公开(公告)号：US20050181315A1

公开(公告)日：2005-08-18

申请号：US11028943

申请日：2005-01-03

Applicant: Adam Cohen ,  Jeffrey Thompson

Inventor： Adam Cohen ,  Jeffrey Thompson

IPC: C25D5/02 ,  C25D5/10 ,  G03C5/38 ,  H01L21/8236

CPC classification number: C25D5/02 ,  B33Y10/00 ,  B33Y50/00 ,  B33Y50/02 ,  C25D1/003 ,  C25D5/022 ,  C25D5/10

Abstract: Some embodiments of the invention are directed to techniques for electrochemically fabricating multi-layer three-dimensional structures where selective patterning of at least one or more layers occurs via a mask which is formed using data representing cross-sections of the three-dimensional structure which has been modified to place it in a polygonal form which defines only regions of positive area. The regions of positive area are regions where structural material is to be located or regions where structural material is not to be located depending on whether the mask will be used, for example, in selectively depositing a structural material or a sacrificial material. The modified data may take the form of adjacent or slightly overlapped relative narrow rectangular structures where the width of the structures is related to a desired formation resolution. The spacing between centers of adjacent rectangles may be uniform or may be a variable. The data modification may also include the formation of duplicate copies of an original structure, scaled copies, mirrored copies, rotated copies, complementary copies, and the like.

Abstract translation: 本发明的一些实施例涉及用于电化学制造多层三维结构的技术，其中至少一个或多个层的选择性图案化通过掩模发生，该掩模使用表示具有三维结构的横截面的数据形成，该三维结构具有 被修改为将其定义为仅限定正面积区域的多边形形式。 根据是否使用掩模，例如选择性地沉积结构材料或牺牲材料，正面积的区域是结构材料要被定位的区域或者结构材料不被定位的区域。 修改的数据可以采取相邻或稍微重叠的相对窄的矩形结构的形式，其中结构的宽度与期望的地层分辨率相关。 相邻矩形的中心之间的间距可以是均匀的或可以是变量。 数据修改还可以包括形成原始结构，缩放副本，镜像副本，旋转副本，补充副本等的重复副本。

公开(公告)号：US20050173374A1

公开(公告)日：2005-08-11

申请号：US11029014

申请日：2005-01-03

Applicant: Adam Cohen ,  Michael Lockard ,  Kieun Kim ,  Qui Le ,  Gang Zhang ,  Uri Frodis ,  Dale McPherson ,  Dennis Smalley

Inventor： Adam Cohen ,  Michael Lockard ,  Kieun Kim ,  Qui Le ,  Gang Zhang ,  Uri Frodis ,  Dale McPherson ,  Dennis Smalley

IPC: B44C1/22 ,  C03C15/00 ,  C03C25/68 ,  C23C18/16 ,  C23F1/00 ,  C25D5/02 ,  C25D5/10 ,  C25D5/34 ,  H01L21/288 ,  H01L21/44 ,  H01L21/4763 ,  H01L21/768

CPC classification number: B44C1/22 ,  B33Y10/00 ,  B81C1/00492 ,  C03C15/00 ,  C03C25/68 ,  C23C18/1605 ,  C23C18/161 ,  C23C18/1651 ,  C23C18/1653 ,  C23C18/405 ,  C23F1/00 ,  C25D1/003 ,  C25D5/02 ,  C25D5/10 ,  H01L21/2885 ,  H01L21/44 ,  H01L21/4763 ,  H01L21/76885

Abstract: Some embodiments of the present invention are directed to techniques for building up single layer or multi-layer structures on dielectric or partially dielectric substrates. Certain embodiments deposit seed layer material directly onto substrate materials while other embodiments use an intervening adhesion layer material. Some embodiments use different seed layer materials and/or adhesion layer materials for sacrificial and structural conductive building materials. Some embodiments apply seed layer and/or adhesion layer materials in what are effectively selective manners while other embodiments apply the materials in blanket fashion. Some embodiments remove extraneous depositions (e.g. depositions to regions unintended to form part of a layer) via planarization operations while other embodiments remove the extraneous material via etching operations. Other embodiments are directed to the electrochemical fabrication of multilayer mesoscale or microscale structures which are formed using at least one conductive structural material, at least one conductive sacrificial material, and at least one dielectric material. In some embodiments the dielectric material is a UV-curable photopolymer.

