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    Ultra-thin microbattery packaging and handling
    56.
    发明授权
    Ultra-thin microbattery packaging and handling 有权

    公开(公告)号：US11539088B2

    公开(公告)日：2022-12-27

    申请号：US16813071

    申请日：2020-03-09

    申请人： International Business Machines Corporation

    发明人： Bing Dang ,  Leanna Pancoast ,  Jae-Woong Nah ,  John Knickerbocker

    IPC分类号： H01M50/10 ,  H01M10/052 ,  H01M10/04 ,  H01M50/116 ,  H01M50/543

    摘要： Microbatteries and methods for forming microbatteries are provided. The microbatteries and methods address at least one or both of edge sealing issues for edges of a stack forming part of a microbatteries and overall sealing for individual cells for microbatteries in a batch process. A transferable solder molding apparatus and sealing structure are proposed in an example to provide a metal casing for a solid-state thin-film microbattery. An exemplary proposed process involves deposition or pre-forming low-temperature solder casing separately from the microbatteries. Then a thermal compression may be used to transfer the solder casing to each battery cell, with a handler apparatus in a batch process in an example. These exemplary embodiments can address the temperature tolerance constrain for solid state thin film battery during handling, metal sealing, and packaging.

    Hermetic packaging of a micro-battery device
    57.
    发明授权
    Hermetic packaging of a micro-battery device 有权

    公开(公告)号：US11522243B2

    公开(公告)日：2022-12-06

    申请号：US17128371

    申请日：2020-12-21

    申请人： International Business Machines Corporation

    发明人： Qianwen Chen ,  Jae-Woong Nah ,  Bing Dang ,  Leanna Pancoast ,  John Knickerbocker

    IPC分类号： H01M50/171 ,  H01M10/0585 ,  H01M50/191 ,  H01M50/197 ,  H01M50/186

    摘要： A method of manufacturing a micro-battery is provided. The method includes forming a micro-battery device by forming a first metal anode via and a first metal cathode via in a first substrate, forming a first metal layer on a bottom side of the first substrate, forming a first battery element on a top side of the substrate, forming an encapsulation layer around the first battery element, forming trenches through the encapsulation layer and the first substrate on different sides of the first battery element, and forming a metal sealing layer in the trenches to cover at least a plurality of sidewall surfaces of the first battery element. The metal sealing layer is electrically connected to the battery element through the first metal layer and the first metal cathode via.

    High bandwidth multichip module
    58.
    发明授权
    High bandwidth multichip module 有权

    公开(公告)号：US11315902B2

    公开(公告)日：2022-04-26

    申请号：US16788459

    申请日：2020-02-12

    申请人： International Business Machines Corporation

    发明人： John Knickerbocker

    IPC分类号： H01L25/065 ,  H01L21/56 ,  H01L23/538 ,  H01L23/00 ,  H01L25/00 ,  H01L23/498 ,  H01L23/66 ,  H01L25/18

    摘要： Multi-semiconductor chip modules that have a substrate with a substrate surface, one or more first substrate connections, and one or more second substrate connections. One or more first semiconductor chips (chips) has one or more larger first chip connections and one or more smaller first chip connections on a first chip bottom surface. One or more of the larger first chip connections physically and electrically connected to a respective first substrate connection. One or more second chips has one or more larger second chip connections and one or more smaller second chip connections on a second chip bottom surface. One or more of the larger second chip connections physically and electrically connected to a respective second substrate connection. A bridge has a bridge thickness, a bridge surface, and one or more bridge connections on the bridge surface. A first part of the bridge surface is under the first chip bottom surface and a second part of the bridge surface is under the second chip bottom surface. The bridge is disposed on the substrate between the first semiconductor chip and the second semiconductor chip, and one or more of the smaller first chip connections is physically and electrically connected to a respective first bridge connection on the first part of the bridge surface and one or more of the smaller second chip connection is physically and electrically connected to a respective second bridge connection. Some embodiments, a large surface bridge with the bridge. The large surface bridge and bridge can have different configurations. The bridge thickness allows larger chip connections and smaller connections with high pitch to intermingled in a location within the module. Methods of manufacture are disclosed.