公开(公告)号：US20140145799A1

公开(公告)日：2014-05-29

申请号：US13726668

申请日：2012-12-26

申请人： TELEFONAKTIEBOLAGET L M ERICSSON (PUBL)

发明人： Chunyun JIAN ,  Somsack SYCHALEUN

IPC分类号： H03H9/58 ,  H03H9/64

CPC分类号： H03H9/6409 ,  H01L2224/48091 ,  H01L2224/49113 ,  H03H3/02 ,  H03H3/08 ,  H03H9/0514 ,  H03H9/0542 ,  H03H9/059 ,  H03H9/08 ,  H03H9/542 ,  H03H9/547 ,  H03H9/605 ,  H03H9/6423 ,  H03H9/6426 ,  H03H9/6483 ,  H03H2009/0019 ,  Y10T29/42 ,  H01L2924/00014

摘要： A method and system for an acoustic wave band reject filter are disclosed. According to one aspect, an acoustic wave band reject filter includes a substrate and a plurality of acoustic wave band reject filter blocks. The substrate includes bonding pads formed on the substrate. Each one of the plurality of acoustic wave band reject filter blocks is fixed on a separate die. Each separate die has solder balls on a side of the die facing the substrate. The solder balls are positioned to electrically connect the bonding pads formed on the substrate to positions on each of the die.

摘要翻译： 公开了一种声波阻带滤波器的方法和系统。 根据一个方面，声波波段抑制滤波器包括基板和多个声波波段滤波器块。 衬底包括形成在衬底上的接合焊盘。 多个声波波段滤波器块中的每一个固定在单独的管芯上。 每个单独的模具在面向基板的模具的一侧上具有焊球。 焊球被定位成将形成在衬底上的焊盘电连接到每个裸片上的位置。

公开(公告)号：US20100219717A1

公开(公告)日：2010-09-02

申请号：US12784564

申请日：2010-05-21

申请人： Tsutomu TAKAI ,  Norihiro HAYAKAWA ,  Taro NISHINO

发明人： Tsutomu TAKAI ,  Norihiro HAYAKAWA ,  Taro NISHINO

IPC分类号： H01L41/053

CPC分类号： H03H9/02984 ,  H01L2224/05001 ,  H01L2224/05568 ,  H01L2224/0557 ,  H01L2224/16225 ,  H01L2924/00014 ,  H01L2924/181 ,  H03H9/02937 ,  H03H9/059 ,  H03H9/1078 ,  H03H9/1085 ,  H03H2009/0019 ,  H01L2924/00012 ,  H01L2224/05599 ,  H01L2224/05099

摘要： An acoustic wave device includes an acoustic wave element including an IDT electrode provided on a substrate, and a protective film arranged to cover the acoustic wave element so as to stabilize characteristics. The protective film is a silicon nitride film composed of silicon and nitrogen as main components and when a composition ratio of the silicon to the nitrogen is represented by 1:X, X is about 1.15 or less.

摘要翻译： 声波装置包括包括设置在基板上的IDT电极的声波元件和布置成覆盖声波元件以保持特性的保护膜。 保护膜是以硅和氮为主要成分的氮化硅膜，当硅与氮的组成比由1：X表示时，X为1.15以下。

公开(公告)号：US20080246557A1

公开(公告)日：2008-10-09

申请号：US12067728

申请日：2006-09-19

申请人： Juergen Kiwitt ,  Maximilian Pitsch

发明人： Juergen Kiwitt ,  Maximilian Pitsch

IPC分类号： H03H9/64 ,  H03H9/72

CPC分类号： H03H9/0028 ,  H03H9/02834 ,  H03H9/6433 ,  H03H9/725 ,  H03H2009/0019

摘要： A component includes a first filter configured to work with acoustic waves. The first filter includes a first sub-filter on a first chip and a second sub-filter on a second chip separate from the first chip. The first filter if a different type of filter, has a different layer structure, or has a different layer thicknesses for at least one layer in comparison to the second filter.

