公开(公告)号：US07910427B1

公开(公告)日：2011-03-22

申请号：US12895357

申请日：2010-09-30

Applicant: Shuji Ikeda ,  Toshiaki Yamanaka ,  Kenichi Kikushima ,  Shinichiro Mitani ,  Kazushige Sato ,  Akira Fukami ,  Masaya Iida ,  Akihiro Shimizu

Inventor： Shuji Ikeda ,  Toshiaki Yamanaka ,  Kenichi Kikushima ,  Shinichiro Mitani ,  Kazushige Sato ,  Akira Fukami ,  Masaya Iida ,  Akihiro Shimizu

IPC: H01L21/8234 ,  H01L29/00

CPC classification number: H01L27/11 ,  G11C11/412 ,  G11C11/4125 ,  H01L21/76895 ,  H01L27/0203 ,  H01L27/0207 ,  H01L27/1104 ,  Y10S257/904

Abstract: A SRAM of complete CMOS type having its memory cell composed of six MISFETs, in which a pair of local wiring lines for connecting the input/output terminals of CMOS inverters are formed of a refractory metal silicide layer formed over a first conducting layer constituting the individual gate electrodes of the drive MISFETs, the transfer MISFETs and the load MISFETs of the memory cell and in which a reference voltage line formed over the local wiring lines is arranged to be superposed over the local wiring lines to form a capacity element. Moreover, the capacity element is formed between the local wiring lines and the first conducting layer by superposing the local wiring lines over the first conducting layer. Moreover, the local wiring lines are formed by using resistance lowering means such as silicification. In addition, there are made common the means for lowering the resistance of the gate electrode of the transfer MISFETs and the means for forming the local wiring lines.

Abstract translation: 一种完整的CMOS型SRAM，其存储单元由六个MISFET组成，其中一对用于连接CMOS反相器的输入/输出端的局部布线由难熔金属硅化物层形成，该难熔金属硅化物层形成在构成个体的第一导电层上 存储单元的驱动MISFET，转移MISFET和负载MISFET的栅极电极，其中形成在局部布线上的参考电压线被布置成叠加在局部布线上以形成电容元件。 此外，通过在第一导电层上叠加局部布线，在局部布线和第一导电层之间形成电容元件。 此外，通过使用诸如硅化的电阻降低装置形成局部布线。 此外，公开了用于降低转移MISFET的栅电极的电阻和用于形成局部布线的装置的手段。

公开(公告)号：US20100301422A1

公开(公告)日：2010-12-02

申请号：US12821329

申请日：2010-06-23

Applicant: Kenichi Osada ,  Masataka Minami ,  Shuji Ikeda ,  Koichiro Ishibashi

Inventor： Kenichi Osada ,  Masataka Minami ,  Shuji Ikeda ,  Koichiro Ishibashi

IPC: H01L27/11

CPC classification number: H01L27/1104 ,  G11C11/412 ,  G11C11/417 ,  H01L27/11 ,  H01L29/4916 ,  H01L29/783 ,  Y10S257/904

Abstract: Prior known static random access memory (SRAM) cells required that a diffusion layer be bent into a key-like shape in order to make electrical contact with a substrate with a P-type well region formed therein, which would result in a decrease in asymmetry leading to occurrence of a problem as to the difficulty in micro-patterning. To avoid this problem, the P-type well region in which an inverter making up an SRAM cell is formed is subdivided into two portions, which are disposed on the opposite sides of an N-type well region NW1 and are formed so that a diffusion layer forming a transistor has no curvature while causing the layout direction to run in a direction parallel to well boundary lines and bit lines. At intermediate locations of an array, regions for use in supply power to the substrate are formed in parallel to word lines in such a manner that one region is provided per group of thirty two memory cell rows or sixty four cell rows.

Abstract translation: 现有已知的静态随机存取存储器（SRAM）单元需要将扩散层弯曲成键状形状，以便与其中形成有P型阱区的衬底电接触，这将导致不对称性的降低 导致出现微图案化困难的问题。 为了避免这个问题，构成SRAM单元的逆变器的P型阱区被细分成两部分，它们设置在N型阱区NW1的相对侧上，并形成为扩散 形成晶体管的层没有曲率，同时使得布局方向在平行于阱边界线和位线的方向上运行。 在阵列的中间位置处，用于向衬底供电的区域形成为平行于字线，以这样的方式，每组三十二个存储单元行或六十六个单元行提供一个区域。

