公开(公告)号：US20060220500A1

公开(公告)日：2006-10-05

申请号：US11445586

申请日：2006-06-01

申请人： Mitsutaka Shimada ,  Yoshifumi Yamagata ,  Kazuhiro Otsuka ,  Masafumi Hisataka ,  Akira Oikawa ,  Michihiko Kuwahata ,  Masaru Yamano

发明人： Mitsutaka Shimada ,  Yoshifumi Yamagata ,  Kazuhiro Otsuka ,  Masafumi Hisataka ,  Akira Oikawa ,  Michihiko Kuwahata ,  Masaru Yamano

IPC分类号： H03H9/25

CPC分类号： H03H9/1085 ,  G01H3/12 ,  H01L21/561 ,  H01L23/3135 ,  H01L23/315 ,  H01L24/81 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/73203 ,  H01L2224/81801 ,  H01L2924/09701 ,  H03H3/08 ,  H03H9/059 ,  Y10T29/42 ,  Y10T29/435 ,  Y10T29/49002 ,  H01L2924/00012

摘要： A surface acoustic wave device is disclosed, which comprises a surface acoustic wave element including a lithium tantalate piezoelectric substrate 10 with one principal surface thereof formed with an IDT electrode 11, a connector electrode 12 and a periphery sealing electrode 13, and a base substrate 2 formed with an electrode 21 for connection to the element connected to the connector electrode 12 through a solder bump component 3 and a periphery sealing conductor film 22 joined to the periphery sealing electrode 13 thorough a solder sealing component 4. For the solder bump component 3 and the solder sealing component 4, a Sn—Sb based or Sn—Ag based lead-free solder containing 90% or more Sn is used, and the thermal expansion coefficient of the base substrate 2 is set in the range of 9-20 pm/° C. The joining is accomplished with high stability resisting thermal stress due to a difference in thermal expansion coefficient, so that a surface acoustic wave device that can maintain stable connection for a long duration of time can be provided.

摘要翻译： 公开了一种弹性表面波器件，它包括一个表面声波元件，它包括其一个主表面形成有IDT电极11的钽酸锂压电基片10，一个连接器电极12和一个周边密封电极13，以及一个基底基片2 形成有用于通过焊料凸块部件3连接到连接到连接器电极12的元件的电极21和通过焊料密封部件4接合到周围密封电极13的周围密封导体膜22。 对于焊料凸块部件3和焊料密封部件4，使用含有90％以上Sn的Sn-Sb系或Sn-Ag系无铅焊料，将基底基板2的热膨胀系数设定在 范围为9-20μm/℃。由于热膨胀系数的差异，能够以高稳定性抵抗热应力实现接合，从而可以提供能够长时间保持稳定连接的表面声波装置 。

公开(公告)号：US07513022B2

公开(公告)日：2009-04-07

申请号：US11445586

申请日：2006-06-01

申请人： Mitsutaka Shimada ,  Yoshifumi Yamagata ,  Kazuhiro Otsuka ,  Masafumi Hisataka ,  Akira Oikawa ,  Michihiko Kuwahata ,  Masaru Yamano

发明人： Mitsutaka Shimada ,  Yoshifumi Yamagata ,  Kazuhiro Otsuka ,  Masafumi Hisataka ,  Akira Oikawa ,  Michihiko Kuwahata ,  Masaru Yamano

IPC分类号： H04R17/00

CPC分类号： H03H9/1085 ,  G01H3/12 ,  H01L21/561 ,  H01L23/3135 ,  H01L23/315 ,  H01L24/81 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/73203 ,  H01L2224/81801 ,  H01L2924/09701 ,  H03H3/08 ,  H03H9/059 ,  Y10T29/42 ,  Y10T29/435 ,  Y10T29/49002 ,  H01L2924/00012

