公开(公告)号：US11810893B2

公开(公告)日：2023-11-07

申请号：US17334937

申请日：2021-05-31

申请人： International Business Machines Corporation

发明人： William Emmett Bernier ,  Bing Dang ,  John Knickerbocker ,  Son Kim Tran ,  Mario J. Interrante

IPC分类号： H01L23/00 ,  H01L23/552 ,  H01L23/498 ,  H01L25/065 ,  H01L23/367 ,  H01L23/60

CPC分类号： H01L24/81 ,  H01L23/367 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/49833 ,  H01L23/552 ,  H01L23/60 ,  H01L24/09 ,  H01L25/0655 ,  H01L2224/08238 ,  H01L2224/16225 ,  H01L2224/81192 ,  H01L2924/014 ,  H01L2924/0105 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/1461 ,  H01L2924/1579 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/15738 ,  H01L2924/15787 ,  H01L2924/19105 ,  H01L2924/1461 ,  H01L2924/00

摘要： An interposer sandwich structure includes a top interposer and a bottom interposer enclosing an integrated circuit electronic device that includes an attachment for attaching the device to the bottom interposer, and an interconnection structure connecting the top interposer to the bottom interposer. The top interposer may also be directly connected to a chip carrier in addition to the bottom interposer. The structure provides shielding and protection of the device against Electrostatic Discharge (ESD), Electromagnetic Interference (EMI), and Electromagnetic Conductivity (EMC) in miniaturized 3D packaging.

公开(公告)号：US11049841B2

公开(公告)日：2021-06-29

申请号：US15688369

申请日：2017-08-28

申请人： International Business Machines Corporation

发明人： William Emmett Bernier ,  Bing Dang ,  Mario J. Interrante ,  John Knickerbocker ,  Son Kim Tran

IPC分类号： H01L23/498 ,  H01L23/552 ,  H01L23/60 ,  H01L23/00 ,  H01L25/065 ,  H01L23/367

摘要： A interposer sandwich structure comprises a top interposer and a bottom interposer enclosing an integrated circuit electronic device that includes means for attaching the device to the bottom interposer, and an interconnection structure connecting the top interposer to the bottom interposer. The top interposer may also be directly connected to a chip carrier in addition to the bottom interposer. The structure provides shielding and protection of the device against Electrostatic Discharge (ESD), Electromagnetic Interference (EMI), and Electromagnetic Conductivity (EMC) in miniaturized 3D packaging.