公开(公告)号：US06881558B1

公开(公告)日：2005-04-19

申请号：US09888860

申请日：2001-06-25

Applicant: David B. Weiner ,  Donghui Zhang ,  Adam Cohen

Inventor： David B. Weiner ,  Donghui Zhang ,  Adam Cohen

IPC: C12N15/72 ,  C12P21/06 ,  C07H21/04 ,  C12N1/12 ,  C12N15/00 ,  C12P21/04

CPC classification number: C12N15/72

Abstract: Methods of cloning and/or amplifying toxic genes in bacteria using a vector which amplifies the toxic gene in bacteria and also allows subsequent expression in mammalian systems is provided. A vector having an origin of replication, a first promoter, a polylinker, a second promoter in reverse orientation with respect to the first promoter, a poly adenylation signal, and a gene encoding a selectable marker, and optionally an enhancer operably connected to the first promoter, and/or a nucleotide sequence encoding a toxic protein is also provided.

Abstract translation: 使用扩增细菌中的毒性基因并允许随后在哺乳动物系统中表达的载体来克隆和/或扩增细菌中的有毒基因的方法。 具有复制起点的载体，第一启动子，多接头体，相对于第一启动子反向取向的第二启动子，多腺苷酸化信号和编码可选择标记的基因，以及任选地可增强的与第一启动子连接的增强子 启动子，和/或编码毒性蛋白质的核苷酸序列。

公开(公告)号：US20050054945A1

公开(公告)日：2005-03-10

申请号：US10658261

申请日：2003-09-10

Applicant: Adam Cohen ,  John Golden ,  Liem Vu

Inventor： Adam Cohen ,  John Golden ,  Liem Vu

IPC: A61B10/00 ,  A61B10/02 ,  A61B10/06 ,  A61B17/32 ,  A61B17/34 ,  A61B17/24

CPC classification number: A61B10/06 ,  A61B10/0096 ,  A61B17/3462 ,  A61B2010/0225 ,  A61B2017/320064

Abstract: The invention includes a forceps and collection assembly for acquiring and storing a plurality of tissue samples in a single pass, and accompanying mechanisms for use with the forceps and collection assembly. The accompanying mechanisms include an endoscope working channel cap assembly configured to minimize compression of a pouch of the forceps and collection assembly as it traverses a seal of the cap assembly, and a flush adapter configured to be coupled to the pouch so as to assist in removing tissue samples in the pouch by flowing fluid through the pouch.

Abstract translation: 本发明包括用于在单次通过中获取和存储多个组织样本的镊子和收集组件，以及与镊子和收集组件一起使用的伴随机构。 伴随的机构包括：内窥镜工作通道盖组件，其构造成当镊子和收集组件穿过盖组件的密封件时使压缩袋的压缩最小化;以及冲洗适配器，其被配置为联接到该小袋以协助去除 通过使流体流过袋子来在袋中组织样品。

公开(公告)号：US20050045585A1

公开(公告)日：2005-03-03

申请号：US10841382

申请日：2004-05-07

Applicant: Gang Zhang ,  Adam Cohen ,  Michael Lockard ,  Ananda Kumar ,  Ezekiel Kruglick ,  Kieun Kim

Inventor： Gang Zhang ,  Adam Cohen ,  Michael Lockard ,  Ananda Kumar ,  Ezekiel Kruglick ,  Kieun Kim

IPC: C25D1/00 ,  C25D5/02 ,  C25D5/10 ,  C25D5/12 ,  C25D5/14 ,  C25D5/18 ,  C25D5/34 ,  C25D5/40 ,  C25D5/48 ,  C25D5/50 ,  H01L21/288 ,  H01L21/768 ,  H05K3/24 ,  C23F1/00

CPC classification number: C25D5/50 ,  C25D1/003 ,  C25D5/022 ,  C25D5/10 ,  C25D5/12 ,  C25D5/14 ,  C25D5/18 ,  C25D5/34 ,  C25D5/40 ,  C25D5/48 ,  H01L21/2885 ,  H01L21/76879 ,  H05K3/241 ,  H05K3/243

Abstract: Multi-layer microscale or mesoscale structures are fabricated with adhered layers (e.g. layers that are bonded together upon deposition of successive layers to previous layers) and are then subjected to a heat treatment operation that enhances the interlayer adhesion significantly. The heat treatment operation is believed to result in diffusion of material across the layer boundaries and associated enhancement in adhesion (i.e. diffusion bonding). Interlayer adhesion and maybe intra-layer cohesion may be enhanced by heat treating in the presence of a reducing atmosphere that may help remove weaker oxides from surfaces or even from internal portions of layers.