摘要： A surface acoustic wave device is disclosed, which comprises a surface acoustic wave element including a lithium tantalate piezoelectric substrate 10 with one principal surface thereof formed with an IDT electrode 11, a connector electrode 12 and a periphery sealing electrode 13, and a base substrate 2 formed with an electrode 21 for connection to the element connected to the connector electrode 12 through a solder bump component 3 and a periphery sealing conductor film 22 joined to the periphery sealing electrode 13 thorough a solder sealing component 4. For the solder bump component 3 and the solder sealing component 4, a Sn—Sb based or Sn—Ag based lead-free solder containing 90% or more Sn is used, and the thermal expansion coefficient of the base substrate 2 is set in the range of 9-20 pm/° C. The joining is accomplished with high stability resisting thermal stress due to a difference in thermal expansion coefficient, so that a surface acoustic wave device that can maintain stable connection for a long duration of time can be provided.

摘要翻译： 公开了一种弹性表面波器件，它包括一个表面声波元件，它包括其一个主表面形成有IDT电极11的钽酸锂压电基片10，一个连接器电极12和一个周边密封电极13，以及一个基底基片2 形成有用于通过焊料凸块部件3连接到连接到连接器电极12的元件的电极21和通过焊接密封部件4接合到周围密封电极13的周围密封导体膜22.对于焊料凸块部件3和 使用焊料密封部件4，含有Sn含量为90％以上的Sn-Sb系或Sn-Ag系无铅焊料，将基底基板2的热膨胀系数设定在9〜20μm/ ℃。由于热膨胀系数的差异，接合实现了高稳定性，抗热应力，从而可以保持稳定的表面声波装置 可以提供长时间的连接。

公开(公告)号：US07248133B2

公开(公告)日：2007-07-24

申请号：US11169292

申请日：2005-06-28

申请人： Wataru Koga ,  Kiyohiro Iioka ,  Mitsutaka Shimada ,  Shinichiro Kitanishi

发明人： Wataru Koga ,  Kiyohiro Iioka ,  Mitsutaka Shimada ,  Shinichiro Kitanishi

IPC分类号： H03H3/08 ,  H03H9/64 ,  H03H9/72

CPC分类号： H03H9/1085 ,  H01L24/97 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01018 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/15787 ,  H03H3/08 ,  H03H2009/0019 ,  Y10T29/42 ,  Y10T428/24083 ,  Y10T428/24099 ,  H01L2224/81 ,  H01L2924/00

摘要： A plurality of surface acoustic wave elements, with an IDT electrode 2 and a pad electrode 3 formed on the principal surface of a piezoelectric substrate 1, are formed to be flip-chip mounted on a circuit board 5 and sealed using sealing resin 7. The circuit board 5 is diced integrally with the sealing resin 7 applying a rotating dicing blade 8 from the bottom surface side thereof to produce a plurality of surface acoustic wave devices. The side surfaces of the surface acoustic wave devices can be formed perpendicularly with dimensional accuracy without rounding or chipping an edge portion of the sealing resin 7.

摘要翻译： 形成在压电基板1的主面上形成有IDT电极2和焊盘电极3的多个声表面波元件被倒装安装在电路板5上，并使用密封树脂7密封。 电路板5与密封树脂7一体地切割，从密封树脂7的底面侧施加旋转的切割刀片8，以产生多个表面声波装置。 表面声波装置的侧面可以垂直于尺寸精度形成，而不会使密封树脂7的边缘部分变圆或碎裂。

公开(公告)号：US20060012450A1

公开(公告)日：2006-01-19

申请号：US11169292

申请日：2005-06-28

申请人： Wataru Koga ,  Kiyohiro Iioka ,  Mitsutaka Shimada ,  Shinichiro Kitanishi

发明人： Wataru Koga ,  Kiyohiro Iioka ,  Mitsutaka Shimada ,  Shinichiro Kitanishi

IPC分类号： H03H9/64

CPC分类号： H03H9/1085 ,  H01L24/97 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01018 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/15787 ,  H03H3/08 ,  H03H2009/0019 ,  Y10T29/42 ,  Y10T428/24083 ,  Y10T428/24099 ,  H01L2224/81 ,  H01L2924/00

