公开(公告)号：US08186052B2

公开(公告)日：2012-05-29

申请号：US12173562

申请日：2008-07-15

申请人： Kenji Iida ,  Tomoyuki Abe ,  Yasutomo Maehara ,  Shin Hirano ,  Takashi Nakagawa ,  Hideaki Yoshimura ,  Seigo Yamawaki ,  Norikazu Ozaki

发明人： Kenji Iida ,  Tomoyuki Abe ,  Yasutomo Maehara ,  Shin Hirano ,  Takashi Nakagawa ,  Hideaki Yoshimura ,  Seigo Yamawaki ,  Norikazu Ozaki

IPC分类号： H05K3/02 ,  H05K3/42 ,  H05K3/46

CPC分类号： H05K3/427 ,  H05K3/064 ,  H05K3/429 ,  H05K3/4608 ,  H05K2201/0281 ,  H05K2201/0323 ,  H05K2201/0347 ,  H05K2201/0959 ,  H05K2201/0969 ,  H05K2201/09809 ,  H05K2203/1178 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165

摘要： The method of producing a substrate comprises the steps of: forming a through-hole in a base member; filling the through-hole with an insulating material; performing electroless plating to coat the surface of the base member, in which the through-hole has been filled with the insulating material, with an electroless-plated layer; applying photo resist on the electroless-plated layer formed on the surface of the base member; optically exposing and developing the photo resist so as to form a resist pattern coating an end face of the through-hole filled with the insulating material; etching an electrically conductive layer formed on the surface of the base member with using the resist pattern as a mask; and removing the resist pattern coating the end face of the through-hole from the base member with using the electroless-plated layer as a release layer.

摘要翻译： 制造基板的方法包括以下步骤：在基底构件中形成通孔; 用绝缘材料填充通孔; 进行化学镀以用绝缘材料涂覆通孔填充有绝缘材料的基底构件的表面; 在形成在基体表面上的化学镀层上施加光刻胶; 光刻曝光和显影光致抗蚀剂，以形成涂覆填充有绝缘材料的通孔的端面的抗蚀剂图案; 使用抗蚀剂图案作为掩模蚀刻形成在基底构件的表面上的导电层; 并且通过使用化学镀层作为剥离层，从基体上除去涂覆通孔的端面的抗蚀剂图案。

公开(公告)号：US20090294166A1

公开(公告)日：2009-12-03

申请号：US12390168

申请日：2009-02-20

申请人： Hideaki YOSHIMURA ,  Kenji IIDA ,  Tomoyuki ABE ,  Yasutomo MAEHARA ,  Shin HIRANO

发明人： Hideaki YOSHIMURA ,  Kenji IIDA ,  Tomoyuki ABE ,  Yasutomo MAEHARA ,  Shin HIRANO

IPC分类号： H05K1/11

CPC分类号： H05K3/445 ,  H05K3/4608 ,  H05K2201/0323 ,  H05K2201/09536 ,  H05K2201/0959 ,  H05K2201/096 ,  H05K2201/09609 ,  H05K2201/09809

摘要： Large-sized through holes are formed in a core layer of a printed wiring board. Large-sized vias are formed in the shape of a cylinder along the inward wall surfaces of the large-sized through holes located within a specific area. A filling material fills the inner space of the large-sized via. A small-sized through hole penetrates through the corresponding filling material along the longitudinal axis of the small-sized through hole. A small-sized via is formed in the shape of a cylinder along the inward wall surface of the small-sized through hole. The filling material and the core layer are uniformly distributed within the specific area in the in-plane direction of the core substrate. This results in suppression of uneven distribution of thermal stress in the core layer in the in-plane direction of the core layer.

摘要翻译： 在印刷电路板的芯层中形成大尺寸的通孔。 大尺寸通孔沿着位于特定区域内的大尺寸通孔的内壁表面形成为圆柱体的形状。 填充材料填充大尺寸通孔的内部空间。 小尺寸的通孔穿过相应的填充材料沿着小尺寸通孔的纵向轴线。 小尺寸的通孔沿着小尺寸通孔的内壁表面形成为圆柱体的形状。 填充材料和芯层均匀地分布在芯基板的面内方向的特定区域内。 这导致抑制芯层在芯层的面内方向上的热应力的不均匀分布。

公开(公告)号：US20090095509A1

公开(公告)日：2009-04-16

申请号：US12188736

申请日：2008-08-08

申请人： Shin Hirano ,  Kenji Iida ,  Yasutomo Maehara ,  Tomoyuki Abe ,  Takashi Nakagawa ,  Hideaki Yoshimura ,  Seigo Yamawaki ,  Norikazu Ozaki

发明人： Shin Hirano ,  Kenji Iida ,  Yasutomo Maehara ,  Tomoyuki Abe ,  Takashi Nakagawa ,  Hideaki Yoshimura ,  Seigo Yamawaki ,  Norikazu Ozaki