公开(公告)号：US20050029109A1

公开(公告)日：2005-02-10

申请号：US10841384

申请日：2004-05-07

Applicant: Gang Zhang ,  Adam Cohen

Inventor： Gang Zhang ,  Adam Cohen

IPC: C25D1/00 ,  C25D5/02 ,  C25D5/10 ,  C25D5/12 ,  C25D5/14 ,  C25D5/18 ,  C25D5/34 ,  C25D5/40 ,  C25D5/48 ,  C25D5/50 ,  H01L21/288 ,  H01L21/768 ,  H05K3/24

CPC classification number: C25D1/003 ,  C25D5/022 ,  C25D5/10 ,  C25D5/12 ,  C25D5/14 ,  C25D5/18 ,  C25D5/34 ,  C25D5/40 ,  C25D5/48 ,  C25D5/50 ,  H01L21/2885 ,  H01L21/76879 ,  H05K3/241 ,  H05K3/243

Abstract: Multi-layer microscale or mesoscale structures are fabricated with adhered layers (e.g. layers that are bonded together upon deposition of successive layers to previous layers) and are then subjected to a heat treatment operation that enhances the interlayer adhesion significantly. The heat treatment operation is believed to result in diffusion of material across the layer boundaries and associated enhancement in adhesion (i.e. diffusion bonding). Interlayer adhesion and maybe intra-layer cohesion may be enhanced by heat treating in the presence of a reducing atmosphere that may help remove weaker oxides from surfaces or even from internal portions of layers.

Abstract translation: 多层微尺度或中尺度结构用粘附层（例如在连续层沉积到先前层上时结合在一起的层）制造，然后进行显着增强层间粘合的热处理操作。 认为热处理操作导致材料在层边界上的扩散，并且附着力增强（即扩散粘合）。 可以通过在有助于从表面甚至从内部部分去除较弱的氧化物的还原气氛的热处理来增强层间粘附和可能的层内内聚力。

公开(公告)号：US20050023144A1

公开(公告)日：2005-02-03

申请号：US10841001

申请日：2004-05-07

Applicant: Adam Cohen ,  Dennis Smalley

Inventor： Adam Cohen ,  Dennis Smalley

IPC: B81B3/00 ,  G01P15/08 ,  G01P15/125 ,  H01P1/202 ,  H01P3/06 ,  H01P5/18 ,  H01P11/00 ,  H05K3/46 ,  H01L21/00 ,  C25D5/02

CPC classification number: B81C1/00126 ,  B33Y10/00 ,  B81B2201/042 ,  B81C1/00396 ,  B81C2201/032 ,  G01P15/0802 ,  G01P15/125 ,  H01P1/202 ,  H01P3/06 ,  H01P5/183 ,  H01P11/00 ,  H01P11/005 ,  H05K3/4647

Abstract: The invention includes methods of fabrication and apparatuses. In at least some embodiments of the applicants' invention, the methods include processes of: maskless selective deposition of non-layered structures, selective etching and/or deposition without use of a separate mask and/or lithography techniques, retaining selected portions of sacrificial material during removal (e.g. etching) of other portions of sacrificial material, depositing materials other than the structural and sacrificial materials, including more than one type of structural and/or sacrificial material, and fabrication of interlacing elements. Embodiments of the methods of the invention provide increased capabilities, properties, flexibility and in the fabrication of three-dimensional structures by electro-deposition or other techniques. In certain embodiments, the apparatuses of the invention include structures having non-layered elements, retained sacrificial materials, three or more different deposited materials, and interlaced elements.

