公开(公告)号：US20080213945A1

公开(公告)日：2008-09-04

申请号：US12076167

申请日：2008-03-14

申请人： Tomoyuki Abe ,  Shinya Iijima

发明人： Tomoyuki Abe ,  Shinya Iijima

IPC分类号： H01L21/607

CPC分类号： H01L21/563 ,  H01L23/49816 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/05001 ,  H01L2224/05085 ,  H01L2224/05567 ,  H01L2224/1134 ,  H01L2224/13012 ,  H01L2224/13023 ,  H01L2224/13099 ,  H01L2224/13144 ,  H01L2224/73203 ,  H01L2224/81192 ,  H01L2224/81205 ,  H01L2224/81801 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/10329 ,  H01L2924/14 ,  H01L2924/1423 ,  H01L2924/15787 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/05099

摘要： A semiconductor device includes a mount substrate and a semiconductor chip mounted upon the mount substrate via a metal bump, wherein metal bump includes an inner part joined to the semiconductor chip and an outer part covering the inner part, the outer part having an increased hardness as compared with the inner part.

摘要翻译： 半导体器件包括安装基板和通过金属凸块安装在安装基板上的半导体芯片，其中金属凸块包括连接到半导体芯片的内部部分和覆盖内部部分的外部部分，外部部件具有增加的硬度 与内部相比。

公开(公告)号：US07420130B2

公开(公告)日：2008-09-02

申请号：US11812124

申请日：2007-06-15

申请人： Keishiro Okamoto ,  Tomoyuki Abe ,  Motoaki Tani ,  Nobuyuki Hayashi

发明人： Keishiro Okamoto ,  Tomoyuki Abe ,  Motoaki Tani ,  Nobuyuki Hayashi

IPC分类号： H01R12/04 ,  H05K1/11

CPC分类号： H05K3/445 ,  H05K1/056 ,  H05K3/426 ,  H05K2201/0179 ,  H05K2201/0195 ,  H05K2201/0323 ,  H05K2201/09581 ,  H05K2203/135 ,  Y10T29/49117 ,  Y10T29/49155 ,  Y10T29/49165

摘要： The wiring board comprises a plate-shaped conductive core material 10 with a through-hole 12 formed in, an insulation layer 14 formed on the surface of the conductive core material 10 and on the inside wall of the through-hole 12, a resin 18 buried in the through-hole 12 with the insulation layer 14 formed in, wirings 22a, 22b formed on the upper surface and the undersurface of the conductive core material 10 with the insulation layer 14 formed on, and an wiring 22d formed in the through-hole 20 formed in the resin 18 and electrically connected to the wirings 22a, 22b.

摘要翻译： 布线板包括具有形成在其中的通孔12的板状导电芯材10，形成在导电芯材10的表面上的绝缘层14和通孔12的内壁上的树脂18 埋置在通孔12中，其中形成有绝缘层14，形成在形成有绝缘层14的导电芯材10的上表面和下表面上的布线22a，22b以及形成在其中的布线22d 通孔20形成在树脂18中并电连接到布线22a，22b。

公开(公告)号：US20080088510A1

公开(公告)日：2008-04-17

申请号：US11664292

申请日：2005-09-29

申请人： Kensuke Murata ,  Hiroshi Tsuboi ,  Kengo Iwata ,  Tomoyuki Abe

发明人： Kensuke Murata ,  Hiroshi Tsuboi ,  Kengo Iwata ,  Tomoyuki Abe

IPC分类号： H01Q3/00 ,  H01Q9/04

CPC分类号： H01Q3/24 ,  H01Q9/0407 ,  H01Q9/0442 ,  H01Q19/005 ,  H01Q19/28

摘要： A microstrip antenna has feed element 102 and parasitic elements 104, 106 on the front surface of substrate 1. Microwave electrical power is applied to feed element 102. Parasitic elements 104, 106 are connected via through hole type leads passing through substrate 1, to switches upon the rear surface of substrate 1, respectively. By actuating the switches individually, parasitic elements 104, 106 are individually switched between a grounded state and a float state. The direction of the radio beam emitted from the microstrip antenna is varied by selecting which of parasitic elements 104, 106 is grounded and floated. A microwave signal source connects to feed element 102 via an feed line 108 very much shorter than the wavelength, accordingly the transmission losses being low and the efficiency being excellent.

