Patent search ap:("INTERNATIONAL BUSINESS MACHINES CORPORATION") AND inv:"Christopher V. Jahnes" Page 4

31.

发明授权
Nanochannel process and structure for bio-detection 有权
Title translation: 纳米通道工艺和生物检测结构

公开(公告)号：US09059135B2

公开(公告)日：2015-06-16

申请号：US13969595

申请日：2013-08-18

Applicant: International Business Machines Corporation

Inventor： Jingwei Bai , Evan G. Colgan , Christopher V. Jahnes , Stanislav Polonsky

IPC: G01N27/403 , H01L29/40 , G01N27/414 , H01L21/283 , H01L21/8238

CPC classification number: H01L29/401 , G01N27/403 , G01N27/4148 , H01L21/283 , H01L21/823871

Abstract: Nanochannel sensors and methods for constructing nanochannel sensors. An example method includes forming a sacrificial line on an insulating layer, forming a dielectric layer, etching a pair of electrode trenches, forming a pair of electrodes, and removing the sacrificial line to form a nanochannel. The dielectric layer may be formed on insulating layer and around the sacrificial line. The pair of electrode trenches may be etched in the dielectric layer on opposite sides of the sacrificial line. The pair of electrodes may be formed by filling the electrode trenches with electrode material. The sacrificial line may be removed by forming a nanochannel between the at least one pair of electrodes.

Abstract translation: 纳米通道传感器和构造纳米通道传感器的方法。示例性方法包括在绝缘层上形成牺牲线，形成电介质层，蚀刻一对电极沟槽，形成一对电极，以及去除牺牲线以形成纳米通道。介电层可以形成在绝缘层上和牺牲线周围。可以在牺牲线的相对侧上的电介质层中蚀刻该对电极沟槽。可以通过用电极材料填充电极沟槽来形成该对电极。可以通过在至少一对电极之间形成纳米通道来去除牺牲线。

32.

发明授权
Parallel optical transceiver module 有权
Title translation: 并行光收发模块

公开(公告)号：US08536610B2

公开(公告)日：2013-09-17

申请号：US13757040

申请日：2013-02-01

Applicant: International Business Machines Corporation

Inventor： Fuad E. Doany , Christopher V. Jahnes , Clint L. Schow , Mehmet Soyuer , Alexander V. Rylyakov

IPC: H01L27/15

CPC classification number: G02B6/12 , G02B6/4232 , G02B6/4246 , G02B6/4249 , G02B6/4259 , G02B6/4267 , H01L27/04 , H01L29/02 , H01L31/0203 , H01L2224/16225 , H01S5/40

Abstract: A silicon-on-insulator wafer is provided. The silicon-on-insulator wafer includes a silicon substrate having optical vias formed therein. In addition, an optically transparent oxide layer is disposed on the silicon substrate and the optically transparent oxide layer is in contact with the optical vias. Then, a complementary metal-oxide-semiconductor layer is formed over the optically transparent oxide layer.

Abstract translation: 提供了绝缘体上硅晶片。绝缘体上硅晶片包括其中形成有光通孔的硅衬底。此外，在硅衬底上设置光学透明氧化物层，并且光学透明氧化物层与光学通孔接触。然后，在光学透明氧化物层上形成互补的金属氧化物半导体层。

33.

发明授权
Planar cavity MEMS and related structures, methods of manufacture and design structures 有权

公开(公告)号：US11104572B2

公开(公告)日：2021-08-31

申请号：US16580133

申请日：2019-09-24

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Christopher V. Jahnes , Anthony K. Stamper

IPC: B81C1/00 , B81B3/00 , H01L41/113 , H01H57/00 , H01H1/00 , H01P1/12

Abstract: A method of forming a Micro-Electro-Mechanical System (MEMS) includes forming a lower electrode on a first insulator layer within a cavity of the MEMS. The method further includes forming an upper electrode over another insulator material on top of the lower electrode which is at least partially in contact with the lower electrode. The forming of the lower electrode and the upper electrode includes adjusting a metal volume of the lower electrode and the upper electrode to modify beam bending.

34.

