Method of preparing a semiconductor device
    41.
    发明授权
    Method of preparing a semiconductor device 失效
    半导体器件的制备方法

    公开(公告)号:US4560582A

    公开(公告)日:1985-12-24

    申请号:US618174

    申请日:1984-06-07

    Inventor: Matsuo Ichikawa

    CPC classification number: H01L21/22 H01L29/0847 H01L29/78 Y10S257/919

    Abstract: A semiconductor device including a MOS field effect transistor formed on a single silicon crystal substrate having source and drain diffused regions of reduced depth. In order to avoid penetration of aluminum from the aluminum connector through the diffused region into the substrate, the diffused region is formed by double diffusion of at least two types of impurities of the same conductive type, but having different diffusion coefficients with respect to each other.

    Abstract translation: 一种半导体器件,包括形成在具有较低深度的源极和漏极扩散区域的单个硅晶体衬底上的MOS场效应晶体管。 为了避免铝从铝连接器穿过扩散区域进入衬底,扩散区域由相同导电类型的至少两种类型的杂质的双扩散形成,但是相对于彼此具有不同的扩散系数 。

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