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    Microelectromechanical (MEM) device including a spring release bridge and method of making the same
    4.
    发明授权
    Microelectromechanical (MEM) device including a spring release bridge and method of making the same 有权
    包括弹簧释放桥的微机电（MEM）装置及其制造方法

    公开(公告)号：US07273762B2

    公开(公告)日：2007-09-25

    申请号：US10985530

    申请日：2004-11-09

    申请人： Bishnu Prasanna Gogoi

    发明人： Bishnu Prasanna Gogoi

    IPC分类号： H01L21/00

    CPC分类号： B81C1/00936 ,  B81B2201/0235 ,  B81B2203/0109 ,  B81C2201/0109 ,  G01P15/0802 ,  G01P15/125 ,  G01P2015/0814

    摘要： A microelectromechanical (MEM) device includes a substrate, a suspension spring, a structure, and a release bridge. The suspension spring is coupled to, and suspended above, the substrate. The structure is coupled to the suspension spring and is resiliently suspended thereby above the substrate. The release bridge is coupled to the suspension spring. During sensor manufacture, the suspension spring and structure are suspended above the substrate by undergoing a release process. The release bridge is sized such that, during the release process, the structure and the suspension spring are released substantially simultaneously.

    摘要翻译： 微机电（MEM）装置包括基板，悬架弹簧，结构和释放桥。 悬架弹簧联接到衬底上并悬挂在衬底上。 该结构耦合到悬架弹簧并且弹性地悬挂在衬底上方。 释放桥联接到悬架弹簧。 在传感器制造过程中，悬架弹簧和结构通过进行释放过程而悬浮在基板上方。 释放桥的尺寸使得在释放过程中，结构和悬挂弹簧基本上同时释放。

    Method for fabricating a gyroscope
    5.
    发明授权
    Method for fabricating a gyroscope 有权
    制造陀螺仪的方法

    公开(公告)号：US07225524B2

    公开(公告)日：2007-06-05

    申请号：US11002241

    申请日：2004-12-03

    申请人： Moon-chul Lee ,  Hyung Choi ,  Seok-jin Kang

    发明人： Moon-chul Lee ,  Hyung Choi ,  Seok-jin Kang

    IPC分类号： H04R31/00

    CPC分类号： G01C19/5769 ,  B81B3/0035 ,  B81B2201/0242 ,  B81C1/00579 ,  B81C1/0092 ,  B81C1/00936 ,  H01R13/52 ,  Y10T29/49002 ,  Y10T29/49005 ,  Y10T29/4902 ,  Y10T74/12 ,  Y10T74/1229

    摘要： Method for fabricating a gyroscope including: fabricating a SMS wafer where a first wafer, a metal film, and a second wafer are sequentially stacked; forming a cantilever or a bridge shaped-structure on the relevant portion of the first wafer through the photolithography process; attaching to the surface of the first wafer, a first cap made of glass and having a predetermined space for sealing the movable structure in a vacuum state; separating and removing the metal film and the second wafer from the first wafer; and attaching to the backside of the first wafer, the second cap which is structurally and materially symmetric to the first cap. The SMS wafer is fabricated by depositing the metal film on the second wafer and bonding the first wafer on the metal film using metal paste or material of polymer series. With lower material costs, improvements in performance and characteristics can be achieved.

    摘要翻译： 制造陀螺仪的方法，包括：制造顺序堆叠第一晶片，金属膜和第二晶片的SMS晶片; 通过光刻工艺在第一晶片的相关部分上形成悬臂或桥形结构; 附接到第一晶片的表面，由玻璃制成的第一盖，并且具有用于在真空状态下密封可移动结构的预定空间; 从第一晶片分离和去除金属膜和第二晶片; 并且附接到所述第一晶片的所述背面，所述第二盖在所述第一盖结构和物理上对称。 通过在第二晶片上沉积金属膜并使用金属浆料或聚合物系列材料将第一晶片接合在金属膜上来制造SMS晶片。 随着材料成本的降低，可以实现性能和特性的提高。