摘要翻译： 微带天线具有馈电元件102和衬底1的前表面上的寄生元件104,106。 微波电力施加到馈电元件102。 寄生元件104,106通过穿过衬底1的通孔型引线分别连接到衬底1的后表面上。 通过单独地驱动开关，寄生元件104,106在接地状态和浮置状态之间单独切换。 通过选择寄生元件104,106中的哪一个接地并漂浮来改变从微带天线发射的无线电波束的方向。 微波信号源通过比波长短得多的馈线108连接到馈电元件102，因此传输损耗低，效率优异。

公开(公告)号：US20070013581A1

公开(公告)日：2007-01-18

申请号：US11167568

申请日：2005-06-28

申请人： Shinya Iijima ,  Tomoyuki Abe ,  Nobuyuki Hayashi ,  Yoji Ohashi ,  Toshihiro Shimura

发明人： Shinya Iijima ,  Tomoyuki Abe ,  Nobuyuki Hayashi ,  Yoji Ohashi ,  Toshihiro Shimura

IPC分类号： G01S7/28

CPC分类号： G01S7/032 ,  G01S13/931 ,  H01L23/552 ,  H01L23/66 ,  H01L25/16 ,  H01L2223/6627 ,  H01L2223/6677 ,  H01L2224/16 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/1903 ,  H01L2924/19105 ,  H01L2924/3011

摘要： A high-frequency module includes a stiffener (a support substrate), a resin base member of which one surface is fixed to the stiffener, a first conductive pattern formed on said one surface of the resin base member, a second conductive pattern formed on the other surface of the resin base member for constituting a waveguide in combination with the first conductive pattern to pass a high-frequency signal through the resin base member and including a window for allowing the high-frequency signal to pass therethrough, a cap for covering a semiconductor element and for absorbing or reflecting the high-frequency signal, an adopter (a waveguide tube) fixed onto the second conductive pattern such that one open end thereof surrounds the window, and an antenna fixed to the other open end of the adaptor.

公开(公告)号：US20060202312A1

公开(公告)日：2006-09-14

申请号：US11188113

申请日：2005-07-25

申请人： Shinya Iijima ,  Tomoyuki Abe ,  Nobuyuki Hayashi ,  Yoji Ohashi ,  Toshihiro Shimura

发明人： Shinya Iijima ,  Tomoyuki Abe ,  Nobuyuki Hayashi ,  Yoji Ohashi ,  Toshihiro Shimura

IPC分类号： H01L29/40 ,  H01Q9/04

CPC分类号： H01Q1/2283 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/15192 ,  H01L2924/16152 ,  H01Q1/22 ,  H01Q9/04 ,  H01Q9/0407 ,  H01Q21/0025 ,  H05K1/0237 ,  H05K3/0058 ,  H01L2924/00 ,  H01L2224/0401

摘要： A communication radio-frequency module is provided that has a semiconductor device to which an antenna element is connected. This communication radio-frequency module includes: a supporting body that has a waveguide formed therein; a wiring board that is fixed onto a surface of the supporting body; the semiconductor device that is flip-chip mounted onto the wiring board by ultrasonic bonding; and the antenna element that is disposed on the other surface of the supporting body. In this module, the wiring board includes a board core member that is made of a resin material, and the supporting body includes a supporting body core member that is also made of a resin material.

摘要翻译： 提供一种具有连接有天线元件的半导体器件的通信射频模块。 该通信射频模块包括：形成有波导的支撑体; 固定在支撑体的表面上的布线板; 通过超声波接合将倒装芯片安装在布线板上的半导体器件; 以及设置在支撑体的另一个表面上的天线元件。 在该模块中，布线板包括由树脂材料制成的板芯构件，并且支撑体包括也由树脂材料制成的支撑体芯构件。

公开(公告)号：US07038142B2

公开(公告)日：2006-05-02

申请号：US10340744

申请日：2003-01-13

申请人： Tomoyuki Abe

发明人： Tomoyuki Abe

IPC分类号： H05K1/03

CPC分类号： H01L23/142 ,  H01L23/145 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/10253 ,  H01L2924/15311 ,  H05K1/056 ,  H05K3/4608 ,  Y10S428/901 ,  Y10T428/24917 ,  H01L2924/00

摘要： The circuit board for mounting semiconductor elements comprises a core substrate 10 formed of a fiber reinforced metal, an insulating layer 14 formed on the core substrate 10, and an interconnection layer 20 formed on the insulating layer 14, whereby the circuit board for mounting semiconductor elements can have a thermal expansion coefficient approximate to that of silicon, and light and thin but has high rigidity.

