公开(公告)号：US09214507B2

公开(公告)日：2015-12-15

申请号：US13588831

申请日：2012-08-17

Applicant: Dinesh C. Mathew ,  Adam T. Garelli ,  Paul S. Drzaic ,  Wei Chen ,  Brett W. Degner ,  Bryan W. Posner

Inventor： Dinesh C. Mathew ,  Adam T. Garelli ,  Paul S. Drzaic ,  Wei Chen ,  Brett W. Degner ,  Bryan W. Posner

IPC: H01J1/62 ,  H01L27/32 ,  G06F3/041 ,  H05B33/08 ,  H01L51/52

CPC classification number: H01L27/3276 ,  G06F3/041 ,  G06F3/0412 ,  H01L27/323 ,  H01L51/0096 ,  H01L51/0097 ,  H01L51/524 ,  H01L51/5281 ,  H01L51/5284 ,  H01L51/5293 ,  H03K2217/96031 ,  H05B33/0896

Abstract: An electronic device may be provided having an organic light-emitting diode display and control circuitry for operating the display. The display may include one or more display layers interposed between the control circuitry and a display layer having thin-film transistors. The electronic device may include a coupling structure interposed between the layer of thin-film transistors and the control circuitry that electrically couples the layer of thin-film transistors to the control circuitry. The coupling structure may include a dielectric member having a conductive via, a flexible printed circuit having a bent portion, or a conductive via formed in an encapsulation layer of the display. The display may include a layer of opaque masking material. The layer of opaque masking material may be formed on an encapsulation layer, an organic emissive layer, a thin-film transistor layer, or a glass layer of the organic light-emitting diode display.

Abstract translation: 可以提供具有用于操作显示器的有机发光二极管显示器和控制电路的电子设备。 显示器可以包括插入在控制电路和具有薄膜晶体管的显示层之间的一个或多个显示层。 电子设备可以包括插入在薄膜晶体管层和将薄膜晶体管层电耦合到控制电路的控制电路之间的耦合结构。 耦合结构可以包括具有导电通孔的电介质构件，具有弯曲部分的柔性印刷电路或形成在显示器的封装层中的导电通孔。 显示器可以包括不透明掩模材料层。 不透明掩模材料层可以形成在有机发光二极管显示器的封装层，有机发光层，薄膜晶体管层或玻璃层上。

公开(公告)号：US09213597B2

公开(公告)日：2015-12-15

申请号：US13286226

申请日：2011-11-01

Applicant: Wei-Chen Teo ,  Pi-Chi Yang

Inventor： Wei-Chen Teo ,  Pi-Chi Yang

IPC: G11C29/00 ,  G06F11/10

CPC classification number: G06F11/1048

Abstract: A memory storage device, a memory controller thereof, and a method for programming data thereof are provided. The memory storage device having an error checking and correcting (ECC) circuit and a rewritable non-volatile memory chip is coupled to a host system. The method includes determining whether write data to be written into the rewritable non-volatile memory chip belongs to a specific type. The method also includes generating at least one first type ECC code with a first length by the ECC circuit according to the write data if the write data belongs to the specific type. The method further includes generating at least one second type ECC code with a second length by the ECC circuit according to the write data if the write data does not belong to the specific type. In which, the first length is longer than the second length.

Abstract translation: 提供了一种存储器存储装置，其存储器控制器及其数据编程方法。 具有错误检查和校正（ECC）电路和可重写非易失性存储器芯片的存储器存储设备耦合到主机系统。 该方法包括确定要写入可重写非易失性存储器芯片的写入数据是否属于特定类型。 该方法还包括如果写入数据属于特定类型，则通过ECC电路根据写数据产生具有第一长度的至少一个第一类型的ECC码。 该方法还包括如果写入数据不属于特定类型，则根据写入数据由ECC电路产生具有第二长度的至少一个第二类型ECC码。 其中，第一长度比第二长度长。

公开(公告)号：US09203807B2

公开(公告)日：2015-12-01

申请号：US13229285

申请日：2011-09-09

Applicant: Ben Wei Chen ,  Chin-Tang Yen ,  Shi-Ming Zhao

Inventor： Ben Wei Chen ,  Chin-Tang Yen ,  Shi-Ming Zhao

IPC: G06F7/04 ,  G06F15/16 ,  G06F17/30 ,  H04L29/06 ,  H04L29/08

CPC classification number: H04L63/0272 ,  H04L29/06326 ,  H04L29/08306 ,  H04L63/029 ,  H04L63/08 ,  H04L67/10