摘要翻译： 组件包括被配置为处理声波的第一滤波器。 第一滤波器包括在第一芯片上的第一子滤波器和与第一芯片分离的第二芯片上的第二子滤波器。 如果不同类型的过滤器具有不同的层结构，或者与第二过滤器相比，对于至少一个层具有不同的层厚度，则第一过滤器。

公开(公告)号：US07116187B2

公开(公告)日：2006-10-03

申请号：US10699779

申请日：2003-11-04

申请人： Kenji Inoue

发明人： Kenji Inoue

IPC分类号： H03H9/64 ,  H03H9/72

CPC分类号： H03H9/725 ,  H03H3/08 ,  H03H9/0576 ,  H03H9/1071 ,  H03H9/6483 ,  H03H9/72 ,  H03H2009/0019

摘要： The SAW element 11 comprises a serial arm 17 formed between an input terminal 15 and an output terminal 16, two serial arm side SAW resonators 20 located in the serial arm 17, at least three parallel arms 19 connected between the serial arm 17 and a reference potential terminal 18, and parallel arm side SAW resonator 21 located in the parallel arms 19, respectively. Each of these parallel arm side SAW resonators 21 has an anti-resonant frequency corresponding with the predetermined resonant frequency of each serial arm side SAW resonator 20. Further, at least one parallel arm side SAW resonator 21 has a resonant frequency different from those of the other parallel arm side SAW resonators 21. Thereby, not only insertion loss can be prevented from being deteriorated but also an attenuation characteristic of the SAW element 11 can be readily varied.

摘要翻译： SAW元件11包括形成在输入端子15和输出端子16之间的串联臂17，位于串联臂17中的两个串联臂侧SAW谐振器20，连接在串联臂17和参考电压之间的至少三个并联臂19 电位端子18和分别位于平行臂19中的平行臂侧SAW谐振器21。 这些并联臂侧SAW谐振器21中的每一个具有与每个串行臂侧SAW谐振器20的预定谐振频率相对应的反谐振频率。 此外，至少一个平行臂侧SAW谐振器21具有与其他并联臂侧SAW谐振器21不同的谐振频率。 因此，不仅可以防止插入损耗的恶化，而且可以容易地改变SAW元件11的衰减特性。

公开(公告)号：US07012323B2

公开(公告)日：2006-03-14

申请号：US10452333

申请日：2003-06-02

申请人： Michael Warner ,  Belgacem Haba ,  Masud Beroz

发明人： Michael Warner ,  Belgacem Haba ,  Masud Beroz

IPC分类号： H01L23/48

CPC分类号： G06F21/10 ,  G06F2221/2129 ,  H01F17/0033 ,  H01L23/24 ,  H01L23/3107 ,  H01L23/3114 ,  H01L23/36 ,  H01L23/3675 ,  H01L23/4334 ,  H01L23/49531 ,  H01L23/49575 ,  H01L23/49822 ,  H01L23/49838 ,  H01L23/49861 ,  H01L23/5387 ,  H01L23/552 ,  H01L23/645 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/50 ,  H01L25/0652 ,  H01L25/0657 ,  H01L25/16 ,  H01L2223/6611 ,  H01L2224/05569 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/05599 ,  H01L2224/12105 ,  H01L2224/16145 ,  H01L2224/16235 ,  H01L2224/32145 ,  H01L2224/32245 ,  H01L2224/45014 ,  H01L2224/45099 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48225 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/4911 ,  H01L2224/73204 ,  H01L2224/73207 ,  H01L2224/73253 ,  H01L2224/73257 ,  H01L2224/73265 ,  H01L2224/85207 ,  H01L2224/85399 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/0652 ,  H01L2225/06527 ,  H01L2225/06541 ,  H01L2225/06551 ,  H01L2225/06568 ,  H01L2225/06572 ,  H01L2225/06579 ,  H01L2225/06582 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01007 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01031 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01061 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/15331 ,  H01L2924/15787 ,  H01L2924/16152 ,  H01L2924/19011 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19103 ,  H01L2924/19104 ,  H01L2924/19105 ,  H01L2924/19107 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H03H9/0542 ,  H03H9/0547 ,  H03H9/1064 ,  H03H2009/0019 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00012

摘要： Inductors are provided in chip assemblies such as in packaged semiconductor chips. The inductors may be incorporated in a chip carrier which forms part of the package, and may include, for example, spiral or serpentine inductors formed from traces on the chip carrier. The chip carrier may include a flap bearing the inductive element, and this flap may be bent to tilt the inductive element out of the plane of the chip carrier to reduce electromagnetic interaction between the inductive element and surrounding electrical components. Other inductors include solenoids formed in part by leads on the chip carrier as, for example, by displacing leads out of the plane of the chip carrier to form loops in vertically-extensive planes transverse to the plane of the chip carrier. Additional features provide trimming of the inductor to a desired inductance value during by breaking or connecting leads during assembly.

