the shaft as a function of the parameter of the shaft in the plurality of circumferentially spaced locations; and adjusting a startup sequence or a motoring sequence of the turbomachine based on the magnitude of the deflection
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公开(公告)号：US20230273160A1
公开(公告)日：2023-08-31
申请号：US18134788
申请日：2023-04-14
Applicant: General Electric Company
CPC classification number: G01N29/223 , G01K11/265 , G01N29/2443 , G01N29/2462 , G01D11/245
Abstract: A system includes a sensor comprising a sensor bonding layer disposed on a surface of the sensor, wherein the sensor bonding layer is a metallic alloy. An inlay includes a planar outer surface, wherein the inlay may be disposed on a curved surface of a structure. A structure bonding layer may be disposed on the planar outer surface of the inlay, wherein the structure bonding layer is a metallic alloy. The sensor bonding layer is coupled to the structure bonding layer via a metallic joint, and the sensor is configured to sense data of the structure through the metallic joint, the structure bonding layer, and the sensor bonding layer. The inlay comprises at least one of a modulus of elasticity, a shape, a thickness, and a size configured to reduce strain transmitted to the sensor.
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3.发明授权公开(公告)号：US11503704B2
公开(公告)日：2022-11-15
申请号：US16730435
申请日：2019-12-30
Applicant: General Electric Company
IPC: H05K1/02 , H05K1/03 , H05K1/09 , H05K1/11 , H05K1/14 , H05K1/16 , H05K1/18 , H05K3/10 , H05K3/32 , H05K3/36 , H05K3/42 , H05K3/46 , H01L21/02 , H01L21/48 , H01L21/50 , H01L21/56 , H01L23/00 , H01L23/12 , H01L23/13 , H01L23/16 , H01L23/31 , H01L23/48 , H01L23/52 , H01L23/58 , H01L23/66 , H01L23/485 , H01L23/498 , H01L23/538
Abstract: An electronics package is disclosed. The electronics package includes a first radio frequency (RF) substrate layer, a second RF substrate layer, and a plurality of conductive layers disposed adjacent to at least one of the first RF substrate layer and the second RF substrate layer and including an inner conductive layer disposed between and adjacent to both the first RF substrate layer and the second RF substrate layer. The inner conductive layer bonds the first RF substrate layer to the second RF substrate layer. The electronics package also includes a plurality of conductive interconnects extending through the first RF substrate layer and the second RF substrate layer and electrically coupled between at least two of the plurality of conductive layers.
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公开(公告)号：US20210325348A1
公开(公告)日：2021-10-21
申请号：US17362407
申请日：2021-06-29
Applicant: General Electric Company
Abstract: A system includes a sensor comprising a sensor bonding layer disposed on a surface of the sensor, wherein the sensor bonding layer is a metallic alloy. An inlay includes a planar outer surface, wherein the inlay may be disposed on a curved surface of a structure. A structure bonding layer may be disposed on the planar outer surface of the inlay, wherein the structure bonding layer is a metallic alloy. The sensor bonding layer is coupled to the structure bonding layer via a metallic joint, and the sensor is configured to sense data of the structure through the metallic joint, the structure bonding layer, and the sensor bonding layer. The inlay comprises at least one of a modulus of elasticity, a shape, a thickness, and a size configured to reduce strain transmitted to the sensor.
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公开(公告)号：US20210125918A1
公开(公告)日：2021-04-29
申请号：US16666016
申请日：2019-10-28
Applicant: General Electric Company
Inventor： Marco Francesco Aimi , Joseph Alfred Iannotti , Joleyn Eileen Brewer
IPC: H01L23/522 , H01L49/02 , H01L21/48
Abstract: A method includes obtaining an active feature layer having a first surface bearing one or more active feature areas. A first capacitor plate of a first capacitor is formed on an interior surface of a cap. A second capacitor plate of the first capacitor is formed on an exterior surface of the cap. The first capacitor plate of the first capacitor overlays and is spaced apart from the second capacitor plate of the first capacitor along a direction that is orthogonal to the exterior surface of the cap to form the first capacitor. The cap is coupled with the first surface of the active feature layer such that the second capacitor plate of the first capacitor is in electrical communication with at least a first active feature of the active feature layer. The cap is bonded with the passive layer substrate.
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Patent Agency Ranking
公开(公告)号：US10225026B2
公开(公告)日：2019-03-05
申请号：US15193621
申请日：2016-06-27
Applicant: General Electric Company
Inventor： Yongjae Lee , Joseph Alfred Iannotti , Filippo Gerbi , Alessio Capanni
IPC: G01R29/10 , H04B17/10 , G08C17/00 , F02D41/22 , F02F3/00 , F04B49/20 , F04B51/00 , F04B53/14 , H01Q9/04 , H01Q9/06 , F04B1/04 , H04Q9/00 , F04B27/04 , F04B39/00 , F04B1/053 , F04B27/053
Abstract: A sensor system for determining a condition associated with a piston rod of a reciprocating system includes an interrogator system having a first antenna. The sensor system further includes a second antenna separated from the first antenna by an air gap distance. The second antenna is configured to be coupled to the piston rod of the reciprocating system. The second antenna is a patch antenna and is configured to communicate with the first antenna through a range of translational movement relative to the first antenna. The sensor system further includes a radio frequency sensor coupled to the second antenna. The radio frequency sensor is configured to be coupled to the piston rod of the reciprocating system, measure a characteristic associated with the piston rod of the reciprocating system, and transmit data associated with the characteristic to the first antenna of the interrogator system through the second antenna.
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7.发明申请公开(公告)号：US20170062890A1
公开(公告)日：2017-03-02
申请号：US14839402
申请日：2015-08-28
Applicant: General Electric Company
Inventor： Yongjae Lee , Joseph Alfred Iannotti , Christopher Fred Keimel , Christopher James Kapusta
IPC: H01P1/10 , H01H61/01 , H01H57/00 , H01H55/00 , H01L21/56 , H01L21/52 , H01L21/54 , H01H59/00 , H01L21/48
CPC classification number: H01P1/15 , H01H55/00 , H01H57/00 , H01H59/0009 , H01H61/01 , H01H2057/006 , H01H2061/006 , H01L21/4853 , H01L21/52 , H01L21/54 , H01L21/56 , H01L2224/16225 , H01L2924/16195 , H01P1/127 , H01P3/084
Abstract: A RF MEMS package includes a MEMS die assembly having a signal line formed on a top surface of a first mounting substrate, the signal line comprising a MEMS device selectively electrically coupling a first portion of the signal line to a second portion of the signal line, and two pairs of ground pads formed on the top surface of the first mounting substrate adjacent respective portions of the signal line. The pairs of ground pads are positioned adjacent respective sides of the MEMS device. A ground assembly is electrically coupled to the pairs of ground pads and includes a second mounting substrate and a ground region formed on a surface of the second mounting substrate. The ground region faces the top surface of the first mounting substrate and is electrically coupled to the pairs of ground pads. A cavity is formed between the ground region and the signal line.
Abstract translation: RF MEMS封装包括具有形成在第一安装衬底的顶表面上的信号线的MEMS管芯组件，所述信号线包括选择性地将所述信号线的第一部分电耦合到所述信号线的第二部分的MEMS器件， 以及两对接地焊盘，形成在第一安装基板的顶表面上，与信号线的相应部分相邻。 接地焊盘对被定位在MEMS器件的相应侧面附近。 接地组件电耦合到所述一对接地焊盘，并且包括形成在所述第二安装衬底的表面上的第二安装衬底和接地区域。 接地区域面向第一安装基板的顶表面并且电耦合到成对的接地焊盘。 在接地区域和信号线之间形成空穴。
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8.发明授权公开(公告)号：US09570783B1
公开(公告)日：2017-02-14
申请号：US14839402
申请日：2015-08-28
Applicant: General Electric Company
Inventor： Yongjae Lee , Joseph Alfred Iannotti , Christopher Fred Keimel , Christopher James Kapusta
IPC: H01P1/10 , H01H57/00 , H01P1/15 , H01H59/00 , H01H61/01 , H01H55/00 , H01L21/48 , H01L21/56 , H01L21/52 , H01L21/54 , H01H61/00
CPC classification number: H01P1/15 , H01H55/00 , H01H57/00 , H01H59/0009 , H01H61/01 , H01H2057/006 , H01H2061/006 , H01L21/4853 , H01L21/52 , H01L21/54 , H01L21/56 , H01L2224/16225 , H01L2924/16195 , H01P1/127 , H01P3/084
Abstract: A RF MEMS package includes a MEMS die assembly having a signal line formed on a top surface of a first mounting substrate, the signal line comprising a MEMS device selectively electrically coupling a first portion of the signal line to a second portion of the signal line, and two pairs of ground pads formed on the top surface of the first mounting substrate adjacent respective portions of the signal line. The pairs of ground pads are positioned adjacent respective sides of the MEMS device. A ground assembly is electrically coupled to the pairs of ground pads and includes a second mounting substrate and a ground region formed on a surface of the second mounting substrate. The ground region faces the top surface of the first mounting substrate and is electrically coupled to the pairs of ground pads. A cavity is formed between the ground region and the signal line.