Abstract: A method and system for use with a public cloud network is disclosed, wherein the public cloud network includes at least one private cloud server and at least one smart client device in communication therewith. The method and system comprise setting up the at least one private cloud server and the at least one smart client device in a client server relationship. The at least one private cloud server includes a message box associated therewith. The first message box is located in the public network. The at least one smart client includes a second message box associated therewith. The second message box is located on the public network. The method includes passing session based message information between the at least one private cloud server and the at least one smart client device via the first message box and the second message box in a secure manner. The session base information is authenticated by the private cloud server and the at least one smart client device. The smart client device and the private cloud server can then communicate with each other after the session based information is authenticated.

Abstract translation: 公开了一种用于公共云网络的方法和系统，其中公共云网络包括至少一个私有云服务器和与其通信的至少一个智能客户端设备。 该方法和系统包括以客户端服务器关系设置至少一个私有云服务器和至少一个智能客户端设备。 所述至少一个私有云服务器包括与其相关联的消息框。 第一个消息框位于公共网络中。 至少一个智能客户端包括与其相关联的第二消息框。 第二个消息框位于公共网络上。 该方法包括经由第一消息框和第二消息框以安全的方式在至少一个私有云服务器与至少一个智能客户端设备之间传送基于会话的消息信息。 会话基础信息由私有云服务器和至少一个智能客户端设备认证。 智能客户端设备和私有云服务器可以在基于会话的信息被认证后相互通信。

公开(公告)号：US09196532B2

公开(公告)日：2015-11-24

申请号：US13529179

申请日：2012-06-21

Applicant: Chia-Wei Tu ,  Yian-Liang Kuo ,  Wen-Hsiung Lu ,  Hsien-Wei Chen ,  Tsung-Fu Tsai

Inventor： Chia-Wei Tu ,  Yian-Liang Kuo ,  Wen-Hsiung Lu ,  Hsien-Wei Chen ,  Tsung-Fu Tsai

IPC: H01L21/78 ,  H01L23/522 ,  H01L23/31 ,  H01L23/00

CPC classification number: H01L23/3135 ,  H01L21/78 ,  H01L23/3107 ,  H01L23/3157 ,  H01L23/585 ,  H01L24/03 ,  H01L24/05 ,  H01L24/13 ,  H01L24/15 ,  H01L2224/02331 ,  H01L2224/02377 ,  H01L2224/0401 ,  H01L2224/0502 ,  H01L2224/05022 ,  H01L2224/05099 ,  H01L2224/05124 ,  H01L2224/05144 ,  H01L2224/05147 ,  H01L2224/05186 ,  H01L2224/05548 ,  H01L2224/05567 ,  H01L2224/05573 ,  H01L2224/05582 ,  H01L2224/05599 ,  H01L2224/05647 ,  H01L2224/13022 ,  H01L2224/13024 ,  H01L2224/13111 ,  H01L2224/16225 ,  H01L2224/94 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/14 ,  H01L2224/03 ,  H01L2224/05 ,  H01L2924/04941 ,  H01L2924/04953 ,  H01L2224/05552

Abstract: A method includes forming an electrical connector over a substrate of a wafer, and molding a polymer layer, with at least a portion of the electrical connector molded in the polymer layer. A first sawing step is performed to form a trench in the polymer layer. After the first sawing step, a second sawing step is performed to saw the wafer into a plurality of dies.

Abstract translation: 一种方法包括在晶片的衬底上形成电连接器，并模制聚合物层，至少一部分电连接器模制在聚合物层中。 执行第一锯切步骤以在聚合物层中形成沟槽。 在第一锯切步骤之后，执行第二锯切步骤以将晶片看成多个模具。

公开(公告)号：US09153356B2

公开(公告)日：2015-10-06

申请号：US12714482

申请日：2010-02-27

Applicant: Sung-Wei Chen

Inventor： Sung-Wei Chen

IPC: C25D5/02 ,  H01B3/00 ,  C25D11/18 ,  C25D11/20

CPC classification number: H01B3/004 ,  C25D5/02 ,  C25D11/18 ,  C25D11/20 ,  Y10T156/10

Abstract: Metal nanoparticles are assembled in interrupted metal strands or other structures of characteristic dimensions and orientation to generate a giant dielectric response through a modified GE effect. Careful selection and modification of the host material and synthesis also leads to low dielectric breakdown voltages. In addition, the high dielectric composite material is employed in material configurations that are more scalable for industrial and consumer applications.