    MEMS structure and method for fabricating the same
    6.
    发明授权
    MEMS structure and method for fabricating the same 失效
    MEMS结构及其制造方法

    公开(公告)号：US07074635B2

    公开(公告)日：2006-07-11

    申请号：US10927459

    申请日：2004-08-27

    申请人： Jong Sam Kim ,  Sung Jun Lee ,  Ro Woon Lee

    发明人： Jong Sam Kim ,  Sung Jun Lee ,  Ro Woon Lee

    IPC分类号： H01L21/00

    CPC分类号： B81C1/00936 ,  B81C2201/0132

    摘要： A MEMS structure includes a floating space formed on the upper silicon layer by a first dry etching, and then dry etched to a predeterminded depth on the lower silicon layer by etching gas supplied through the etched holes from which the oxide film has been removed at the bottom surface thereof in a second dry etching process, so as to float the movable portion; and the oxide film for preventing electrical short circuit remaining on the lower surface of the movable portion so as to correspond to the lower silicon layer leaving the floating space therebetween.

    摘要翻译： MEMS结构包括通过第一干蚀刻在上硅层上形成的浮动空间，然后通过蚀刻通过蚀刻孔提供的气蚀干蚀刻到下硅层上的预制深度 其第二干蚀刻工艺中的底表面浮起可动部分; 以及用于防止可动部分的下表面上的电短路的氧化膜，以便对应于在其间留下浮动空间的下硅层。

    Microelectromechanical (MEM) device including a spring release bridge and method of making the same
    7.
    发明申请
    Microelectromechanical (MEM) device including a spring release bridge and method of making the same 有权
    包括弹簧释放桥的微机电（MEM）装置及其制造方法

    公开(公告)号：US20060096377A1

    公开(公告)日：2006-05-11

    申请号：US10985530

    申请日：2004-11-09

    申请人： Bishnu Gogoi

    发明人： Bishnu Gogoi

    IPC分类号： G01P15/00

    CPC分类号： B81C1/00936 ,  B81B2201/0235 ,  B81B2203/0109 ,  B81C2201/0109 ,  G01P15/0802 ,  G01P15/125 ,  G01P2015/0814

    摘要： A microelectromechanical (MEM) device includes a substrate, a suspension spring, a structure, and a release bridge. The suspension spring is coupled to, and suspended above, the substrate. The structure is coupled to the suspension spring and is resiliently suspended thereby above the substrate. The release bridge is coupled to the suspension spring. During sensor manufacture, the suspension spring and structure are suspended above the substrate by undergoing a release process. The release bridge is sized such that, during the release process, the structure and the suspension spring are released substantially simultaneously.

    摘要翻译： 微机电（MEM）装置包括基板，悬架弹簧，结构和释放桥。 悬架弹簧联接到衬底上并悬挂在衬底上。 该结构耦合到悬架弹簧并且弹性地悬挂在衬底上方。 释放桥联接到悬架弹簧。 在传感器制造过程中，悬架弹簧和结构通过进行释放过程而悬浮在基板上方。 释放桥的尺寸使得在释放过程中，结构和悬挂弹簧基本上同时释放。

    Dendritic material sacrificial layer micro-scale gap formation method
    8.
    发明授权
    Dendritic material sacrificial layer micro-scale gap formation method 失效
    树枝状材料牺牲层微尺度间隙形成方法

