Method of growing group III nitride crystals
    31.
    发明授权
    Method of growing group III nitride crystals 有权
    生长III族氮化物晶体的方法

    公开(公告)号:US08449672B2

    公开(公告)日:2013-05-28

    申请号:US12149051

    申请日:2008-04-25

    IPC分类号: C03B11/04

    CPC分类号: C30B9/12 C30B19/02 C30B29/406

    摘要: This disclosure pertains to a process for making single crystal Group III nitride, particularly gallium nitride, at low pressure and temperature, in the region of the phase diagram of Group III nitride where Group III nitride is thermodynamically stable comprises a charge in the reaction vessel of (a) Group III nitride material as a source, (b) a barrier of solvent interposed between said source of Group III nitride and the deposition site, the solvent being prepared from the lithium nitride (Li3N) combined with barium fluoride (BaF2), or lithium nitride combined with barium fluoride and lithium fluoride (LiF) composition, heating the solvent to render it molten, dissolution of the source of GaN material in the molten solvent and following precipitation of GaN single crystals either self seeded or on the seed, maintaining conditions and then precipitating out.

    摘要翻译: 本公开涉及在III族氮化物的相图的区域中在低压和温度下制造单晶III族氮化物,特别是氮化镓的方法,其中III族氮化物是热力学稳定的,包括反应容器中的电荷 (a)作为源的III族氮化物材料,(b)介于所述III族氮化物源和沉积位置之间的溶剂阻挡层,所述溶剂由与氟化钡(BaF 2)组合的氮化锂(Li 3 N)制备, 或与氮化钡和氟化锂(LiF)组合物的氮化锂,加热溶剂使其熔融,将GaN材料源溶解在熔融溶剂中,并且随着GaN单结晶的沉淀,自身接种或种子,保持 条件然后沉淀出来。

    Freestanding III-Nitride Single-Crystal Substrate and Method of Manufacturing Semiconductor Device Utilizing the Substrate
    34.
    发明申请
    Freestanding III-Nitride Single-Crystal Substrate and Method of Manufacturing Semiconductor Device Utilizing the Substrate 有权
    独立的III型氮化物单晶基板和利用该基板制造半导体器件的方法

    公开(公告)号:US20120070962A1

    公开(公告)日:2012-03-22

    申请号:US13006429

    申请日:2011-01-14

    摘要: Freestanding III-nitride single-crystal substrates whose average dislocation density is not greater than 5×105 cm−2 and that are fracture resistant, and a method of manufacturing semiconductor devices utilizing such freestanding III-nitride single-crystal substrates are made available. The freestanding III-nitride single-crystal substrate includes one or more high-dislocation-density regions (20h), and a plurality of low-dislocation-density regions (20k) in which the dislocation density is lower than that of the high-dislocation-density regions (20h), wherein the average dislocation density is not greater than 5×105 cm−2. Herein, the ratio of the dislocation density of the high-dislocation-density region(s) (20h) to the average dislocation density is sufficiently large to check the propagation of cracks in the substrate. And the semiconductor device manufacturing method utilizes the freestanding III-nitride single crystal substrate (20p).

    摘要翻译: 可以获得平均位错密度不大于5×105cm-2并且是耐断裂性的独立的III族氮化物单晶衬底,以及利用这种独立式III族氮化物单晶衬底制造半导体器件的方法。 独立的III族氮化物单晶衬底包括一个或多个高位错密度区域(20h)和位错密度低于高位错密度区域(20k)的多个低位错密度区域(20k) 密度区域(20h),其中平均位错密度不大于5×105cm-2。 这里,高位错密度区域(20h)的位错密度与平均位错密度的比例足够大,以检查基板中的裂纹的传播。 并且半导体器件制造方法利用独立的III族氮化物单晶衬底(20p)。

    Method for producing group III nitride semiconductor
    37.
    发明申请
    Method for producing group III nitride semiconductor 有权
    III族氮化物半导体的制造方法