摘要翻译： 用于安装半导体元件的电路板包括由纤维增强金属形成的芯基板10，形成在芯基板10上的绝缘层14和形成在绝缘层14上的互连层20，由此用于安装半导体元件的电路板 可以具有接近于硅的热膨胀系数，而且薄而薄但刚性高。

公开(公告)号：US20050220006A1

公开(公告)日：2005-10-06

申请号：US11066568

申请日：2005-02-28

申请人： Satoshi Kumano ,  Yoshiyasu Sutou ,  Toshiyuki Yada ,  Kiyofumi Hara ,  Tomoyuki Abe ,  Michiko Suzuki ,  Kenichiro Ogi

发明人： Satoshi Kumano ,  Yoshiyasu Sutou ,  Toshiyuki Yada ,  Kiyofumi Hara ,  Tomoyuki Abe ,  Michiko Suzuki ,  Kenichiro Ogi

IPC分类号： H04J1/16 ,  H04J3/14 ,  H04J3/16 ,  H04L1/00 ,  H04L1/22 ,  H04L12/26 ,  H04L12/28 ,  H04L12/42 ,  H04L12/50 ,  H04L12/56 ,  H04Q11/00 ,  H04Q11/04

CPC分类号： H04L1/22 ,  H04J3/1611 ,  H04J2203/0023 ,  H04J2203/0057 ,  H04L12/42

摘要： The present invention relates a node device cross-connected to a STM transmission system and a maintenance and operation support device connected to the node device. The object of the present invention is to releasing a desired transmission section or link efficiently. Therefore, the node device according to the preset invention includes control section individually selecting a link provided to for a path in the communication devices accommodated into the local and remote stations; and cross-connection section providing a path through the selected link, wherein the control section selects an auxiliary link based on a system configuration when identifiers of all paths to be replaced by the substitute path are given.

摘要翻译： 本发明涉及交叉连接到STM传输系统的节点设备和连接到节点设备的维护和操作支持设备。 本发明的目的是有效地释放期望的传输部分或链接。 因此，根据本发明的节点装置包括控制部分，单独选择为容纳在本地和远程站中的通信设备中的路径提供的链路; 以及提供通过所选择的链路的路径的交叉连接部分，其中当给出要由所述替代路径替换的所有路径的标识符时，所述控制部分基于系统配置来选择辅助链路。

公开(公告)号：US06869665B2

公开(公告)日：2005-03-22

申请号：US10644004

申请日：2003-08-20

申请人： Motoaki Tani ,  Nobuyuki Hayashi ,  Tomoyuki Abe ,  Yasuhito Takahashi ,  Yoshiyasu Saeki

发明人： Motoaki Tani ,  Nobuyuki Hayashi ,  Tomoyuki Abe ,  Yasuhito Takahashi ,  Yoshiyasu Saeki

IPC分类号： H05K1/11 ,  H01L23/12 ,  H01L23/14 ,  H05K1/03 ,  H05K1/05 ,  H05K3/46 ,  B32B3/00

CPC分类号： H05K1/056 ,  H05K3/4608 ,  H05K2201/0209 ,  H05K2201/0281 ,  H05K2201/0323 ,  H05K2201/068 ,  Y10S428/901 ,  Y10T428/24917

摘要： A wiring board includes a core layer and a pair of multilayer wiring portions. The core layer, having an upper surface and a lower surface, is formed from a resin composite which contains resin filler and encloses several pieces of carbon fiber cloth. One of the multilayer wiring portions is stacked on the upper surface of the core layer, while the other is stacked on the lower surface of the core layer. Each multilayer wiring portion is composed of a number of insulating layers and wiring patterns stacked alternately with the insulating layers. The wiring patterns of the upper and the lower wiring portions are connected to each other by conductors extending through the entire thickness of the core layer.

