PRINTED WIRING BOARD
    2.
    发明申请
    PRINTED WIRING BOARD 失效
    印刷线路板

    公开(公告)号:US20090294166A1

    公开(公告)日:2009-12-03

    申请号:US12390168

    申请日:2009-02-20

    IPC分类号: H05K1/11

    摘要: Large-sized through holes are formed in a core layer of a printed wiring board. Large-sized vias are formed in the shape of a cylinder along the inward wall surfaces of the large-sized through holes located within a specific area. A filling material fills the inner space of the large-sized via. A small-sized through hole penetrates through the corresponding filling material along the longitudinal axis of the small-sized through hole. A small-sized via is formed in the shape of a cylinder along the inward wall surface of the small-sized through hole. The filling material and the core layer are uniformly distributed within the specific area in the in-plane direction of the core substrate. This results in suppression of uneven distribution of thermal stress in the core layer in the in-plane direction of the core layer.

    摘要翻译: 在印刷电路板的芯层中形成大尺寸的通孔。 大尺寸通孔沿着位于特定区域内的大尺寸通孔的内壁表面形成为圆柱体的形状。 填充材料填充大尺寸通孔的内部空间。 小尺寸的通孔穿过相应的填充材料沿着小尺寸通孔的纵向轴线。 小尺寸的通孔沿着小尺寸通孔的内壁表面形成为圆柱体的形状。 填充材料和芯层均匀地分布在芯基板的面内方向的特定区域内。 这导致抑制芯层在芯层的面内方向上的热应力的不均匀分布。