摘要翻译： 电感器设置在诸如封装半导体芯片的芯片组件中。 电感器可以结合在构成封装的一部分的芯片载体中，并且可以包括例如由芯片载体上的迹线形成的螺旋或蛇形电感器。 芯片载体可以包括承载感应元件的翼片，并且该翼片可以被弯曲以将感应元件倾斜到芯片载体的平面之外，以减小电感元件和周围的电气部件之间的电磁相互作用。 其他电感器包括由芯片载体上的引线部分地形成的螺线管，例如通过将引线移出芯片载体的平面而在横向于芯片载体的平面的垂直方向的平面中形成环。 附加特征提供了在组装期间通过断开或连接引线将电感器修整到期望的电感值。

公开(公告)号：US20060012450A1

公开(公告)日：2006-01-19

申请号：US11169292

申请日：2005-06-28

申请人： Wataru Koga ,  Kiyohiro Iioka ,  Mitsutaka Shimada ,  Shinichiro Kitanishi

发明人： Wataru Koga ,  Kiyohiro Iioka ,  Mitsutaka Shimada ,  Shinichiro Kitanishi

IPC分类号： H03H9/64

CPC分类号： H03H9/1085 ,  H01L24/97 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01018 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/15787 ,  H03H3/08 ,  H03H2009/0019 ,  Y10T29/42 ,  Y10T428/24083 ,  Y10T428/24099 ,  H01L2224/81 ,  H01L2924/00

摘要： A plurality of surface acoustic wave elements, with an IDT electrode 2 and a pad electrode 3 formed on the principal surface of a piezoelectric substrate 1, are formed to be flip-chip mounted on a circuit board 5 and sealed using sealing resin 7. The circuit board 5 is diced integrally with the sealing resin 7 applying a rotating dicing blade 8 from the bottom surface side thereof to produce a plurality of surface acoustic wave devices. The side surfaces of the surface acoustic wave devices can be formed perpendicularly with dimensional accuracy without rounding or chipping an edge portion of the sealing resin 7.

摘要翻译： 形成在压电基板1的主面上形成有IDT电极2和焊盘电极3的多个声表面波元件被倒装安装在电路板5上，并使用密封树脂7密封。 电路板5与密封树脂7一体地切割，从密封树脂7的底面侧施加旋转的切割刀片8，以产生多个表面声波装置。 表面声波装置的侧面可以垂直于尺寸精度形成，而不会使密封树脂7的边缘部分变圆或碎裂。

公开(公告)号：US06683515B1

公开(公告)日：2004-01-27

申请号：US09666814

申请日：2000-09-21

申请人： Hiroyuki Nakamura ,  Kenji Monma ,  Toru Yamada ,  Kazunori Nishimura

发明人： Hiroyuki Nakamura ,  Kenji Monma ,  Toru Yamada ,  Kazunori Nishimura

IPC分类号： H03H964

CPC分类号： H03H9/74 ,  H03H9/02779 ,  H03H2009/0019 ,  H03H2250/00 ,  H04B7/084

摘要： A surface-acoustic-wave filter has a piezoelectric substrate; and a plurality of transversal surface-acoustic-wave (SAW) filters set on the piezoelectric substrate and respectively having at least two inter-digital transducer (IDT) electrodes for transcieving surface acoustic waves, characterized in that periods for surface acoustic waves to propagate from inputs to outputs of the SAW filters differ in the SAW filters and thereby, timings of outputs from the SAW filters are different from each other.