公开(公告)号：US07598558B2

公开(公告)日：2009-10-06

申请号：US11926321

申请日：2007-10-29

Applicant: Naotaka Hashimoto ,  Yutaka Hoshino ,  Shuji Ikeda

Inventor： Naotaka Hashimoto ,  Yutaka Hoshino ,  Shuji Ikeda

IPC: H01L27/108

CPC classification number: H01L27/11 ,  G11C11/4125 ,  H01L23/5222 ,  H01L27/0207 ,  H01L27/1104 ,  H01L27/1112 ,  H01L2924/0002 ,  Y10S257/903 ,  H01L2924/00

Abstract: In a complete CMOS SRAM having a memory cell composed of six MISFETs formed over a substrate, a capacitor element having a stack structure is formed of a lower electrode covering the memory cell, an upper electrode, and a capacitor insulating film (dielectric film) interposed between the lower electrode and the upper electrode. One electrode (the lower electrode) of the capacitor element is connected to one storage node of a flip-flop circuit, and the other electrode (the upper electrode) is connected to the other storage node. As a result, the storage node capacitance of the memory cell of the SRAM is increased to improve the soft error resistance.

Abstract translation: 在具有由衬底上形成的六个MISFET构成的存储单元的完整CMOS SRAM中，具有堆叠结构的电容器元件由覆盖存储单元的下电极，上电极和插入了电容器绝缘膜（电介质膜）的电极形成 在下电极和上电极之间。 电容器元件的一个电极（下电极）连接到触发器电路的一个存储节点，另一个电极（上电极）连接到另一个存储节点。 结果，SRAM的存储单元的存储节点电容增加，以提高软错误电阻。

公开(公告)号：US20090218608A1

公开(公告)日：2009-09-03

申请号：US12362995

申请日：2009-01-30

Applicant: Akio NISHIDA ,  Yasuko Yoshida ,  Shuji Ikeda

Inventor： Akio NISHIDA ,  Yasuko Yoshida ,  Shuji Ikeda

IPC: H01L27/11

CPC classification number: H01L27/11 ,  H01L27/1104

Abstract: In order to provide a semiconductor integrated circuit device such as a high-performance semiconductor integrated circuit device capable of reducing a soft error developed in each memory cell of a SRAM, the surface of a wiring of a cross-connecting portion, of a SRAM memory cell having a pair of n-channel type MISFETs whose gate electrodes and drains are respectively cross-connected, is formed in a shape that protrudes from the surface of a silicon oxide film. A silicon nitride film used as a capacitive insulating film, and an upper electrode are formed on the wiring. A capacitance can be formed of the wiring, the silicon nitride film and the upper electrode.

Abstract translation: 为了提供一种半导体集成电路器件，例如能够减少在SRAM的每个存储单元中产生的软错误的高性能半导体集成电路器件，SRAM存储器的交叉连接部分的布线表面 其栅电极和漏极分别交叉连接的一对n沟道型MISFET形成为从氧化硅膜的表面突出的形状。 在布线上形成用作电容绝缘膜的氮化硅膜和上电极。 电容可以由布线，氮化硅膜和上电极形成。

公开(公告)号：US07456486B2

公开(公告)日：2008-11-25

申请号：US11826491

申请日：2007-07-16

Applicant: Shuji Ikeda ,  Toshiaki Yamanaka ,  Kenichi Kikushima ,  Shinichiro Mitani ,  Kazushige Sato ,  Akira Fukami ,  Masaya Iida ,  Akihiro Shimizu

Inventor： Shuji Ikeda ,  Toshiaki Yamanaka ,  Kenichi Kikushima ,  Shinichiro Mitani ,  Kazushige Sato ,  Akira Fukami ,  Masaya Iida ,  Akihiro Shimizu

IPC: H01L29/00 ,  H01L21/8234

CPC classification number: H01L27/11 ,  G11C11/412 ,  G11C11/4125 ,  H01L21/76895 ,  H01L27/0203 ,  H01L27/0207 ,  H01L27/1104 ,  Y10S257/904

Abstract: A SRAM of complete CMOS type having its memory cell composed of six MISFETs, in which a pair of local wiring lines for connecting the input/output terminals of CMOS inverters are formed of a refractory metal silicide layer formed over a first conducting layer constituting the individual gate electrodes of the drive MISFETs, the transfer MISFETs and the load MISFETs of the memory cell and in which a reference voltage line formed over the local wiring lines is arranged to be superposed over the local wiring lines to form a capacity element. Moreover, the capacity element is formed between the local wiring lines and the first conducting layer by superposing the local wiring lines over the first conducting layer. Moreover, the local wiring lines are formed by using resistance lowering means such as silicification. In addition, there are made common the means for lowering the resistance of the gate electrode of the transfer MISFETs and the means for forming the local wiring lines.

