公开(公告)号：US11875595B2

公开(公告)日：2024-01-16

申请号：US17764570

申请日：2021-05-21

Applicant: BOE TECHNOLOGY GROUP CO., LTD.

Inventor： Xiaoquan Hai ,  Lei Wang ,  Xiaoliang Ding ,  Xue Dong ,  Xuan Liang

IPC: G06V40/13 ,  G06V40/12 ,  H10K59/122 ,  H10K59/65

CPC classification number: G06V40/1318 ,  G06V40/1359 ,  H10K59/122 ,  H10K59/65

Abstract: A texture recognition apparatus and an electronic apparatus are provided. The texture recognition apparatus has a touch side surface, and includes a light source array, an image sensor array, and a light shielding layer. The light source array includes a plurality of light sources; the image sensor array includes a plurality of image sensors, each image sensor includes a photosensitive element; the light shielding layer is on a light incident side of the image sensor array, the light shielding layer includes a plurality of light-transmitting holes; the plurality of light-transmitting holes are configured to collimate light emitted by the plurality of light sources and reflected by the texture to a direction perpendicular to the touch side surface; and in the direction perpendicular to the touch side surface, a photosensitive element in each image sensor at least partially overlaps with at least one of the plurality of light-transmitting holes.

公开(公告)号：US11742377B2

公开(公告)日：2023-08-29

申请号：US17488243

申请日：2021-09-28

Applicant: BOE TECHNOLOGY GROUP CO., LTD.

Inventor： Xue Dong ,  Guangcai Yuan ,  Qi Yao ,  Zhanfeng Cao ,  Shi Shu ,  Mingxing Wang ,  Xiang Li

IPC: H01L25/00 ,  H01L27/15 ,  H01L25/065

CPC classification number: H01L27/156 ,  H01L25/0655 ,  H01L25/50

Abstract: A LED chip, including: substrate; LEDs on side of the substrate, each including first semiconductor pattern, light emission pattern, second semiconductor pattern sequentially stacked, the first semiconductor patterns of at least two LEDs being formed as single piece to constitute first semiconductor layer; at least one first electrode on side of first semiconductor layer away from the substrate and electrically coupled to first semiconductor layer; second electrodes on side of the second semiconductor patterns away from the substrate, each being electrically coupled to second semiconductor pattern of corresponding LED; pixel defining layer on side of the substrate away from LED, and having pixel openings in one-to-one correspondence with LEDs; and a color conversion pattern within at least two pixel openings, and converting light of first color emitted by the light emission pattern into light of target color other than the first color. The LED chip is Mini-LED or Micro-LED chip.

公开(公告)号：US11715744B2

公开(公告)日：2023-08-01

申请号：US17047912

申请日：2020-03-25

Applicant: BOE Technology Group Co., Ltd.

Inventor： Guangcai Yuan ,  Xue Dong ,  Feng Guan ,  Yupeng Gao

IPC: H01L27/12

CPC classification number: H01L27/127 ,  H01L27/1233

Abstract: This disclosure provides an array substrate, a method for preparing the array substrate, and a display panel. The method includes: forming a first thin film transistor and a second thin film transistor on a base substrate. In the formation of an active layer of the first thin film transistor, by using an eutectic point of the catalyst particle and silicon, and a driving factor that the Gibbs free energy of amorphous silicon is greater than that of crystalline silicon (silicon-based nanowire), and due to absorption of the amorphous silicon by the molten catalyst particle to form a supersaturated silicon eutectoid, the silicon nucleates and grows into a silicon-based nanowire. Moreover, during the growth of the silicon-based nanowire, the amorphous silicon film grows linearly along guide structure under the action of the catalyst particle, thus obtaining a silicon-based nanowire with a high density and high uniformity.

公开(公告)号：US11715425B2

公开(公告)日：2023-08-01

申请号：US17556678

申请日：2021-12-20

Applicant: Beijing BOE Optoelectronics Technology Co., Ltd. ,  BOE Technology Group Co., Ltd.