IPC分类号： H05K1/00 ,  H05K3/10

CPC分类号： H05K9/00 ,  H05K1/115 ,  H05K3/429 ,  H05K3/4608 ,  H05K3/4611 ,  H05K3/4691 ,  H05K2201/0281 ,  H05K2201/0323 ,  H05K2201/09581 ,  H05K2201/0959 ,  H05K2201/09809 ,  Y10T29/49155

摘要： In the core substrate, short circuit between an electrically conductive core section and a plated through-hole section can be securely prevented and cables can be formed in a high dense state. The core substrate comprises: the electrically conductive core section having a pilot hole, through which the plated through-hole section is formed; cable layers being respectively laminated on the both side faces of the core section; a plated layer coating an inner face of the pilot hole; and an insulating material filling a space between the plated layer and an outer circumferential face of the plated through-hole section.

摘要翻译： 在芯基板中，可以可靠地防止导电芯部与电镀通孔部之间的短路，并且可以以高致密状态形成电缆。 芯基板包括：导电芯部分具有导孔，电镀通孔部分穿过该引导孔; 电缆层分别层叠在芯部的两个侧面上; 涂覆导向孔的内表面的镀层; 以及填充所述镀层与所述电镀通孔部的外周面之间的空间的绝缘材料。

公开(公告)号：US20090094824A1

公开(公告)日：2009-04-16

申请号：US12173562

申请日：2008-07-15

申请人： Kenji Iida ,  Tomoyuki Abe ,  Yasutomo Maehara ,  Shin Hirano ,  Takashi Nakagawa ,  Hideaki Yoshimura ,  Seigo Yamawaki ,  Norikazu Ozaki

发明人： Kenji Iida ,  Tomoyuki Abe ,  Yasutomo Maehara ,  Shin Hirano ,  Takashi Nakagawa ,  Hideaki Yoshimura ,  Seigo Yamawaki ,  Norikazu Ozaki

IPC分类号： H05K3/10

CPC分类号： H05K3/427 ,  H05K3/064 ,  H05K3/429 ,  H05K3/4608 ,  H05K2201/0281 ,  H05K2201/0323 ,  H05K2201/0347 ,  H05K2201/0959 ,  H05K2201/0969 ,  H05K2201/09809 ,  H05K2203/1178 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165

摘要： The method of producing a substrate comprises the steps of: forming a through-hole in a base member; filling the through-hole with an insulating material; performing electroless plating to coat the surface of the base member, in which the through-hole has been filled with the insulating material, with an electroless-plated layer; applying photo resist on the electroless-plated layer formed on the surface of the base member; optically exposing and developing the photo resist so as to form a resist pattern coating an end face of the through-hole filled with the insulating material; etching an electrically conductive layer formed on the surface of the base member with using the resist pattern as a mask; and removing the resist pattern coating the end face of the through-hole from the base member with using the electroless-plated layer as a release layer.

摘要翻译： 制造基板的方法包括以下步骤：在基底构件中形成通孔; 用绝缘材料填充通孔; 进行化学镀以用绝缘材料涂覆通孔填充有绝缘材料的基底构件的表面; 在形成在基体表面上的化学镀层上施加光刻胶; 光刻曝光和显影光致抗蚀剂，以形成涂覆填充有绝缘材料的通孔的端面的抗蚀剂图案; 使用抗蚀剂图案作为掩模蚀刻形成在基底构件的表面上的导电层; 并且通过使用化学镀层作为剥离层，从基体上除去涂覆通孔的端面的抗蚀剂图案。

公开(公告)号：US08119923B2

公开(公告)日：2012-02-21

申请号：US12188257

申请日：2008-08-08

申请人： Hideaki Yoshimura ,  Kenji Fukuzono ,  Kenji Iida ,  Tomoyuki Abe ,  Yasutomo Maehara ,  Takashi Nakagawa ,  Shin Hirano ,  Takashi Kanda

发明人： Hideaki Yoshimura ,  Kenji Fukuzono ,  Kenji Iida ,  Tomoyuki Abe ,  Yasutomo Maehara ,  Takashi Nakagawa ,  Shin Hirano ,  Takashi Kanda

IPC分类号： H05K1/00 ,  B32B9/00

CPC分类号： H05K1/0366 ,  H05K1/0271 ,  H05K1/056 ,  H05K3/4608 ,  H05K2201/0323 ,  H05K2201/068 ,  H05K2201/09145 ,  Y10T428/24917 ,  Y10T428/24926

摘要： A circuit board has a low thermal expansion coefficient that suits the thermal expansion coefficient of an element to be mounted thereupon and can prevent the occurrence of delamination and cracking of a core layer when the circuit board is used in a low temperature environment. The circuit board is constructed by laminating a core layer and at least one wiring layer, where the at least one wiring layer has slightly smaller external dimensions in a planar direction than the core layer.

