发明授权
- 专利标题: Semiconductor device and method of fabricating the same
- 专利标题(中): 半导体装置及其制造方法
-
申请号: US11835071申请日: 2007-08-07
-
公开(公告)号: US07700468B2公开(公告)日: 2010-04-20
- 发明人: Ji Houn Jung
- 申请人: Ji Houn Jung
- 申请人地址: KR Seoul
- 专利权人: Dongbu Hitek Co., Ltd.
- 当前专利权人: Dongbu Hitek Co., Ltd.
- 当前专利权人地址: KR Seoul
- 代理机构: Saliwanchik, Lloyd & Saliwanchik
- 优先权: KR10-2006-0074110 20060807
- 主分类号: H01L21/425
- IPC分类号: H01L21/425
摘要:
Provided are a semiconductor device and a method of fabricating the semiconductor device. In the method, a field oxide layer can be formed in a semiconductor substrate so as to define and active electrode including a gate oxide layer and a gate poly is formed in the active region. An etch groove is formed between the gate electrode and the field oxide layer. Dopant ions are implanted between the gate electrode and the field oxide layer so as to form a source/drain region.
公开/授权文献
- US20080029791A1 Semiconductor Device and Method of Fabricating the Same 公开/授权日:2008-02-07
信息查询
IPC分类: