Abstract:
Provided is a flash memory device. The flash memory device includes: a memory cell storing multi-bit data; a reference bias voltage supply circuit generating a reference bias voltage; an sense amplifier sensing the multi-bit data stored in the memory cell using the reference bias voltage; and a control circuit controlling the reference bias voltage supply circuit. The control circuit controls the reference bias voltage supply circuit to allow the reference bias voltage to be developed according to a change of a main word line voltage applied to the memory cell during a read operation.
Abstract:
A semiconductor integrated circuit device includes a memory cell array including a plurality of planes each including a plurality of memory cells, a power supply voltage generating circuit including a voltage generating circuit configured to generate a power supply voltage common to the plurality of planes, a select number detection circuit configured to detect a number of selected planes of the plurality of planes, and a resistance variable circuit configured to vary a wiring resistance between the plurality of planes and the voltage generating circuit in accordance with the number of selected planes, which is reported from the select number detection circuit, and a control circuit configured to control the power supply voltage generating circuit.
Abstract:
Methods of accessing storage devices. The methods include rearranging a writing order of continuous first and second data according to a reading order, and writing the first and second data in a first and second storage region of the storage device, respectively, according to the writing order. The reading order reads the second storage region first that provides interference on the first storage region.
Abstract:
A soft programming pre-charge voltage provides boosting control during soft programming operations for non-volatile memory devices. A pre-charge voltage can be applied to the word lines of a block of memory cells to enable pre-charging of the channel region of a NAND string to be inhibited from soft programming. The level of boosting in the channel region of the inhibited NAND string is governed by the pre-charge voltage and the soft programming voltage. By controlling the pre-charge voltage, more reliable and consistent channel boosting can be achieved. In one embodiment, the pre-charge voltage is increased between applications of the soft programming voltage to reduce or eliminate a rise in the channel's boosted potential. In one embodiment, the soft programming pre-charge voltage level(s) is determined during testing that is performed as part of a manufacturing process.
Abstract:
A semiconductor memory device includes a main memory includes a nonvolatile memory, and a buffer which stores input/output data of the nonvolatile memory, a buffer unit of the main memory, the buffer unit includes a volatile memory, a self-test interface includes a data input/output pin, and a controller which controls the main memory and the buffer unit. The controller at least stores data in the buffer from the self-test interface via the data input/output pin.
Abstract:
Multiple programming processes are performed for a plurality of non-volatile storage elements. Each of the programming processes operate to program at least a subset of the non-volatile storage elements to a respective set of target conditions using program pulses. At least a subset of the programming processes include identifying a program pulse associated with achieving a particular result for a respective programming process and performing one or more sensing operations at one or more alternative results for the non-volatile storage elements. Subsequent programming process are adjusted based on a first alternative result and the identification of the program pulse if the one or more sensing operations determined that greater than a predetermined number of non-volatile storage elements achieved the first alternative result. Subsequent programming process are adjusted based on the identification of the program pulse if the one or more sensing operations determined that less than a required number of non-volatile storage elements achieved any of the alternative results.
Abstract:
In an example embodiment, an electronic circuit comprises a memory matrix with rows and columns of memory cells. First row conductors are provided for each of the rows. Second row conductors correspond to pairs of rows, each successive row forming a respective pair with a preceding one of the rows, so that each pair overlaps with one row of the next pair. Column conductors are provided for each of the columns. Each of the memory cells comprises an access transistor, a node and a first and a second resistive memory element. The access transistor has a control electrode coupled to the first row conductor of the row of the memory cell, a main current channel coupled between the column conductor for the column of the memory cell and the node. The first and second the resistive memory element are coupled between the node and the second row conductors for the pairs of rows to which the memory cell belongs.
Abstract:
The invention relates to a non-volatile memory device comprising: an input for providing external data (D1) to be stored on the non-volatile memory device; and a first non-volatile memory block (100) and a second non-volatile memory block (200), the first non-volatile memory block (100) and the second non-volatile memory block (200) being provided on a single die (10), wherein the first non-volatile memory block (100) and second non-volatile memory block (200) are of a different type such that the first non-volatile memory block (100) and the second non-volatile memory block (200) require incompatible external attack techniques in order to retrieve data there from, the external data (D1) being stored in a distributed way (D1′, D1″) into both the first non-volatile memory block (100) and the second non-volatile memory block (200). The invention further relates to method of protecting data in a non-volatile memory device.
Abstract:
Provided are memory devices and memory programming methods. A memory device may include: a multi-bit cell array that includes a plurality of memory cells; a controller that extracts state information of each of the memory cells, divides the plurality of memory cells into a first group and a second group, assigns a first verify voltage to memory cells of the first group and assigns a second verify voltage to memory cells of the second group; and a programming unit that changes a threshold voltage of each memory cell of the first group until the threshold voltage of each memory cell of the first group is greater than or equal to the first verify voltage, and changes a threshold voltage of each memory cell of the second group until the threshold voltage of each memory cell of the second group is greater than or equal to the second verify voltage.
Abstract:
A nonvolatile memory having a non-power of two memory capacity is disclosed. The nonvolatile memory device includes at least one plane. The plane includes a plurality of blocks with each of the blocks divided into a number of pages and each of the blocks defined along a first dimension by a first number of memory cells for storing data, and along a second dimension of by a second number of memory cells for storing data. The nonvolatile memory has a non-power of two capacity proportionally related to a total number of memory cells in said plane. The nonvolatile memory also includes a plurality of row decoders. An at least substantially one-to-one relationship exists, in the memory device, for number of row decoders to number of pages. Each of the row decoders is configured to facilitate a read operation on an associated page of the memory device.