Abstract translation: RF MEMS封装包括具有形成在第一安装衬底的顶表面上的信号线的MEMS管芯组件，所述信号线包括选择性地将所述信号线的第一部分电耦合到所述信号线的第二部分的MEMS器件， 以及两对接地焊盘，形成在第一安装基板的顶表面上，与信号线的相应部分相邻。 接地焊盘对被定位在MEMS器件的相应侧面附近。 接地组件电耦合到所述一对接地焊盘，并且包括形成在所述第二安装衬底的表面上的第二安装衬底和接地区域。 接地区域面向第一安装基板的顶表面并且电耦合到成对的接地焊盘。 在接地区域和信号线之间形成空穴。
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公开(公告)号：US20150115980A1
公开(公告)日：2015-04-30
申请号：US14063526
申请日：2013-10-25
Applicant: General Electric Company
Inventor： Selaka Bandara Bulumulla , Joseph Alfred Iannotti , James Patrick Carneal , Mahesh Panicker
CPC classification number: G01N22/02 , G01M7/04 , G01N29/07 , G01N29/265 , G01N33/383
Abstract: An inspection system for a metal-reinforced concrete structure is described. The system includes a radio frequency (RF) system configured to be movable with respect to a surface of the concrete structure while transmitting radio signals into the interior of the structure, and receiving reflected radio signals. The system also includes a processor configured to process the reflected radio signals, so as to obtain a focused image of the reinforcement in at least one selected region within the concrete structure. The image corresponds to the physical condition of the reinforcement. A method for determining the condition of a reinforced concrete structure is also described, utilizing the inspection system.
Abstract translation: 描述了一种用于金属钢筋混凝土结构的检查系统。 该系统包括射频（RF）系统，其配置成相对于混凝土结构的表面可移动，同时将无线电信号传送到结构的内部，并且接收反射的无线电信号。 该系统还包括配置成处理反射的无线电信号的处理器，以便在混凝土结构内的至少一个选定区域中获得加强件的聚焦图像。 图像对应于加固的物理条件。 还描述了一种用于确定钢筋混凝土结构状况的方法，利用检查系统。
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公开(公告)号：US11982645B2
公开(公告)日：2024-05-14
申请号：US18134788
申请日：2023-04-14
Applicant: General Electric Company
CPC classification number: G01N29/223 , G01D11/245 , G01K11/265 , G01N29/2443 , G01N29/2462
Abstract: A system includes a sensor comprising a sensor bonding layer disposed on a surface of the sensor, wherein the sensor bonding layer is a metallic alloy. An inlay includes a planar outer surface, wherein the inlay may be disposed on a curved surface of a structure. A structure bonding layer may be disposed on the planar outer surface of the inlay, wherein the structure bonding layer is a metallic alloy. The sensor bonding layer is coupled to the structure bonding layer via a metallic joint, and the sensor is configured to sense data of the structure through the metallic joint, the structure bonding layer, and the sensor bonding layer. The inlay comprises at least one of a modulus of elasticity, a shape, a thickness, and a size configured to reduce strain transmitted to the sensor.
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