Abstract translation: 本发明包括制造方法和装置。 在申请人的发明的至少一些实施例中，所述方法包括以下过程：无掩模地选择性沉积非分层结构，选择性蚀刻和/或沉积，而不使用单独的掩模和/或光刻技术，保留牺牲材料的选定部分 在牺牲材料的其它部分的去除（例如蚀刻）期间，沉积除结构和牺牲材料之外的材料，包括多于一种类型的结构和/或牺牲材料，以及制造隔行元件。 本发明的方法的实施例通过电沉积或其他技术提供增强的能力，性质，柔性和制造三维结构。 在某些实施例中，本发明的装置包括具有非层状元件，保留的牺牲材料，三种或更多种不同沉积材料和隔行元件的结构。

公开(公告)号：US4903188A

公开(公告)日：1990-02-20

申请号：US287124

申请日：1988-12-20

Applicant: Suresh Madhavan ,  Adam Cohen ,  Roger Holman

Inventor： Suresh Madhavan ,  Adam Cohen ,  Roger Holman

IPC: H02M7/5387

CPC classification number: H02M7/53875

Abstract: A pulse width modulated inductive load controller including a load switching circuit having a plurality of switches which are operative in pairs; each pair including first and second switch devices for controlling power to a load. Commutation logic enables various sequential combination of pairs of switch devices and a clock defines the operation period of each sequential combination of switch device pairs. Pulse width modulation circuitry controls the closed time interval of the switch devices during the operation period of each combination of switch device pairs. Transition control circuitry maintains closed at least one of the switch devices in each sequential combination of switch device pairs after the other switch device is opened, thereby assuring that any regenerated current from the previously energized load coils is provided a path to recirculate through the load.

公开(公告)号：US10389780B2

公开(公告)日：2019-08-20

申请号：US13763601

申请日：2013-02-08

Applicant: Amit Eshet ,  Adam Cohen ,  Assav Bar Yaccov ,  Nir Radian

Inventor： Amit Eshet ,  Adam Cohen ,  Assav Bar Yaccov ,  Nir Radian

IPC: H04L29/06

Abstract: A computer readable medium and a method for bandwidth management, the method may include receiving or generating (a) video entity quality information for multiple sets of video entities, each set of video entities comprises video entities that belong to different versions of a same video stream, (b) user device screen size information for each user device out of multiple users devices, (c) user device profile information for each user out of multiple users, and (d) bandwidth constraints relating to bandwidth available for transmission of selected video entities to the user devices; wherein each user of the multiple users is associated with a user device of the multiple users devices; selecting for each user device a selected video entity based on at least (a) the video entity quality information, (b) the user device screen size information, (c) the requested video profile information, and (d) the bandwidth constraints; and, streaming to the multiple user devices from multiple selected video entities.

公开(公告)号：US08589999B1

公开(公告)日：2013-11-19

申请号：US12853325

申请日：2010-08-10

Applicant: Adam Cohen ,  Alon Shafrir ,  Edward Stein

Inventor： Adam Cohen ,  Alon Shafrir ,  Edward Stein

IPC: H04N7/173 ,  H04N11/02 ,  H04N7/26 ,  G06K9/36

CPC classification number: H04N21/222 ,  H04N21/23424 ,  H04N21/2347

Abstract: A media processing unit, the media processing unit including: (i) an input interface, configured to receive a second media stream, wherein the second media stream includes first access units and second access units; wherein each second access unit lacks decoding parameters sufficient for full decoding of the second access unit; wherein each first access unit includes decoding parameters required for full decoding of at least one first access unit and of at least one second access unit; (ii) a media-processor, configured to select a selected access unit of the second media stream, and to process the second media stream to provide a processed second media stream by writing into the selected access unit decoding parameters that are responsive to decoding parameters of a previous first access unit; and (iii) a transmitter, configured to transmit the processed second media stream to a splicer.

Abstract translation: 一种媒体处理单元，所述媒体处理单元包括：（i）被配置为接收第二媒体流的输入接口，其中所述第二媒体流包括第一接入单元和第二接入单元; 其中每个第二存取单元缺少足以完全解码第二存取单元的解码参数; 其中每个第一接入单元包括对至少一个第一接入单元和至少一个第二接入单元的完全解码所需的解码参数; （ii）媒体处理器，被配置为选择所述第二媒体流的所选择的接入单元，并且处理所述第二媒体流以通过写入所选择的接入单元中的解码参数来提供经处理的第二媒体流，所述参数响应于解码参数 的先前的第一接入单元; 和（iii）发射机，被配置为将经处理的第二媒体流发送到拼接器。