Inventor： Tiankuo Shi ,  Yifan Hou ,  Zhihua Ji ,  Xiaomang Zhang ,  Wei Sun ,  Rui Liu ,  Minglei Chu ,  Xue Dong ,  Hao Zhang ,  Lili Chen

IPC: G09G3/3266 ,  G09G3/36 ,  G09G5/00

CPC classification number: G09G3/3266 ,  G09G3/3618 ,  G09G5/001 ,  G09G2360/18

Abstract: A display method, a display device, a display system, and a storage medium are provided. The display method includes: obtaining a first fixation coordinate transmitted by an image acquisition device, and obtaining a second fixation coordinate and a current frame of image that are transmitted by a first processor; performing refresh and display by using the current frame of image; determining a type of the current frame of image, and determining, based on the type, whether the first fixation coordinate changes abnormally; and performing refresh and display by using a previous frame of image for non-fixation region in a case that the first fixation coordinate changes abnormally, and performing refresh and display by using a next frame of image transmitted by the first processor in a case that the first fixation coordinate does not change abnormally.

公开(公告)号：US11605238B2

公开(公告)日：2023-03-14

申请号：US16346223

申请日：2018-11-01

Applicant: BOE TECHNOLOGY GROUP CO., LTD.

Inventor： Rui Xu ,  Xue Dong ,  Haisheng Wang ,  Yingming Liu ,  Lei Wang ,  Changfeng Li ,  Pinchao Gu ,  Xueyou Cao ,  Wei Liu ,  Xiaoliang Ding ,  Xiaoquan Hai

IPC: G06V40/13 ,  G06F21/32 ,  G06F21/84 ,  H01L27/32

Abstract: A fingerprint identification module may include an array substrate (201), a plurality of point light sources (202) on the array substrate (201), and a plurality of photosensors (203) on the array substrate (201). The array substrate (201) may include a switch array (204) and a light emitting unit array (205) on the switch array (204). The plurality of point light sources (202) is configured to emit light to irradiate different regions of a finger at different times.

公开(公告)号：US11568833B2

公开(公告)日：2023-01-31

申请号：US16911501

申请日：2020-06-25

Applicant: BOE Technology Group Co., Ltd.

Inventor： Pengpeng Wang ,  Xue Dong ,  Haisheng Wang ,  Xiaoliang Ding ,  Lei Wang ,  Lin Zhang

IPC: G09G5/10 ,  H04N5/225 ,  G02B3/00 ,  G06T7/557

Abstract: The present disclosure discloses a structure for collecting light field information, a display device, and a control method of the display device. The structure for collecting light field information includes a base substrate, a plurality of sensor chips located on the base substrate, where each of the plurality of sensor chips includes a plurality of sensing units arranged in an array, and a plurality of micro-imaging structures located above a side, facing away from the base substrate, of the plurality of sensor chips. Each of the plurality of micro-imaging structures corresponds to a respective one of the sensor chips. An orthographic projection of the respective one sensor chip on the base substrate has an overlapping region with an orthographic projection of the each micro-imaging structure on the base substrate. The respective one sensor chip is configured to receive light field information passing through the each micro-imaging structure.

公开(公告)号：US11557246B2

公开(公告)日：2023-01-17

申请号：US17419162

申请日：2020-09-30

Applicant: BOE TECHNOLOGY GROUP CO., LTD.

Inventor： Minghua Xuan ,  Xue Dong

IPC: G09G3/32

Abstract: A pixel circuit includes an input circuit and a time control circuit. The input circuit is configured to output a driving signal to an element to be driven, so that the element to be driven emits light. The time control circuit is coupled to the input circuit, and is configured to control a light-emitting duration of the element to be driven to be a first duration by controlling the input circuit in response to a first control signal provided by a first control signal terminal, and control the light-emitting duration to be a second duration by controlling the input circuit in response to a second control signal provided by a second control signal terminal and a third control signal provided by a third control signal terminal. The second duration is less than the first duration, and the second duration includes a plurality of interval time periods.