摘要： A plurality of surface acoustic wave elements, with an IDT electrode 2 and a pad electrode 3 formed on the principal surface of a piezoelectric substrate 1, are formed to be flip-chip mounted on a circuit board 5 and sealed using sealing resin 7. The circuit board 5 is diced integrally with the sealing resin 7 applying a rotating dicing blade 8 from the bottom surface side thereof to produce a plurality of surface acoustic wave devices. The side surfaces of the surface acoustic wave devices can be formed perpendicularly with dimensional accuracy without rounding or chipping an edge portion of the sealing resin 7.

摘要翻译： 形成在压电基板1的主面上形成有IDT电极2和焊盘电极3的多个声表面波元件被倒装安装在电路板5上，并使用密封树脂7密封。 电路板5与密封树脂7一体地切割，从密封树脂7的底面侧施加旋转的切割刀片8，以产生多个表面声波装置。 表面声波装置的侧面可以垂直于尺寸精度形成，而不会使密封树脂7的边缘部分变圆或碎裂。

公开(公告)号：US07154206B2

公开(公告)日：2006-12-26

申请号：US10628881

申请日：2003-07-28

申请人： Mitsutaka Shimada ,  Yoshifumi Yamagata ,  Kazuhiro Otsuka ,  Masafumi Hisataka ,  Akira Oikawa ,  Michihiko Kuwahata ,  Masaru Yamano

发明人： Mitsutaka Shimada ,  Yoshifumi Yamagata ,  Kazuhiro Otsuka ,  Masafumi Hisataka ,  Akira Oikawa ,  Michihiko Kuwahata ,  Masaru Yamano

IPC分类号： H01L41/08

CPC分类号： H03H9/1085 ,  G01H3/12 ,  H01L21/561 ,  H01L23/3135 ,  H01L23/315 ,  H01L24/81 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/73203 ,  H01L2224/81801 ,  H01L2924/09701 ,  H03H3/08 ,  H03H9/059 ,  Y10T29/42 ,  Y10T29/435 ,  Y10T29/49002 ,  H01L2924/00012

摘要： A surface acoustic wave device is disclosed, which comprises a surface acoustic wave element including a lithium tantalate piezoelectric substrate 10 with one principal surface thereof formed with an IDT electrode 11, a connector electrode 12 and a periphery sealing electrode 13, and a base substrate 2 formed with an electrode 21 for connection to the element connected to the connector electrode 12 through a solder bump component 3 and a periphery sealing conductor film 22 joined to the periphery sealing electrode 13 thorough a solder sealing component 4. For the solder bump component 3 and the solder sealing component 4, a Sn—Sb based or Sn—Ag based lead-free solder containing 90% or more Sn is used, and the thermal expansion coefficient of the base substrate 2 is set in the range of 9–20 pm/° C. The joining is accomplished with high stability resisting thermal stress due to a difference in thermal expansion coefficient, so that a surface acoustic wave device that can maintain stable connection for a long duration of time can be provided.

摘要翻译： 公开了一种弹性表面波器件，它包括一个表面声波元件，它包括其一个主表面形成有IDT电极11的钽酸锂压电基片10，一个连接器电极12和一个周边密封电极13，以及一个基底基片2 形成有用于通过焊料凸块部件3连接到连接到连接器电极12的元件的电极21和通过焊接密封部件4接合到周围密封电极13的周围密封导体膜22.对于焊料凸块部件3和 使用焊料密封部件4，含有Sn含量为90％以上的Sn-Sb系或Sn-Ag系无铅焊料，将基底基板2的热膨胀系数设定在9〜20μm/ ℃。由于热膨胀系数的差异，接合实现了高稳定性，抗热应力，从而可以保持稳定的表面声波装置 可以提供长时间的连接。