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    ACOUSTIC WAVE BAND REJECT FILTER
    1.
    发明申请
    ACOUSTIC WAVE BAND REJECT FILTER 有权
    声波波带防雷滤波器

    公开(公告)号：US20140145800A1

    公开(公告)日：2014-05-29

    申请号：US13788587

    申请日：2013-03-07

    申请人： TELEFONAKTIEBOLAGET L M ERICSSON (PUBL)

    发明人： Chunyun JIAN ,  Somsack SYCHALEUN

    IPC分类号： H03H9/46 ,  H03H9/64

    CPC分类号： H03H9/46 ,  H03H9/542 ,  H03H9/547 ,  H03H9/605 ,  H03H9/64 ,  H03H9/6409 ,  H03H9/6483

    摘要： A method and system for an acoustic wave band reject filter are disclosed. According to one aspect, an acoustic wave band reject filter includes a substrate and a plurality of acoustic wave band reject filter circuit blocks. The substrate includes bonding pads formed on the substrate. Each one of the plurality of acoustic wave band reject filter circuit blocks is fixed on a separate die. Each separate die has solder balls on a side of the die facing the substrate. The solder balls are positioned to electrically connect the bonding pads formed on the substrate to electrodes of the dies

    摘要翻译： 公开了一种声波阻带滤波器的方法和系统。 根据一个方面，声波波段抑制滤波器包括基板和多个声波波段的滤波器电路块。 衬底包括形成在衬底上的接合焊盘。 多个声波波段滤波器电路块中的每一个被固定在单独的管芯上。 每个单独的模具在面向基板的模具的一侧上具有焊球。 焊球被定位成将形成在衬底上的焊盘电连接到管芯的电极

    FLIP CHIP TYPE SAW BAND REJECT FILTER DESIGN
    2.
    发明申请
    FLIP CHIP TYPE SAW BAND REJECT FILTER DESIGN 审中-公开
    FLIP芯片类型SAW BAND拒绝滤波器设计

    公开(公告)号：US20160056792A1

    公开(公告)日：2016-02-25

    申请号：US14933490

    申请日：2015-11-05

    申请人： Telefonaktiebolaget L M Ericsson (publ)

    发明人： Chunyun JIAN

    IPC分类号： H03H9/25 ,  H03H3/02 ,  H03H9/64

    CPC分类号： H03H9/02992 ,  H03H3/02 ,  H03H9/25 ,  H03H9/64 ,  H03H9/6409

    摘要： A method and system for providing a surface acoustic wave band reject filter are disclosed. According to one aspect, a surface acoustic wave band reject filter includes a substrate having electrode bars and bonding pads formed on the substrate. The filter further includes at least one die having a side facing the substrate. A plurality of surface acoustic wave resonators are formed on the at least one die formed on the substrate. Solder balls formed on a side of the at least one die facing the substrate are positioned to engage bonding pads on the substrate. The plurality of surface acoustic wave resonators collectively exhibit a band reject filter response.

    摘要翻译： 公开了一种用于提供表面声波阻带滤波器的方法和系统。 根据一个方面，声表面波阻带滤波器包括具有形成在基板上的电极棒和接合焊盘的基板。 该过滤器还包括至少一个具有面向衬底的一个模具。 在形成在基板上的至少一个模具上形成多个表面声波谐振器。 形成在面向衬底的至少一个管芯的一侧上的焊球被定位成接合衬底上的接合焊盘。 多个表面声波谐振器共同呈现带阻滤波器响应。

    FLIP CHIP TYPE SAW BAND REJECT FILTER DESIGN
    4.
    发明申请
    FLIP CHIP TYPE SAW BAND REJECT FILTER DESIGN 有权
    FLIP芯片类型SAW BAND拒绝滤波器设计

    公开(公告)号：US20140218133A1

    公开(公告)日：2014-08-07

    申请号：US13760651

    申请日：2013-02-06

    申请人： TELEFONAKTIEBOLAGET L M ERICSSON (PUBL)

    发明人： Chunyun JIAN

    IPC分类号： H03H9/64

    CPC分类号： H03H9/02992 ,  H03H3/02 ,  H03H9/25 ,  H03H9/64 ,  H03H9/6409

    摘要： A method and system for providing a surface acoustic wave band reject filter are disclosed. According to one aspect, a surface acoustic wave band reject filter includes a substrate having electrode bars and bonding pads formed on the substrate. The filter further includes at least one die having a side facing the substrate. A plurality of surface acoustic wave resonators are formed on the at least one die formed on the substrate. Solder balls formed on a side of the at least one die facing the substrate are positioned to engage bonding pads on the substrate. The plurality of surface acoustic wave resonators collectively exhibit a band reject filter response.

    摘要翻译： 公开了一种用于提供表面声波阻带滤波器的方法和系统。 根据一个方面，声表面波阻带滤波器包括具有形成在基板上的电极棒和接合焊盘的基板。 该过滤器还包括至少一个具有面向衬底的一个模具。 在形成在基板上的至少一个模具上形成多个表面声波谐振器。 形成在面向衬底的至少一个管芯的一侧上的焊球被定位成接合衬底上的接合焊盘。 多个表面声波谐振器共同呈现带阻滤波器响应。