公开(公告)号：US20190254546A1

公开(公告)日：2019-08-22

申请号：US15902841

申请日：2018-02-22

Applicant: General Electric Company

Inventor： Craig Patrick Galligan ,  Nancy Cecelia Stoffel ,  Eric Patrick Davis ,  Kaustubh Ravindra Nagarkar

IPC: A61B5/04 ,  A61B5/00 ,  A61N1/05

Abstract: The present approach relates to the fabrication of probes of a probe array device using wire bonding techniques. In certain implementation, a wire bond apparatus bonds ones end of a wire to a region of a probe array substrate. The second end, however, is not bonded to the substrate and instead is either fabricated to be vertical with respect to the substrate or raised from a non-bonded site to be vertical. The process may be repeated to form multiple probes of the probe array.

公开(公告)号：US20180235544A1

公开(公告)日：2018-08-23

申请号：US15625740

申请日：2017-06-16

Applicant: General Electric Company

Inventor： Kaustubh Ravindra Nagarkar ,  Jeffrey Michael Ashe ,  Eric Patrick Davis ,  Nancy Cecelia Stoffel

IPC: A61B5/00 ,  H05K5/00 ,  H05K1/18 ,  H05K1/11 ,  H05K5/02 ,  H05K3/30 ,  H05K3/40 ,  A61B5/07 ,  C23C14/34 ,  B33Y80/00

CPC classification number: A61B5/6861 ,  A61B5/076 ,  A61B2560/0468 ,  A61B2562/04 ,  A61B2562/125 ,  B33Y80/00 ,  C23C14/34 ,  H05K1/0313 ,  H05K1/113 ,  H05K1/181 ,  H05K3/303 ,  H05K3/4038 ,  H05K5/0026 ,  H05K5/0095 ,  H05K5/0247 ,  H05K5/064 ,  H05K2201/0141 ,  H05K2201/10098 ,  H05K2201/10151 ,  H05K2201/10522

Abstract: A system includes an implantable sensor assembly. The implantable sensor assembly includes a housing. The housing includes a substrate layer comprising an interior surface and an exterior surface, and a cap layer, wherein the substrate layer and the cap layer are coupled to form an enclosed cavity that at least partially encloses the interior surface of the substrate layer within the cavity and wherein both the substrate layer and the cap layer are formed from an insulating material. The implantable sensor assembly also includes one or more electronic components disposed within the cavity of the housing and one or more probes disposed on the exterior surface of the substrate layer and electrically coupled to the one or more electronic components by one or more electrical connections extending through the housing.

公开(公告)号：US11253212B2

公开(公告)日：2022-02-22

申请号：US16736607

申请日：2020-01-07

Applicant: General Electric Company

Inventor： Biju Jacob ,  Douglas Albagli ,  William Robert Ross ,  William Andrew Hennessy ,  Eric Patrick Davis ,  Bruno Kristiaan Bernard De Man ,  Nicholas Ryan Konkle

IPC: G01T1/20 ,  G01T1/24 ,  A61B6/00 ,  H04N5/32

Abstract: The present disclosure relates to the use of X-ray detector cassettes that may be abutted or overlapped to form a detector assembly suitable for imaging objects that are too large to image using a single X-ray detector cassette. Such a detector assembly may be customized in terms of the size and/or shape of the field-of-view (FOV). In certain embodiments the radiation-sensitive electronics (e.g., readout electronics) are positioned to the side of the X-ray detecting components (e.g., scintillator, TFT array, and so forth), allowing the cassette to be thin relative to other detector devices and allowing the electronics to remain outside the X-ray beam path.

公开(公告)号：US20160155693A1

公开(公告)日：2016-06-02

申请号：US14556258

申请日：2014-12-01

Applicant: General Electric Company

Inventor： Scott Smith ,  Christopher James Kapusta ,  Glenn Alan Forman ,  Eric Patrick Davis

IPC: H01L23/498 ,  H01L23/00 ,  H01L21/288 ,  H01L25/065 ,  H01L21/48

CPC classification number: H01L23/49827 ,  H01L21/2885 ,  H01L21/486 ,  H01L22/12 ,  H01L22/14 ,  H01L22/22 ,  H01L23/49838 ,  H01L24/24 ,  H01L24/29 ,  H01L24/82 ,  H01L24/83 ,  H01L24/97 ,  H01L25/0655 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/16227 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/82031 ,  H01L2224/82039 ,  H01L2224/82047 ,  H01L2224/82106 ,  H01L2224/82138 ,  H01L2224/83129 ,  H01L2224/8314 ,  H01L2224/83192 ,  H01L2224/92144 ,  H01L2224/97 ,  H01L2225/1035 ,  H01L2225/1058 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01028 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15724 ,  H01L2924/15738 ,  H01L2924/15747 ,  H01L2924/15763 ,  H01L2924/3025 ,  H01L2224/83 ,  H01L2224/82

Abstract: An electronic package and a method of making the same in provided. The electronic package includes a dielectric layer and a conformal masking layer disposed on at least a portion of the dielectric layer. The electronic package further includes a routing layer disposed on at least a portion of the masking layer and a micro-via disposed at least in part in the conformal masking layer and the routing layer. Further, at least a portion of the routing layer forms a conformal electrically conductive layer in at least a portion of the micro-via. Also, the conformal masking layer is configured to define a size of the micro-via. The electronic package further includes a semiconductor die operatively coupled to the micro-via.