发明授权
Micro-electro-mechanical system (MEMS) and related actuator bumps, methods of manufacture and design structures 有权

公开(公告)号：US10811206B2

公开(公告)日：2020-10-20

申请号：US16207485

申请日：2018-12-03

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Christopher V. Jahnes , Anthony K. Stamper

IPC: H02N1/00 , H01H59/00 , B81C1/00 , G06F30/30 , G06F30/39 , B81B3/00 , B81B7/00 , H01H1/00

Abstract: Micro-Electro-Mechanical System (MEMS) structures, methods of manufacture and design structures are provided. The method of forming a MEMS structure includes forming fixed actuator electrodes and a contact point on a substrate. The method further includes forming a MEMS beam over the fixed actuator electrodes and the contact point. The method further includes forming an array of actuator electrodes in alignment with portions of the fixed actuator electrodes, which are sized and dimensioned to prevent the MEMS beam from collapsing on the fixed actuator electrodes after repeating cycling. The array of actuator electrodes are formed in direct contact with at least one of an underside of the MEMS beam and a surface of the fixed actuator electrodes.

35.

发明授权
Micro-electro-mechanical system (MEMS) and related actuator bumps, methods of manufacture and design structures 有权

公开(公告)号：US10748725B2

公开(公告)日：2020-08-18

申请号：US15406134

申请日：2017-01-13

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Christopher V. Jahnes , Anthony K. Stamper

IPC: H02N1/00 , H01H59/00 , B81C1/00 , G06F30/30 , G06F30/39 , B81B3/00 , B81B7/00 , H01H1/00

Abstract: Micro-Electro-Mechanical System (MEMS) structures, methods of manufacture and design structures are provided. The method of forming a MEMS structure includes forming fixed actuator electrodes and a contact point on a substrate. The method further includes forming a MEMS beam over the fixed actuator electrodes and the contact point. The method further includes forming an array of actuator electrodes in alignment with portions of the fixed actuator electrodes, which are sized and dimensioned to prevent the MEMS beam from collapsing on the fixed actuator electrodes after repeating cycling. The array of actuator electrodes are formed in direct contact with at least one of an underside of the MEMS beam and a surface of the fixed actuator electrodes.

36.

发明授权
Planar cavity MEMS and related structures, methods of manufacture and design structures 有权

公开(公告)号：US10173889B2

公开(公告)日：2019-01-08

申请号：US14515681

申请日：2014-10-16

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Russell T. Herrin , Christopher V. Jahnes , Anthony K. Stamper , Eric J. White

IPC: H01L29/84 , B81B3/00 , H01L41/113 , B81C1/00 , H01H57/00 , G06F17/50 , H01H1/00 , H01H59/00

Abstract: A method of forming at least one Micro-Electro-Mechanical System (MEMS) cavity includes forming a first sacrificial cavity layer over a wiring layer and substrate. The method further includes forming an insulator layer over the first sacrificial cavity layer. The method further includes performing a reverse damascene etchback process on the insulator layer. The method further includes planarizing the insulator layer and the first sacrificial cavity layer. The method further includes venting or stripping of the first sacrificial cavity layer to a planar surface for a first cavity of the MEMS.

37.

发明授权
Micro-electro-mechanical system (MEMS) and related actuator bumps, methods of manufacture and design structures 有权

公开(公告)号：US10147577B2

公开(公告)日：2018-12-04

申请号：US15155409

申请日：2016-05-16

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Christopher V. Jahnes , Anthony K. Stamper

IPC: H01H59/00 , H02N1/00 , B81B3/00 , B81B7/00 , G06F17/50 , B81C1/00 , H01H1/00

Abstract: Micro-Electro-Mechanical System (MEMS) structures, methods of manufacture and design structures are provided. The method of forming a MEMS structure includes forming fixed actuator electrodes and a contact point on a substrate. The method further includes forming a MEMS beam over the fixed actuator electrodes and the contact point. The method further includes forming an array of actuator electrodes in alignment with portions of the fixed actuator electrodes, which are sized and dimensioned to prevent the MEMS beam from collapsing on the fixed actuator electrodes after repeating cycling. The array of actuator electrodes are formed in direct contact with at least one of an underside of the MEMS beam and a surface of the fixed actuator electrodes.