摘要翻译： 电路板具有适合要安装的元件的热膨胀系数的低热膨胀系数，并且可以防止当在低温环境中使用电路板时芯层的分层和破裂的发生。 电路板通过层叠芯层和至少一个布线层而构成，其中至少一个布线层在平面方向上具有比芯层稍小的外部尺寸。

公开(公告)号：US08178791B2

公开(公告)日：2012-05-15

申请号：US12331113

申请日：2008-12-09

申请人： Tomoyuki Abe ,  Kazumasa Saito ,  Shin Hirano ,  Kenji Iida

发明人： Tomoyuki Abe ,  Kazumasa Saito ,  Shin Hirano ,  Kenji Iida

IPC分类号： H05K1/11 ,  H01K3/10

CPC分类号： H05K3/445 ,  H05K3/42 ,  H05K3/4608 ,  H05K2201/0323 ,  H05K2201/0347 ,  H05K2201/09563 ,  H05K2201/096 ,  H05K2201/09827 ,  H05K2203/135 ,  Y10T29/49165

摘要： A wiring substrate includes a core substrate having a first main surface and a mutually opposing second main surface, the second main surface having a conductive property. A first through hole penetrates a core substrate. A first conductive layer extends from the first main surface to the second main surface via the first through hole. An insulating layer is formed on the first conductive layer. A second through hole has the insulating layer as an interior wall. And a second conductive layer is formed inside the second through hole.

摘要翻译： 布线基板包括具有第一主表面和相互相对的第二主表面的芯基板，第二主表面具有导电性能。 第一通孔穿透芯基板。 第一导电层经由第一通孔从第一主表面延伸到第二主表面。 绝缘层形成在第一导电层上。 第二通孔具有作为内壁的绝缘层。 并且第二导电层形成在第二通孔的内部。

公开(公告)号：US08151456B2

公开(公告)日：2012-04-10

申请号：US12175732

申请日：2008-07-18

申请人： Yasutomo Maehara ,  Kenji Iida ,  Tomoyuki Abe ,  Shin Hirano ,  Takashi Nakagawa ,  Hideaki Yoshimura ,  Seigo Yamawaki ,  Norikazu Ozaki

发明人： Yasutomo Maehara ,  Kenji Iida ,  Tomoyuki Abe ,  Shin Hirano ,  Takashi Nakagawa ,  Hideaki Yoshimura ,  Seigo Yamawaki ,  Norikazu Ozaki

IPC分类号： H05K3/02 ,  H05K3/40 ,  H05K3/42

CPC分类号： H05K3/427 ,  H05K1/115 ,  H05K1/116 ,  H05K3/0094 ,  H05K3/061 ,  H05K3/429 ,  H05K3/4602 ,  H05K3/4611 ,  H05K3/4691 ,  H05K2201/0347 ,  H05K2201/09581 ,  H05K2201/0959 ,  H05K2201/0969 ,  H05K2201/09809 ,  H05K2203/1178 ,  H05K2203/135 ,  H05K2203/1476 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165

摘要： The method of producing a substrate comprises the steps of: forming a through-hole in a base member; plating the base member so as to coat an inner face of the through-hole with a plated layer; applying photo resist on the base member; optically exposing and developing the photo resist so as to form a resist pattern, which coats at least a planar area of the through-hole; and etching an electrically conductive layer formed on the surface of the base member. The resist pattern is formed so as to separate an area of exposing the conductive layer a prescribed distance away from an edge of the through-hole, and the prescribed length is longer than a distance of etching a side face of the conductive layer in the etching step.

摘要翻译： 制造基板的方法包括以下步骤：在基底构件中形成通孔; 电镀所述基底构件以便用镀层涂覆所述通孔的内表面; 在基底上施加光刻胶; 对光致抗蚀剂进行光学曝光和显影，以形成至少覆盖通孔的平面区域的抗蚀剂图案; 以及蚀刻形成在所述基底构件的表面上的导电层。 形成抗蚀剂图形，以将导电层暴露出距通孔边缘规定距离的区域，并且规定的长度比蚀刻导电层的侧面的距离长 步。

公开(公告)号：US08035037B2

公开(公告)日：2011-10-11

申请号：US12170963

申请日：2008-07-10

申请人： Kenji Iida ,  Tomoyuki Abe ,  Yasutomo Maehara ,  Shin Hirano ,  Takashi Nakagawa ,  Hideaki Yoshimura ,  Seigo Yamawaki ,  Norikazu Ozaki

发明人： Kenji Iida ,  Tomoyuki Abe ,  Yasutomo Maehara ,  Shin Hirano ,  Takashi Nakagawa ,  Hideaki Yoshimura ,  Seigo Yamawaki ,  Norikazu Ozaki