摘要翻译： 布线板包括芯层和一对多层布线部。 具有上表面和下表面的芯层由包含树脂填料的树脂复合材料形成，并包围几片碳纤维布。 多层布线部分中的一个堆叠在芯层的上表面上，而另一个层叠在芯层的下表面上。 每个多层布线部分由与绝缘层交替堆叠的多个绝缘层和布线图形组成。 上布线部分和下布线部分的布线图案通过延伸穿过芯层整个厚度的导体彼此连接。

公开(公告)号：US5746868A

公开(公告)日：1998-05-05

申请号：US503917

申请日：1995-07-19

申请人： Tomoyuki Abe

发明人： Tomoyuki Abe

IPC分类号： H05K1/09 ,  B22F7/08 ,  H01L21/48 ,  H05K3/02 ,  H05K3/10 ,  H05K3/24 ,  H05K3/28 ,  H05K3/34 ,  H05K3/38 ,  H05K3/40 ,  H05K3/46 ,  B32B31/18 ,  B05D5/12 ,  B32B31/26

CPC分类号： H05K3/4617 ,  B22F7/08 ,  H01L21/4857 ,  H01L21/486 ,  H05K3/102 ,  H05K3/247 ,  H05K3/4069 ,  H05K3/4664 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/83192 ,  H01L2224/92247 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H05K1/095 ,  H05K2201/0305 ,  H05K2201/0355 ,  H05K2201/0394 ,  H05K2203/0191 ,  H05K2203/1131 ,  H05K2203/1327 ,  H05K3/28 ,  H05K3/3473 ,  H05K3/388 ,  H05K3/4038 ,  Y10T156/1057 ,  Y10T29/49155

摘要： A method of manufacturing a multilayer circuit substrate includes a process of forming via holes in an insulating film, a process of applying an electrically conducting paste obtained by having ultra-fine metal particles disperse in a solvent onto an insulating film, and a process of forming vias composed of a sintered product of ultra-fine metal particles in the via holes by removing the solvent and also sintering the ultra-fine metal particles. The sintered products of the ultra-fine metal particles on the insulating layer is removed (or patterned) by peeling off the protective film stuck to the insulating layer.

公开(公告)号：US08186052B2

公开(公告)日：2012-05-29

申请号：US12173562

申请日：2008-07-15

申请人： Kenji Iida ,  Tomoyuki Abe ,  Yasutomo Maehara ,  Shin Hirano ,  Takashi Nakagawa ,  Hideaki Yoshimura ,  Seigo Yamawaki ,  Norikazu Ozaki

发明人： Kenji Iida ,  Tomoyuki Abe ,  Yasutomo Maehara ,  Shin Hirano ,  Takashi Nakagawa ,  Hideaki Yoshimura ,  Seigo Yamawaki ,  Norikazu Ozaki

IPC分类号： H05K3/02 ,  H05K3/42 ,  H05K3/46

CPC分类号： H05K3/427 ,  H05K3/064 ,  H05K3/429 ,  H05K3/4608 ,  H05K2201/0281 ,  H05K2201/0323 ,  H05K2201/0347 ,  H05K2201/0959 ,  H05K2201/0969 ,  H05K2201/09809 ,  H05K2203/1178 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165

摘要： The method of producing a substrate comprises the steps of: forming a through-hole in a base member; filling the through-hole with an insulating material; performing electroless plating to coat the surface of the base member, in which the through-hole has been filled with the insulating material, with an electroless-plated layer; applying photo resist on the electroless-plated layer formed on the surface of the base member; optically exposing and developing the photo resist so as to form a resist pattern coating an end face of the through-hole filled with the insulating material; etching an electrically conductive layer formed on the surface of the base member with using the resist pattern as a mask; and removing the resist pattern coating the end face of the through-hole from the base member with using the electroless-plated layer as a release layer.

摘要翻译： 制造基板的方法包括以下步骤：在基底构件中形成通孔; 用绝缘材料填充通孔; 进行化学镀以用绝缘材料涂覆通孔填充有绝缘材料的基底构件的表面; 在形成在基体表面上的化学镀层上施加光刻胶; 光刻曝光和显影光致抗蚀剂，以形成涂覆填充有绝缘材料的通孔的端面的抗蚀剂图案; 使用抗蚀剂图案作为掩模蚀刻形成在基底构件的表面上的导电层; 并且通过使用化学镀层作为剥离层，从基体上除去涂覆通孔的端面的抗蚀剂图案。