摘要:
Compounds that may have anti-inflammatory activity are of general formula (I); wherein X1, is H or COR1, and X2 is H or COR2 but X1, and X2 are not both H; R1 and R2 are the same or different and are each C1-4 alkyl substituted with R3, or a four to seven-membered ring which can be optionally substituted with R8 and can contain one or more additional heteroatoms selected from O, S(O)n and NR9; is R3 is F, CF3, OR4, NR5R6 O, S(O)n R7; R4, R5 and R6 are the same or different and are each H or C1-4 alkyl optionally substituted with R3, or NR5R6 is a C4-6 heterocycloalkyl ring containing one or more heteroatoms selected from O, NR8 and S(O)n; each n is 0-2; R7 is C1-4 alkyl; R8 is as defined for R3 or C1-4 alkyl optionally substituted with R3 or halogen; and R9 is H or C1-4 alkyl; or a salt, solvate or hydrate thereof.
摘要:
The present invention is related to use of protein kinase N beta or a fragment or derivative thereof as a downstream target of the PI 3-kinase pathway, preferably as a downstream drug target of the PI 3-kinase pathway.
摘要:
A method for manufacturing an image sensor according to an embodiment includes performing a plasma surface treatment on an oxide film microlens to mitigate high surface morphology. The image sensor can include a passivation layer on a substrate having a pad region and a pixel region and a color filter layer on the passivation layer. A first low temperature oxide can be formed over the substrate including the color filter layer; and an oxide film microlens can be formed on the first low temperature oxide layer. A portion of the first low temperature oxide layer can provide a seed microlens upon which a second low temperature oxide layer is formed to form the oxide film microlenses. The plasma surface treatment can then be applied with respect to the oxide film microlenses.
摘要:
Disclosed are a metal line of a semiconductor device and a method of manufacturing the same. In one embodiment, the metal line includes a first interlayer dielectric layer pattern formed on a lower interconnection structure and having a via hole that exposes a lower interconnection of the lower interconnection structure, a first barrier pattern selectively covering a sidewall of the via hole and the lower interconnection, a second interlayer dielectric layer pattern on the first interlayer dielectric layer pattern and having a trench that exposes the via hole, a second barrier pattern covering an inner wall of the trench and the first barrier pattern, a seed pattern formed on the second barrier pattern, and a copper line formed on the seed pattern.
摘要:
The subject invention pertains to antibodies that have binding specificity for an antigen that is expressed on a subset of human, hematopoietic mononuclear cells, including a hematopoietic stem cell population, but is not expressed on normal, mature myeloid cells. In one embodiment, a monoclonal antibody, MG1, is provided. This antibody is useful in methods of isolating cell suspensions from human blood and marrow that can be employed in bone marrow transplantation, genetic therapy, and in treating other diseases of the hematopoietic system. Cell suspensions containing MG1+ human hematopoietic cells are also provided, as well as therapeutic methods employing the cell suspensions. The subject invention also pertains to the novel antigen recognized by the subject antibodies.
摘要:
Provided are a semiconductor device and a method of fabricating the semiconductor device. In the method, a field oxide layer can be formed in a semiconductor substrate so as to define and active electrode including a gate oxide layer and a gate poly is formed in the active region. An etch groove is formed between the gate electrode and the field oxide layer. Dopant ions are implanted between the gate electrode and the field oxide layer so as to form a source/drain region.
摘要:
An image sensor according to one embodiment of the present invention includes a semiconductor substrate having a CMOS circuit formed therein; an interlayer dielectric layer formed on the semiconductor substrate and including a trench formed therein; a metal wiring and a first conductive layer formed within the trench of the interlayer dielectric layer; an intrinsic layer formed on the semiconductor substrate including the first conductive layer and the interlayer dielectric layer; and a second conductive layer formed on the intrinsic layer.
摘要:
Provided is a semiconductor device. The semiconductor device includes a semiconductor substrate, a plurality of contact metals, and a gate electrode. The semiconductor substrate has an active region and a dummy active region, and a plurality of contact metals are formed in the active region. A gate electrode is located between the contact metals in the active region. A first distance between the active region and the dummy active region, and a second distance between an edge of the contact metal and an edge of the active region are set such that a channel characteristic of the active region is improved.
摘要:
Disclosed is a vibration motor. The vibration motor includes a bracket including a support tube protruding from the bracket, a case coupled with the bracket, a support shaft supported by the bracket and the case, a bearing rotatably fitted around the support shaft, a rotor fixed to the bearing to rotate together with the bearing, thereby generating vibration, a stator mounted on the bracket to rotate the rotor through interaction with the rotor, a support member installed around the support tube, and a first washer interposed between the support tube and the bearing and supported by the support member.
摘要:
Provided is a CMOS image sensor and method of manufacturing same. The CMOS image sensor includes a photodiode, a transfer transistor, a reset transistor, a drive transistor, and a select transistor. A device isolation layer is formed on a first conductive type substrate. Gate electrodes of the transfer transistor, the reset transistor, the drive transistor, and the select transistor are formed on an active region of the substrate with gate insulating layers interposed therebetween. A first diffusion region is formed of a second conductive type in a first region of the active region, where the first region does not include a floating diffusion region between the transfer transistor and the reset transistor and the photodiode region. A second diffusion region is formed of the second conductive type in the floating diffusion region at a concentration lower than that of the second conductive type first diffusion region.