IPC分类号： H05K1/11

CPC分类号： H05K3/4608 ,  H05K1/056 ,  H05K3/427 ,  H05K3/429 ,  H05K3/4611 ,  H05K3/4691 ,  H05K2201/0281 ,  H05K2201/0323 ,  H05K2201/09309 ,  H05K2201/0959 ,  H05K2201/0969 ,  H05K2201/09809 ,  H05K2203/1178 ,  Y10S428/901 ,  Y10T29/49155

摘要： The core substrate is capable of securely preventing short circuit between an electrically conductive core section and a plated through-hole section. The core substrate comprises: an electrically conductive core section having a pilot hole, through which a plated through-hole section is formed; electrically conductive layers coating the inner face of the pilot hole and a surface of the core section; a gas purging hole being formed in the conductive layer coating the surface of the core section; an insulating material filling a space between the inner face of the pilot hole and an outer circumferential face of the plated through-hole section; and cable layers being laminated on both side faces of the core section.

摘要翻译： 芯基板能够可靠地防止导电芯部与电镀通孔部之间的短路。 芯基板包括：具有引导孔的导电芯部分，形成电镀通孔部分; 涂覆导向孔的内表面和芯部表面的导电层; 形成在所述芯部的表面上的导电层中形成的气体净化孔; 绝缘材料，其填充所述导向孔的内表面与所述电镀通孔部的外周面之间的空间; 并且层叠在芯部的两个侧面上的电缆层。

公开(公告)号：US20090308651A1

公开(公告)日：2009-12-17

申请号：US12331113

申请日：2008-12-09

申请人： Tomoyuki ABE ,  Kazumasa SAITO ,  Shin HIRANO ,  Kenji IlDA

发明人： Tomoyuki ABE ,  Kazumasa SAITO ,  Shin HIRANO ,  Kenji IlDA

IPC分类号： H05K1/11 ,  H05K3/10

CPC分类号： H05K3/445 ,  H05K3/42 ,  H05K3/4608 ,  H05K2201/0323 ,  H05K2201/0347 ,  H05K2201/09563 ,  H05K2201/096 ,  H05K2201/09827 ,  H05K2203/135 ,  Y10T29/49165

摘要： A wiring substrate includes a core substrate having a first main surface and a mutually opposing second main surface, the second main surface having a conductive property. A first through hole penetrates a core substrate. A first conductive layer extends from the first main surface to the second main surface via the first through hole. An insulating layer is formed on the first conductive layer. A second through hole has the insulating layer as an interior wall. And a second conductive layer is formed inside the second through hole.

摘要翻译： 布线基板包括具有第一主表面和相互相对的第二主表面的芯基板，第二主表面具有导电性能。 第一通孔穿透芯基板。 第一导电层经由第一通孔从第一主表面延伸到第二主表面。 绝缘层形成在第一导电层上。 第二通孔具有作为内壁的绝缘层。 并且第二导电层形成在第二通孔的内部。

公开(公告)号：US20090098391A1

公开(公告)日：2009-04-16

申请号：US12188759

申请日：2008-08-08

申请人： Takashi NAKAGAWA ,  Kenji IIDA ,  Yasutomo MAEHARA ,  Shin HIRANO ,  Tomoyuki ABE ,  Hideaki YOSHIMURA ,  Seigo YAMAWAKI ,  Norikazu OZAKI

发明人： Takashi NAKAGAWA ,  Kenji IIDA ,  Yasutomo MAEHARA ,  Shin HIRANO ,  Tomoyuki ABE ,  Hideaki YOSHIMURA ,  Seigo YAMAWAKI ,  Norikazu OZAKI

IPC分类号： B32B5/28 ,  B32B37/04

CPC分类号： H05K9/00 ,  H05K1/036 ,  H05K1/0366 ,  H05K1/056 ,  H05K3/429 ,  H05K2201/0281 ,  H05K2201/0323 ,  H05K2201/0959 ,  H05K2201/09809

摘要： The core member constitutes a core substrate of a circuit board. The core member comprises: a carbon fiber-reinforced core section, in which prepregs including carbon fibers are thermocompression-bonded; and copper foils being respectively thermocompression-bonded on the both side faces of the carbon fiber-reinforced core section with prepregs including glass fibers. The pregregs including glass fibers are composed of resin, whose melting temperature range is higher than that of resin composing the pregregs including carbon fibers.

摘要翻译： 芯构件构成电路板的芯基板。 芯构件包括：碳纤维增强芯部，其中包括碳纤维的预浸料被热压粘合; 并且在包括玻璃纤维的预浸料坯的碳纤维增强芯部的两个侧面上分别热压粘合铜箔。 包括玻璃纤维的预浸料由树脂组成，其熔融温度范围高于构成包括碳纤维的预浸料的树脂。