Abstract:
A device and method of optical equalization using an optical modulator is provided. An electrical modulation signal is split into a first modulation signal and a second modulation signal. The second modulation signal is delayed relative to the first modulation signal. An amplitude of the second modulation signal is attenuated relative to the first modulation signal. The first modulation signal is applied to a first waveguide segment of the optical modulator. The second modulation signal that is delayed and attenuated relative to the first modulation signal is applied to a second waveguide segment of the optical modulator. Both the applied first and second modulation signals generate a feed-forward equalized optical signal that is recombined in the optical domain.
Abstract:
A method for transmitting data between a first device and a second device over a communication link includes transmitting, by the first device, data of a first type using one or more first channels, receiving, by the second device, the data of the first type from the first device using the one or more first channels, generating, by the second device, data of a second type based on the data of the first type, and transmitting, by the second device, the generated data of the second type using one or more second channels. The data of the first type and the data of the second type are different. The one or more second channels are channels dedicated to transmit the data of the second type.
Abstract:
A method and system of optical communication are provided. An optical modulator device includes a first and a second waveguide segment, and is configured to modulate an incident optical signal. A first feed-forward equalization (FFE) circuit including an inner first tap and an inner second tap, is configured to equalize the first waveguide segment. A second FFE circuit including a first inner tap and a second inner tap, is configured to equalize the second waveguide segment. An FFE recombination of the first inner tap and the second inner tap of the first and second FFE circuits, is in the electrical domain, respectively. An FFE recombination of the first and second modulation signals, operative to equalize a combination of the first second waveguide segments, is in the optical domain.
Abstract:
Methods an systems for low-power transmission include biasing an emitter in a non-linear operating range of the emitter near a threshold current of the emitter. A data signal is distorted to add a precursor pulse to a rising edge of a data waveform to quickly bring the emitter into a linear operating range. The distorted data signal is transmitted at the emitter.
Abstract:
Tuning parameters of individual wavelength channels transmitted over a multimode optical fiber is provided. Characteristics of the multimode optical fiber used for an optical data link within an optical signal transmission system are retrieved. A wavelength channel grid including each central wavelength in a plurality of central wavelengths that corresponds to each particular wavelength channel in a plurality of wavelength channels used to transmit data via optical signals over the multimode optical fiber is determined. A maximum allowable data rate is calculated for each wavelength channel based on the characteristics of the multimode optical fiber at defined channel wavelengths, optical signal transceiver specifications, and data transmission performance requirements for the optical signal transmission system. Operational parameters are assigned to each wavelength channel based on the calculated maximum allowable data rate for each wavelength channel to achieve the data transmission performance requirements for the optical signal transmission system.
Abstract:
A photonic integrated circuit apparatus is disclosed. The apparatus includes a photonic chip and a lens array coupling element. The photonic chip includes a waveguide at a side edge surface of the photonic chip. The lens array coupling element is mounted on a top surface of the photonic chip and on the side edge surface. The coupling element includes a lens array that is configured to modify spot sizes of light traversing to or from the waveguide. The coupling element further includes an overhang on a side of the coupling element that opposes the lens array and that abuts the top surface of the photonic chip. The overhang includes a vertical stop surface that has a depth configured to horizontally align an edge of the waveguide with a focal length of the lens array and that vertically aligns focal points of the lens array with the edge of the waveguide.
Abstract:
A method of forming a circuit includes forming a transimpedance amplifier having a first input node and a second input node. The method also includes forming a feedback circuit having a first transistor having a drain terminal connected to the first input node, a source terminal, and a gate terminal, a second transistor having a drain terminal connected to the second input node, a source terminal, and a gate terminal, and a third transistor having a drain terminal connected to the source terminal of the first transistor and the source terminal of the second terminal.
Abstract:
A device and method of optical equalization using an optical modulator is provided. An electrical modulation signal is split into a first modulation signal and a second modulation signal. The second modulation signal is delayed relative to the first modulation signal. An amplitude of the second modulation signal is attenuated relative to the first modulation signal. The first modulation signal is applied to a first waveguide segment of the optical modulator. The second modulation signal that is delayed and attenuated relative to the first modulation signal is applied to a second waveguide segment of the optical modulator. Both the applied first and second modulation signals generate a feed-forward equalized optical signal that is recombined in the optical domain.
Abstract:
A silicon-on-insulator wafer is provided. The silicon-on-insulator wafer includes a silicon substrate having optical vias formed therein. In addition, an optically transparent oxide layer is disposed on the silicon substrate and the optically transparent oxide layer is in contact with the optical vias. Then, a complementary metal-oxide-semiconductor layer is formed over the optically transparent oxide layer.
Abstract:
A communication system includes first and second devices. The first device includes a first transmitter and a first receiver. The first transmitter transmits one data of a first type using one or more first channels over a first communication link to the second device. The first receiver receives one data of a second type, from the second device, using one or more second channels over the first communication link. The second device includes a second transmitter and a second receiver. The second receiver receives the one data of the first type using the one or more first channels over the first communication link, and to generate the one data of the second type based on the one data of the first type. The second transmitter transmits the one data of the second type using one or more second channels over the first communication link to the first device.