公开(公告)号：US20070184603A1

公开(公告)日：2007-08-09

申请号：US11783187

申请日：2007-04-06

Applicant: Shinji Nishihara ,  Shuji Ikeda ,  Naotaka Hashimoto ,  Hiroshi Momiji ,  Hiromi Abe ,  Shinichi Fukada ,  Masayuki Suzuki

Inventor： Shinji Nishihara ,  Shuji Ikeda ,  Naotaka Hashimoto ,  Hiroshi Momiji ,  Hiromi Abe ,  Shinichi Fukada ,  Masayuki Suzuki

IPC: H01L21/8238

CPC classification number: H01L21/823814 ,  C23C14/16 ,  C23C14/3414 ,  H01L21/28518 ,  H01L21/2855 ,  H01L21/31608 ,  H01L21/76229 ,  H01L21/76828 ,  H01L21/823835 ,  H01L21/823842 ,  H01L21/823871 ,  H01L23/53223 ,  H01L29/456 ,  H01L29/4933 ,  H01L29/665 ,  H01L29/6656 ,  H01L29/6659 ,  H01L29/7833 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A Co silicide layer having a low resistance and a small junction leakage current is formed on the surface of the gate electrode, source and drain of MOSFETS by silicidizing a Co film deposited on a main plane of a wafer by sputtering using a high purity Co target having a Co purity of at least 99.99% and Fe and Ni contents of not greater than 10 ppm, preferably having a Co purity of 99.999%.

Abstract translation: 在MOSFET的栅电极，源极和漏极的表面上形成具有低电阻和小的漏电流的Co硅化物层，通过使用高纯度Co靶溅射沉积在晶片的主平面上的Co膜， Co纯度至少为99.99％，Fe和Ni含量不大于10ppm，Co的纯度优选为99.999％。

公开(公告)号：US20070114606A1

公开(公告)日：2007-05-24

申请号：US11649264

申请日：2007-01-04

Applicant: Yutaka Hoshino ,  Shuji Ikeda ,  Isao Yoshida ,  Shiro Kamohara ,  Megumi Kawakami ,  Tomoyuki Miyake ,  Masatoshi Morikawa

Inventor： Yutaka Hoshino ,  Shuji Ikeda ,  Isao Yoshida ,  Shiro Kamohara ,  Megumi Kawakami ,  Tomoyuki Miyake ,  Masatoshi Morikawa

IPC: H01L29/76

CPC classification number: H01L29/66659 ,  H01L21/823475 ,  H01L21/823871 ,  H01L23/4827 ,  H01L23/53219 ,  H01L23/53295 ,  H01L27/0255 ,  H01L27/088 ,  H01L29/0692 ,  H01L29/0696 ,  H01L29/0847 ,  H01L29/086 ,  H01L29/1045 ,  H01L29/105 ,  H01L29/1083 ,  H01L29/4175 ,  H01L29/41758 ,  H01L29/42368 ,  H01L29/4238 ,  H01L29/4916 ,  H01L29/7835 ,  H01L29/861 ,  H01L2924/0002 ,  H01L2924/3011 ,  H01L2924/00

Abstract: In a high frequency amplifying MOSFET having a drain offset region, the size is reduced and the on-resistance is decreased by providing conductor plugs 13 (P1) for leading out electrodes on a source region 10, a drain region 9 and leach-through layers 3 (4), to which a first layer wirings 11a, 11d (M1) are connected and, further, backing second layer wirings 12a to 12d are connected on the conductor plugs 13 (P1) to the first layer wirings 11s, 11d (M1).

Abstract translation: 在具有漏极偏移区域的高频放大MOSFET中，通过提供用于在源极区域10，漏极区域9和漏电极上引出电极的导体插头13（P 1），尺寸减小并且导通电阻降低 连接有第一层布线11a，11d（M1）的层3（4），并且另外，背面的第二层布线12a至12d在导体塞13（P1）上连接到第一层 层布线11s，11d（M 1）。

公开(公告)号：US07135732B2

公开(公告)日：2006-11-14

申请号：US10479703

申请日：2002-06-04

Applicant: Tomio Iwasaki ,  Hiroshi Moriya ,  Hideo Miura ,  Shuji Ikeda

Inventor： Tomio Iwasaki ,  Hiroshi Moriya ,  Hideo Miura ,  Shuji Ikeda

IPC: H01L27/108

CPC classification number: H01L29/517 ,  H01L21/28185 ,  H01L21/28194 ,  H01L21/31604 ,  H01L27/10814 ,  H01L28/40 ,  H01L28/60 ,  H01L29/513

Abstract: In order to supply a semiconductor device having high-reliability, there are used a first capacitor electrode, a capacitor insulating film formed in contact with the first capacitor electrode and mainly composed of titanium oxide, and a second capacitor electrode formed in contact with the capacitor insulating film, and there is used a conductive oxide film mainly composed of ruthenium oxide or iridium oxide for the first capacitor electrode and the second capacitor electrode. Alternatively, there is used a gate insulating film having a titanium silicate film and titanium oxide which suppress leakage current.