摘要翻译： 表面声波滤波器具有压电基板; 和多个横向表面声波（SAW）滤波器，其设置在压电基片上并且分别具有至少两个用于转换表面声波的数字间转换器（IDT）电极，其特征在于，声表面波的周期从 在SAW滤波器中SAW滤波器的输出的输入不同，因此来自SAW滤波器的输出的定时彼此不同。

公开(公告)号：US20030062969A1

公开(公告)日：2003-04-03

申请号：US10253988

申请日：2002-09-25

申请人： TDK Corporation

发明人： Kenji Inoue

IPC分类号： H03H009/00

CPC分类号： H03H9/725 ,  H03H3/08 ,  H03H9/0576 ,  H03H9/1071 ,  H03H9/6483 ,  H03H9/72 ,  H03H2009/0019

摘要： The SAW element 11 comprises a serial arm 17 formed between an input terminal 15 and an output terminal 16, two serial arm side SAW resonators 20 located in the serial arm 17, at least three parallel arms 19 connected between the serial arm 17 and a reference potential terminal 18, and parallel arm side SAW resonator 21 located in the parallel arms 19, respectively. Each of these parallel arm side SAW resonators 21 has an anti-resonant frequency corresponding with the predetermined resonant frequency of each serial arm side SAW resonator 20. Further, at least one parallel arm side SAW resonator 21 has a resonant frequency different from those of the other parallel arm side SAW resonators 21. Thereby, not only insertion loss can be prevented from being deteriorated but also an attenuation characteristic of the SAW element 11 can be readily varied.

摘要翻译： SAW元件11包括形成在输入端子15和输出端子16之间的串联臂17，位于串联臂17中的两个串联臂侧SAW谐振器20，连接在串联臂17和参考电压之间的至少三个并联臂19 电位端子18和分别位于平行臂19中的平行臂侧SAW谐振器21。 这些平行臂侧SAW谐振器21中的每一个具有与每个串行臂侧SAW谐振器20的预定谐振频率对应的反谐振频率。此外，至少一个并联臂侧SAW谐振器21具有与 其他的平行臂侧SAW谐振器21.因此，不仅可以防止插入损耗的恶化，而且可以容易地改变SAW元件11的衰减特性。

公开(公告)号：US20020057037A1

公开(公告)日：2002-05-16

申请号：US10042196

申请日：2002-01-11

发明人： Rieko Chujo

IPC分类号： H01L041/04 ,  H04R017/00

CPC分类号： H03H9/059 ,  H01L2224/13012 ,  H01L2224/13144 ,  H01L2224/81205 ,  H01L2224/81801 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H03H2009/0019 ,  Y10T29/42 ,  H01L2224/0401

摘要： An attempt is made to reduce the size of a multichip package obtained by mounting a plurality of surface acoustic wave elements having different frequency characteristics in one package. For this purpose, when a plurality of surface acoustic wave elements are face-down bonded to a package, the ultrasound wave application direction is set to a direction substantially perpendicular to the direction in which the surface acoustic wave elements are juxtaposed.

摘要翻译： 尝试通过将具有不同频率特性的多个声表面波元件安装在一个封装中而获得的多芯片封装的尺寸减小。 为此，当将多个表面声波元件面朝下地接合到封装体上时，将超声波施加方向设定为与表面声波元件并置的方向大致垂直的方向。

公开(公告)号：US6075307A

公开(公告)日：2000-06-13

申请号：US15827

申请日：1998-01-29

申请人： Eiichi Fukiharu

发明人： Eiichi Fukiharu

IPC分类号： H03H9/25 ,  H03H3/08 ,  H03H9/05 ,  H03H9/72

CPC分类号： H03H9/0585 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48237 ,  H01L2924/16152 ,  H03H2009/0019

摘要： A surface acoustic wave system having a mounting receptacle on which there are mounted a plurality of surface acoustic wave elements being bonded together by sides of their surface acoustic wave substrates so as to form a single element assembly. With this structure, a plurality of surface acoustic wave elements can be treated as one surface acoustic wave element in the mounting process, and so less problem is taken in the mounting process. For there is no need for saving a space between two neighboring surface acoustic wave elements for the mounting process, the mounting density can be increased. Further, it is possible to bond together the surface acoustic wave elements having different surface acoustic wave substrates and treat the bonded elements as one element, which provides more flexibility to the system design.

摘要翻译： 一种具有安装座的表面声波系统，其上安装有多个表面声波元件，它们通过其声表面波衬底的侧面结合在一起，以形成单个元件组件。 利用这种结构，在安装过程中可以将多个表面声波元件作为一个声表面波元件来处理，因此在安装过程中不太多的问题。 由于不需要在用于安装过程的两个相邻表面声波元件之间节省空间，所以可以提高安装密度。 此外，可以将具有不同表面声波基板的表面声波元件结合在一起，并将接合元件作为一个元件，这为系统设计提供了更大的灵活性。