    公开(公告)号：US06248668B1

    公开(公告)日：2001-06-19

    申请号：US09483153

    申请日：2000-01-14

    申请人： David Beebe ,  Hyuk-Jeen Suh ,  Jeffrey S. Moore ,  Pamidighantam Bharathi

    发明人： David Beebe ,  Hyuk-Jeen Suh ,  Jeffrey S. Moore ,  Pamidighantam Bharathi

    IPC分类号： H01L21302

    CPC分类号： B81B3/0005 ,  B81C1/00936 ,  B81C2201/0108

    摘要： A micro-scale gap fabrication process using a dry releasable dendritic material sacrificial layer. The fabrication process produces micro-scale gaps, such as those required between a suspended microstructure and an opposing surface in MEMS. The dendritic sacrificial layer is releasable by heating the dendritic material past its decomposition point after forming the microstructure. The sacrificial layer may be applied to a wafer, for example, by spin coating a solution including the dissolved dendritic material. The sacrificial layer, after being formed, may be patterned and prepared for accepting structural material for the microstructure. After a desired microstructure or microstructures are formed around the sacrificial layer, the layer is dry releasable by heating.

    摘要翻译： 使用干可剥离树枝状材料牺牲层的微尺度间隙制造工艺。 制造过程产生微尺度间隙，例如在MEMS中的悬浮微结构和相对表面之间所需的间隙。 树枝状牺牲层通过在形成微观结构之后通过加热树枝状材料经过其分解点来释放。 牺牲层可以施加到晶片上，例如通过旋涂包括溶解的树枝状材料的溶液。 形成后的牺牲层可以被图案化并制备用于接受微结构的结构材料。 在围绕牺牲层形成期望的微结构或微结构之后，通过加热可以释放该层。

    Method for manufacturing a micromechanical relay
    9.
    发明授权
    Method for manufacturing a micromechanical relay 有权
    微机电继电器的制造方法

    公开(公告)号：US6162657A

    公开(公告)日：2000-12-19

    申请号：US308007

    申请日：1999-05-11

    申请人： Ignaz Schiele ,  Frank Kozlowski

    发明人： Ignaz Schiele ,  Frank Kozlowski

    IPC分类号： B81B3/00 ,  B81C1/00 ,  H01H59/00 ,  H01L21/00

    CPC分类号： B81C1/00936 ,  B81B2201/018 ,  H01H59/0009 ,  H01H2059/0018 ,  H01H2059/0072

    摘要： A method of producing a micromechanical relay comprises the steps of providing a substrate including a conductive fixed electrode in or on said substrate. A sacrificial layer and a conductive layer are applied and the conductive layer is structured so as to define a beam structure as a movable counterelectrode opposite said fixed electrode. A contact area is applied, the conductive layer extending between an anchoring region and the contact area and being insulated from said contact area. Subsequently, the sacrificial layer is removed by means of etching so as to produce the beam structure comprising a movable area and an area secured to the anchoring region on the substrate. The beam structure is defined such that etch access openings in said beam structure are structured such that the size of the area covered by the etch access openings used for etching the sacrificial layer increases from the area of the beam structure secured to the substrate to the movable area of the beam structure so that the etching of the sacrificial layer is controlled in such a way that the portion of the sacrificial layer arranged below the movable area of the beam structure is etched faster than the portion of the sacrificial layer arranged in the area of the anchoring region.

    摘要翻译： PCT No.PCT / EP97 / 06174 Sec。 371日期1999年5月11日 102（e）日期1999年5月11日PCT 1997年11月6日PCT公布。 出版物WO98 / 21734 日期1998年5月22日制造微机电继电器的方法包括以下步骤：在所述衬底中或所述衬底上提供包括导电固定电极的衬底。 施加牺牲层和导电层，并且导电层被构造成将波束结构限定为与所述固定电极相对的可移动反电极。 施加接触区域，导电层在锚固区域和接触区域之间延伸并且与所述接触区域绝缘。 随后，通过蚀刻去除牺牲层，以便产生包括可移动区域和固定到衬底上的锚定区域的区域的束结构。 光束结构被定义为使得所述光束结构中的蚀刻访问开口被构造成使得用于蚀刻牺牲层的蚀刻访问开口覆盖的区域的尺寸从固定到基板的光束结构的区域增加到可移动 波束结构的面积，使得牺牲层的蚀刻被控制为使得布置在光束结构的可移动区域下方的牺牲层的部分被蚀刻得比布置在 锚固区域。