Abstract translation: 金属纳米粒子被组装成中断的金属线或特征尺寸和取向的其它结构，以通过改进的GE效应产生巨大的介电响应。 仔细选择和修改主体材料和合成还会导致低介电击穿电压。 此外，高介电复合材料用于对于工业和消费者应用更具可扩展性的材料配置。

公开(公告)号：US09117831B2

公开(公告)日：2015-08-25

申请号：US13004261

申请日：2011-01-11

Applicant: Ching-Jung Yang ,  Yu-Wen Liu ,  Michael Shou-Ming Tong ,  Hsien-Wei Chen ,  Chung-Ying Yang ,  Tsung-Yuan Yu

Inventor： Ching-Jung Yang ,  Yu-Wen Liu ,  Michael Shou-Ming Tong ,  Hsien-Wei Chen ,  Chung-Ying Yang ,  Tsung-Yuan Yu

IPC: H01L23/00 ,  H01L23/58

CPC classification number: H01L23/564 ,  H01L23/585 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A semiconductor device includes a substrate having a circuit region and a seal ring region. The seal ring region surrounds the circuit region. A seal ring structure is disposed over the seal ring region. The seal ring structure has a first portion and a second portion above the first portion. The first portion has a width W1, and the second portion has a width W2. The width W1 is less than the width W2.

Abstract translation: 半导体器件包括具有电路区域和密封环区域的衬底。 密封圈区域围绕电路区域。 密封环结构设置在密封环区域的上方。 密封环结构具有在第一部分上方的第一部分和第二部分。 第一部分具有宽度W1，第二部分具有宽度W2。 宽度W1小于宽度W2。

公开(公告)号：US09115320B2

公开(公告)日：2015-08-25

申请号：US13493964

申请日：2012-06-11

Applicant: Lishun Hu ,  Wei Chen

Inventor： Lishun Hu ,  Wei Chen

IPC: B65G51/18 ,  C10J3/50

CPC classification number: C10J3/506 ,  C10J2200/15

Abstract: A conveying apparatus is provided. The conveying apparatus comprises a conveying pipeline and a supplementary gas pipeline extending into the conveying pipeline. The conveying pipeline defines an inlet and an outlet, and comprises an expanding portion defining the inlet, a shrinking portion defining the outlet, and an intermediate portion disposed between and in fluid communication with the expanding portion and the shrinking portion. A conveying apparatus and a conveying method are also presented.

Abstract translation: 提供输送装置。 输送装置包括输送管道和延伸到输送管道中的补充气体管道。 输送管道限定入口和出口，并且包括限定入口的膨胀部分，限定出口的收缩部分和设置在膨胀部分和收缩部分之间并与膨胀部分和收缩部分流体连通的中间部分。 还提出了输送装置和输送方法。

公开(公告)号：US09105588B2

公开(公告)日：2015-08-11

申请号：US12909458

申请日：2010-10-21

Applicant: Ying-Ju Chen ,  Hsien-Wei Chen

Inventor： Ying-Ju Chen ,  Hsien-Wei Chen

IPC: H01L23/498 ,  H01L23/31 ,  H01L23/00 ,  H01L21/3205

CPC classification number: H01L23/3171 ,  H01L21/76816 ,  H01L21/76877 ,  H01L23/3192 ,  H01L23/562 ,  H01L24/02 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/02313 ,  H01L2224/02331 ,  H01L2224/0239 ,  H01L2224/024 ,  H01L2224/0345 ,  H01L2224/03452 ,  H01L2224/03462 ,  H01L2224/03464 ,  H01L2224/03614 ,  H01L2224/0382 ,  H01L2224/03912 ,  H01L2224/0401 ,  H01L2224/05009 ,  H01L2224/05025 ,  H01L2224/05082 ,  H01L2224/05147 ,  H01L2224/05166 ,  H01L2224/05562 ,  H01L2224/0558 ,  H01L2224/05655 ,  H01L2224/1132 ,  H01L2224/1145 ,  H01L2224/1146 ,  H01L2224/11462 ,  H01L2224/1147 ,  H01L2224/11849 ,  H01L2224/13099 ,  H01L2224/13147 ,  H01L2924/01019 ,  H01L2924/07025 ,  H01L2924/10329 ,  H01L2924/14 ,  H01L2924/01029 ,  H01L2924/01013 ,  H01L2924/00