    公开(公告)号:US20110155046A1

    公开(公告)日:2011-06-30

    申请号:US12926995

    申请日:2010-12-22

    申请人: Shiro Yamazaki

    发明人: Shiro Yamazaki

    IPC分类号: C30B19/10 C30B19/04

    摘要: In the Na flux method, a target semiconductor layer is separated from a sapphire substrate of a template substrate. The template substrate formed of the sapphire substrate and a GaN layer is placed in a Ga—Na molten mixture. The temperature the molten mixture and the nitrogen pressure are adjusted to 850° C. and 2.5 MPa, respectively. Under the conditions, a part of the GaN layer is melted back until the surface of the sapphire substrate is exposed, so that the remaining portion of the GaN layer is left in the form of a plurality of upright columns. Then, the pressure is elevated to 3 MPa, whereby a target GaN layer is grown on the processed GaN layer. Through lowering temperature, stress due to the difference in linear expansion coefficient and lattice constant between sapphire and GaN is generated, to thereby generate cracks in the processed GaN layer. By virtue of the cracking, the target GaN layer is separated from the sapphire substrate.

    摘要翻译: 在Na通量法中,将目标半导体层与模板基板的蓝宝石基板分离。 由蓝宝石衬底和GaN层形成的模板衬底放置在Ga-Na熔融混合物中。 熔融混合物的温度和氮气压力分别调节到850℃和2.5MPa。 在这种条件下,GaN层的一部分被熔化,直到蓝宝石衬底的表面露出,使得GaN层的剩余部分呈多个立柱的形式。 然后,将压力升高至3MPa,由此在经处理的GaN层上生长目标GaN层。 通过降低温度,产生由于蓝宝石和GaN之间的线膨胀系数和晶格常数的差异引起的应力,从而在经处理的GaN层中产生裂纹。 由于破裂,目标GaN层与蓝宝石衬底分离。

    PRODUCTION OF A HEXAGONAL BORON NITRIDE CRYSTAL BODY CAPABLE OF EMITTING OUT ULTRAVIOLET RADIATION
    39.
    发明申请
    PRODUCTION OF A HEXAGONAL BORON NITRIDE CRYSTAL BODY CAPABLE OF EMITTING OUT ULTRAVIOLET RADIATION 有权
    生产能够发射超紫外线辐射的十六烷基硼酸盐晶体

    公开(公告)号:US20100120187A1

    公开(公告)日:2010-05-13

    申请号:US12451641

    申请日:2008-05-22

    IPC分类号: H01L21/20

    摘要: The invention has for its object to provide a process of synthesizing high-purity hBN crystal bodies on a robust substrate even under normal pressure.The inventive process of producing hexagonal boron nitride crystal bodies is characterized by comprising a preparation step of preparing a mixture of a boron nitride raw material and a metal solvent comprising a transition metal, a contact step of bringing a sapphire substrate in contact with the mixture, a heating step of heating the mixture, and a recrystallization step of recrystallizing at normal pressure a melt obtained in the heating step. It is also characterized by using as the metal solvent a transition metal selected from the group consisting of Fe, Ni, Co, and a combination thereof, and at least one substance selected from the group consisting of Cr, TiN and V without recourse to any sapphire substrate.

    摘要翻译: 本发明的目的是提供即使在常压下也能在坚固的基底上合成高纯度hBN晶体的方法。 制造六方氮化硼晶体的本发明方法的特征在于包括制备氮化硼原料和包含过渡金属的金属溶剂的混合物的制备步骤,使蓝宝石衬底与该混合物接触的接触步骤, 加热混合物的加热步骤和在常压下重结晶在加热步骤中获得的熔体的再结晶步骤。 还特征在于使用选自Fe,Ni,Co及其组合的过渡金属作为金属溶剂,以及选自Cr,TiN和V中的至少一种物质,而不用任何 蓝宝石衬底。