摘要:
A semiconductor device includes a mount substrate and a semiconductor chip mounted upon the mount substrate via a metal bump, wherein metal bump includes an inner part joined to the semiconductor chip and an outer part covering the inner part, the outer part having an increased hardness as compared with the inner part.
摘要:
The wiring board comprises a plate-shaped conductive core material 10 with a through-hole 12 formed in, an insulation layer 14 formed on the surface of the conductive core material 10 and on the inside wall of the through-hole 12, a resin 18 buried in the through-hole 12 with the insulation layer 14 formed in, wirings 22a, 22b formed on the upper surface and the undersurface of the conductive core material 10 with the insulation layer 14 formed on, and an wiring 22d formed in the through-hole 20 formed in the resin 18 and electrically connected to the wirings 22a, 22b.
摘要:
A microstrip antenna has feed element 102 and parasitic elements 104, 106 on the front surface of substrate 1. Microwave electrical power is applied to feed element 102. Parasitic elements 104, 106 are connected via through hole type leads passing through substrate 1, to switches upon the rear surface of substrate 1, respectively. By actuating the switches individually, parasitic elements 104, 106 are individually switched between a grounded state and a float state. The direction of the radio beam emitted from the microstrip antenna is varied by selecting which of parasitic elements 104, 106 is grounded and floated. A microwave signal source connects to feed element 102 via an feed line 108 very much shorter than the wavelength, accordingly the transmission losses being low and the efficiency being excellent.
摘要:
A high-frequency module includes a stiffener (a support substrate), a resin base member of which one surface is fixed to the stiffener, a first conductive pattern formed on said one surface of the resin base member, a second conductive pattern formed on the other surface of the resin base member for constituting a waveguide in combination with the first conductive pattern to pass a high-frequency signal through the resin base member and including a window for allowing the high-frequency signal to pass therethrough, a cap for covering a semiconductor element and for absorbing or reflecting the high-frequency signal, an adopter (a waveguide tube) fixed onto the second conductive pattern such that one open end thereof surrounds the window, and an antenna fixed to the other open end of the adaptor.
摘要:
A communication radio-frequency module is provided that has a semiconductor device to which an antenna element is connected. This communication radio-frequency module includes: a supporting body that has a waveguide formed therein; a wiring board that is fixed onto a surface of the supporting body; the semiconductor device that is flip-chip mounted onto the wiring board by ultrasonic bonding; and the antenna element that is disposed on the other surface of the supporting body. In this module, the wiring board includes a board core member that is made of a resin material, and the supporting body includes a supporting body core member that is also made of a resin material.
摘要:
The circuit board for mounting semiconductor elements comprises a core substrate 10 formed of a fiber reinforced metal, an insulating layer 14 formed on the core substrate 10, and an interconnection layer 20 formed on the insulating layer 14, whereby the circuit board for mounting semiconductor elements can have a thermal expansion coefficient approximate to that of silicon, and light and thin but has high rigidity.
摘要:
The present invention relates a node device cross-connected to a STM transmission system and a maintenance and operation support device connected to the node device. The object of the present invention is to releasing a desired transmission section or link efficiently. Therefore, the node device according to the preset invention includes control section individually selecting a link provided to for a path in the communication devices accommodated into the local and remote stations; and cross-connection section providing a path through the selected link, wherein the control section selects an auxiliary link based on a system configuration when identifiers of all paths to be replaced by the substitute path are given.
摘要:
A wiring board includes a core layer and a pair of multilayer wiring portions. The core layer, having an upper surface and a lower surface, is formed from a resin composite which contains resin filler and encloses several pieces of carbon fiber cloth. One of the multilayer wiring portions is stacked on the upper surface of the core layer, while the other is stacked on the lower surface of the core layer. Each multilayer wiring portion is composed of a number of insulating layers and wiring patterns stacked alternately with the insulating layers. The wiring patterns of the upper and the lower wiring portions are connected to each other by conductors extending through the entire thickness of the core layer.
摘要:
A method of manufacturing a multilayer circuit substrate includes a process of forming via holes in an insulating film, a process of applying an electrically conducting paste obtained by having ultra-fine metal particles disperse in a solvent onto an insulating film, and a process of forming vias composed of a sintered product of ultra-fine metal particles in the via holes by removing the solvent and also sintering the ultra-fine metal particles. The sintered products of the ultra-fine metal particles on the insulating layer is removed (or patterned) by peeling off the protective film stuck to the insulating layer.
摘要:
The method of producing a substrate comprises the steps of: forming a through-hole in a base member; filling the through-hole with an insulating material; performing electroless plating to coat the surface of the base member, in which the through-hole has been filled with the insulating material, with an electroless-plated layer; applying photo resist on the electroless-plated layer formed on the surface of the base member; optically exposing and developing the photo resist so as to form a resist pattern coating an end face of the through-hole filled with the insulating material; etching an electrically conductive layer formed on the surface of the base member with using the resist pattern as a mask; and removing the resist pattern coating the end face of the through-hole from the base member with using the electroless-plated layer as a release layer.