Abstract: A conductive feature on a semiconductor component is disclosed. A first passivation layer is formed over a substrate. A bond pad is formed over the first passivation layer. A second passivation layer overlies the first passivation layer and the bond pad. The second passivation layer has a first opening overlying the bond pad and a plurality of second openings exposing a top surface of the first passivation layer. A buffer layer overlies the second passivation layer and fills the plurality of second openings. The buffer layer has a third opening overlapping the first opening and together exposes a portion the bond pad. The combined first opening and third opening has sidewalls. An under bump metallurgy (UBM) layer overlies the sidewalls of the combined first opening and third opening, and contacts the exposed portion of the bond pad. A conductive feature overlies the UBM layer.

Abstract translation: 公开了半导体部件上的导电特征。 在衬底上形成第一钝化层。 在第一钝化层上形成接合焊盘。 第二钝化层覆盖第一钝化层和接合焊盘。 第二钝化层具有覆盖接合焊盘的第一开口和暴露第一钝化层的顶表面的多个第二开口。 缓冲层覆盖在第二钝化层上并填充多个第二开口。 缓冲层具有与第一开口重叠的第三开口并且一起暴露接合焊盘的一部分。 组合的第一开口和第三开口具有侧壁。 凸块下金属（UBM）层覆盖在组合的第一开口和第三开口的侧壁上，并且与接合焊盘的暴露部分接触。 导电特征覆盖在UBM层上。

公开(公告)号：US09078463B2

公开(公告)日：2015-07-14

申请号：US13437516

申请日：2012-04-02

Applicant: Kerry C. Huber ,  Wei Chen Yu

Inventor： Kerry C. Huber ,  Wei Chen Yu

IPC: A23K1/00 ,  A23L1/0522 ,  A23L1/2165 ,  A23L1/216

CPC classification number: A23L1/05223 ,  A23L19/12 ,  A23L19/15 ,  A23L29/219 ,  A23V2002/00

Abstract: This application relates to compositions comprising whole-tissue potato products with enhanced resistant starch (RS) content and reduced estimated glycemic index values. Methods of preparing and using whole-tissue potato products with enhanced resistant starch (RS) content and glycemic index values are also disclosed.

公开(公告)号：US09066822B2

公开(公告)日：2015-06-30

申请号：US13529833

申请日：2012-06-21

Applicant: Ryan J. Caldwell ,  Andrew H. Hansen ,  Sean M. Wood ,  Wei Chen ,  Regan A. Radcliffe ,  Kevin A. Yngve ,  Bennett E. Kuhar ,  Andrew J. Nelson ,  Eric Nickel

Inventor： Ryan J. Caldwell ,  Andrew H. Hansen ,  Sean M. Wood ,  Wei Chen ,  Regan A. Radcliffe ,  Kevin A. Yngve ,  Bennett E. Kuhar ,  Andrew J. Nelson ,  Eric Nickel

IPC: A61F2/80 ,  A61F2/68 ,  A61F2/50 ,  A61F2/60 ,  A61F2/70 ,  A61F2/74 ,  A61F2/76

CPC classification number: A61F2/80 ,  A61F2/60 ,  A61F2/68 ,  A61F2/70 ,  A61F2002/501 ,  A61F2002/5073 ,  A61F2002/607 ,  A61F2002/608 ,  A61F2002/6809 ,  A61F2002/689 ,  A61F2002/704 ,  A61F2002/741 ,  A61F2002/742 ,  A61F2002/747 ,  A61F2002/7655 ,  A61F2002/802

Abstract: Pump systems for use in suspension of a prosthetic device from a residual limb and methods of suspending a prosthetic device from a residual limb are disclosed. The pump systems include a mechanically activated pump having a first compression member coupled to a second compression member, a compressible bladder disposed between the first and second compression members, and coupling elements that engage and couple together the first and second compression members. The mechanically activated pump may be connected with an electrically activated pump within a fluid circuit of a hybrid pump system to provide vacuum engagement between a prosthetic device and a residual limb.

Abstract translation: 公开了用于从肢体悬挂假体装置的泵系统和从残肢悬挂假肢装置的方法。 泵系统包括机械活动的泵，其具有联接到第二压缩构件的第一压缩构件，设置在第一和第二压缩构件之间的可压缩气囊，以及接合并联接在一起的第一和第二压缩构件的联接元件。 机械激活的泵可以与混合泵系统的流体回路内的电活动泵连接，以在假肢装置和残肢之间提供真空接合。