公开(公告)号：US11538273B2

公开(公告)日：2022-12-27

申请号：US16626779

申请日：2018-12-03

Applicant: BOE Technology Group Co., Ltd.

Inventor： Shengji Yang ,  Xue Dong ,  Xiaochuan Chen ,  Hui Wang ,  Pengcheng Lu ,  Kuanta Huang ,  Zengqiang Zheng

IPC: G06V40/13 ,  G02B5/18 ,  G02F1/1335 ,  G06F21/32 ,  G06F21/84 ,  H01L27/146

Abstract: An integrated photo-sensing detection display substrate. The integrated photo-sensing detection display substrate includes a base substrate; a plurality of light emitting elements on the base substrate and configured to emit light, a portion of the light being totally reflected by a surface thereby forming totally reflected light; an addressable diffraction grating layer on a side of the base substrate away from the plurality of light emitting elements, and including a plurality of individually addressable diffraction regions, light diffraction respectively in the plurality of individually addressable diffraction regions being independently controllable; and a photosensor on a side of the addressable diffraction grating layer away from the base substrate and configured to detect light transmitted from one or more of the plurality of individually addressable diffraction regions, thereby detecting fingerprint information.

公开(公告)号：US20220320056A1

公开(公告)日：2022-10-06

申请号：US17434835

申请日：2021-04-08

Applicant: BOE Technology Group Co., Ltd.

Inventor： Xuan Liang ,  Meili Wang ,  Fei Wang ,  Xue Dong ,  Qi Qi

IPC: H01L25/16 ,  H01L23/00

Abstract: A light-emitting substrate, a method of manufacturing a light-emitting substrate, and a display device are provided. The light-emitting substrate includes: a first substrate, wherein the first substrate includes a first base substrate, a light-emitting diode arranged on the first base substrate, and a first conductive pad arranged on the first base substrate; a second substrate arranged opposite to the first substrate, wherein the second substrate includes a second base substrate, and a second conductive pad arranged on the second base substrate; and a bonding wire structure including a bonding wire, wherein the first conductive pad is located on a surface of the first substrate away from the second substrate, the second conductive pad is located on a surface of the second substrate away from the first substrate, and the bonding wire is configured to electrically connect the first conductive pad and the second conductive pad.

公开(公告)号：US20220293576A1

公开(公告)日：2022-09-15

申请号：US17536268

申请日：2021-11-29

Applicant: BOE TECHNOLOGY GROUP CO., LTD.

Inventor： Meili Wang ,  Xuan Liang ,  Fei Wang ,  Lei Wang ,  Yafeng Yang ,  Xue Dong ,  Zhanfeng Cao ,  Mingxing Wang ,  Fuqiang Li ,  Chenyang Zhang ,  Xinxin Zhao ,  Yanling Han ,  Lei Wang ,  Xuan Feng ,  Yapeng Li

IPC: H01L25/16 ,  H01L33/62 ,  H01L27/146 ,  H01L21/66

Abstract: A semiconductor apparatus and a method for manufacturing the semiconductor apparatus are provided. The semiconductor apparatus includes: a base substrate; a chip arranged on the base substrate, wherein the chip includes a chip main body and a plurality of terminals arranged on the chip main body; a terminal expansion layer arranged on the base substrate, the terminal expansion layer including a conductive material, and the terminal expansion layer and at least one terminal are located on a same side of the chip main body; and a plurality of expansion wires in the terminal expansion layer, wherein the plurality of expansion wires are electrically connected to the plurality of terminals, respectively, to lead out the plurality of terminals, wherein an orthographic projection of at least one expansion wire on the base substrate completely covers an orthographic projection of a terminal electrically connected to the expansion wire on the base substrate.