Abstract translation: 为了提供具有高可靠性的半导体器件，使用第一电容器电极，形成为与第一电容器电极接触并主要由氧化钛构成的电容器绝缘膜，以及形成为与电容器接触的第二电容器电极 并且使用主要由氧化钌或氧化铱构成的导电氧化物膜用于第一电容器电极和第二电容器电极。 或者，使用具有抑制漏电流的钛硅酸盐膜和氧化钛的栅极绝缘膜。

公开(公告)号：US20060214254A1

公开(公告)日：2006-09-28

申请号：US11443226

申请日：2006-05-31

Applicant: Norio Ishitsuka ,  Tomio Iwasaki ,  Hiroyuki Ohta ,  Hideo Miura ,  Masahito Takahashi ,  Norio Suzuki ,  Shuji Ikeda ,  Hideki Tanaka ,  Hiroyuki Mima

Inventor： Norio Ishitsuka ,  Tomio Iwasaki ,  Hiroyuki Ohta ,  Hideo Miura ,  Masahito Takahashi ,  Norio Suzuki ,  Shuji Ikeda ,  Hideki Tanaka ,  Hiroyuki Mima

IPC: H01L29/00

CPC classification number: H01L27/11526 ,  H01L21/28123 ,  H01L21/76224 ,  H01L21/823481 ,  H01L27/105 ,  H01L27/11546

Abstract: To suppress occurrence of defects in a semiconductor substrate, a semiconductor device is constituted by having: the semiconductor substrate; an element isolating region having a trench formed in the semiconductor substrate and an embedding insulating film which is embedded into the trench; an active region formed adjacent to the element isolating region, in which a gate insulating film is formed and a gate electrode is formed on the gate insulating film; and a region formed in such a manner that at least a portion of the gate electrode is positioned on the element isolating region, and a first edge surface of an upper side of the embedding insulating film in a first element isolating region where the gate electrode is positioned is located above a second edge surface of the embedding insulating film in a second element isolating region where the gate electrode film is not positioned.

Abstract translation: 为了抑制半导体衬底中的缺陷的发生，半导体器件通过具有：半导体衬底; 具有形成在所述半导体衬底中的沟槽的元件隔离区域和嵌入所述沟槽中的嵌入绝缘膜; 形成在元件隔离区域附近形成的有源区，其中形成栅极绝缘膜并在栅极绝缘膜上形成栅电极; 以及形成为使得栅电极的至少一部分位于元件隔离区域上的区域，以及在栅电极为第一元件隔离区域的嵌入绝缘膜的上侧的第一边缘表面 定位在位于绝缘膜的第二边缘表面上方的第二元件隔离区域中，栅极电极膜未被定位。

公开(公告)号：US06940118B2

公开(公告)日：2005-09-06

申请号：US10299197

申请日：2002-11-18

Applicant: Tomio Iwasaki ,  Hiroshi Moriya ,  Hideo Miura ,  Shuji Ikeda

Inventor： Tomio Iwasaki ,  Hiroshi Moriya ,  Hideo Miura ,  Shuji Ikeda

IPC: H01L21/02 ,  H01L21/28 ,  H01L21/316 ,  H01L21/822 ,  H01L21/8242 ,  H01L21/8246 ,  H01L21/8247 ,  H01L27/04 ,  H01L27/105 ,  H01L27/108 ,  H01L29/423 ,  H01L29/43 ,  H01L29/49 ,  H01L29/51 ,  H01L29/78 ,  H01L29/788 ,  H01L29/792 ,  H01L29/76 ,  H01L29/94 ,  H01L31/119

CPC classification number: H01L29/517 ,  H01L21/28185 ,  H01L21/28194 ,  H01L21/31641 ,  H01L21/31645 ,  H01L27/10873 ,  H01L28/56 ,  H01L28/57 ,  H01L29/4975 ,  H01L29/513

Abstract: A semiconductor device has a gate dielectric film formed of zirconium oxide or hafnium oxide as a chief material and a gate electrode film in contact with the gate dielectric film on one principal surface side of a silicon substrate. The gate dielectric film contains an addition element to prevent diffusion of oxygen.

Abstract translation: 半导体器件具有由氧化锆或氧化铪形成的栅极电介质膜和与硅衬底的一个主表面侧的栅极电介质膜接触的栅电极膜。 栅极电介质膜含有防止氧扩散的添加元素。