Abstract translation: 一种电子封装及其制造方法。 电子封装包括介电层和设置在电介质层的至少一部分上的保形掩模层。 电子封装还包括设置在掩模层的至少一部分上的布线层和至少部分地设置在保形掩模层和布线层中的微通孔。 此外，路由层的至少一部分在微通孔的至少一部分中形成共形导电层。 此外，共形掩模层被配置为限定微通孔的尺寸。 电子封装还包括可操作地耦合到微通孔的半导体管芯。

公开(公告)号：US20150099948A1

公开(公告)日：2015-04-09

申请号：US14045809

申请日：2013-10-04

Applicant: General Electric Company

Inventor： Christopher James Kapusta ,  Eric Patrick Davis ,  Jason Harris Karp

IPC: G01L1/04 ,  A61B5/1455

CPC classification number: A61B5/14552 ,  A61B2562/046 ,  A61B2562/12 ,  Y10T29/49004 ,  Y10T29/49126

Abstract: A flexible embedded sensor array includes a first substrate, an electrically conductive pad disposed on at least a portion of the first substrate, and a plurality of sensors disposed on at least a portion of electrically conductive pads. Further, the flexible embedded sensor array includes an electrically non-conductive adhesive material disposed in proximity to one or more of the plurality of sensors, a second substrate, and an electrical contact disposed between at least a portion of the sensor and at least a portion of the second substrate.

Abstract translation: 柔性嵌入式传感器阵列包括第一衬底，设置在第一衬底的至少一部分上的导电焊盘以及设置在导电焊盘的至少一部分上的多个传感器。 此外，柔性嵌入式传感器阵列包括设置在多个传感器中的一个或多个传感器附近的非导电粘合材料，第二基板和设置在传感器的至少一部分之间的电触头和至少一部分 的第二基板。

公开(公告)号：US20210204889A1

公开(公告)日：2021-07-08

申请号：US16736607

申请日：2020-01-07

Applicant: General Electric Company

Inventor： Biju Jacob ,  Douglas Albagli ,  William Robert Ross ,  William Andrew Hennessy ,  Eric Patrick Davis ,  Bruno Kristiaan Bernard De Man ,  Nicholas Ryan Konkle

IPC: A61B6/00 ,  H04N5/32

Abstract: The present disclosure relates to the use of X-ray detector cassettes that may be abutted or overlapped to form a detector assembly suitable for imaging objects that are too large to image using a single X-ray detector cassette. Such a detector assembly may be customized in terms of the size and/or shape of the field-of-view (FOV). In certain embodiments the radiation-sensitive electronics (e.g., readout electronics) are positioned to the side of the X-ray detecting components (e.g., scintillator, TFT array, and so forth), allowing the cassette to be thin relative to other detector devices and allowing the electronics to remain outside the X-ray beam path.

公开(公告)号：US09666516B2

公开(公告)日：2017-05-30

申请号：US14556258

申请日：2014-12-01

Applicant: General Electric Company

Inventor： Scott Smith ,  Christopher James Kapusta ,  Glenn Alan Forman ,  Eric Patrick Davis

IPC: H01L23/00 ,  H01L23/498 ,  H01L25/065 ,  H01L21/48 ,  H01L21/288 ,  H01L21/66

CPC classification number: H01L23/49827 ,  H01L21/2885 ,  H01L21/486 ,  H01L22/12 ,  H01L22/14 ,  H01L22/22 ,  H01L23/49838 ,  H01L24/24 ,  H01L24/29 ,  H01L24/82 ,  H01L24/83 ,  H01L24/97 ,  H01L25/0655 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/16227 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/82031 ,  H01L2224/82039 ,  H01L2224/82047 ,  H01L2224/82106 ,  H01L2224/82138 ,  H01L2224/83129 ,  H01L2224/8314 ,  H01L2224/83192 ,  H01L2224/92144 ,  H01L2224/97 ,  H01L2225/1035 ,  H01L2225/1058 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01028 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15724 ,  H01L2924/15738 ,  H01L2924/15747 ,  H01L2924/15763 ,  H01L2924/3025 ,  H01L2224/83 ,  H01L2224/82

Abstract: An electronic package and a method of making the same in provided. The electronic package includes a dielectric layer and a conformal masking layer disposed on at least a portion of the dielectric layer. The electronic package further includes a routing layer disposed on at least a portion of the masking layer and a micro-via disposed at least in part in the conformal masking layer and the routing layer. Further, at least a portion of the routing layer forms a conformal electrically conductive layer in at least a portion of the micro-via. Also, the conformal masking layer is configured to define a size of the micro-via. The electronic package further includes a semiconductor die operatively coupled to the micro-via.

公开(公告)号：US09642566B2

公开(公告)日：2017-05-09

申请号：US14045809

申请日：2013-10-04

Applicant: General Electric Company

Inventor： Christopher James Kapusta ,  Eric Patrick Davis ,  Jason Harris Karp

IPC: G01L1/04 ,  A61B5/1455

CPC classification number: A61B5/14552 ,  A61B2562/046 ,  A61B2562/12 ,  Y10T29/49004 ,  Y10T29/49126

Abstract: A flexible embedded sensor array includes a first substrate, an electrically conductive pad disposed on at least a portion of the first substrate, and a plurality of sensors disposed on at least a portion of electrically conductive pads. Further, the flexible embedded sensor array includes an electrically non-conductive adhesive material disposed in proximity to one or more of the plurality of sensors, a second substrate, and an electrical contact disposed between at least a portion of the sensor and at least a portion of the second substrate.