公开(公告)号：US20170135229A1

公开(公告)日：2017-05-11

申请号：US15318689

申请日：2015-06-12

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Muthu Sebastian ,  Fong Liang Tan

IPC: H05K3/46 ,  H05K1/02 ,  H05K1/09 ,  C23C14/14 ,  C23C14/08 ,  C23C14/34 ,  C23C18/38 ,  C23C18/42 ,  C23C18/16 ,  C25D3/38 ,  C25D3/46 ,  C25D5/54 ,  C25D5/48 ,  G03F7/20 ,  G03F7/40 ,  G06F3/044 ,  H05K3/06

CPC classification number: H05K3/467 ,  C23C14/00 ,  C23C14/083 ,  C23C14/14 ,  C23C14/34 ,  C23C18/165 ,  C23C18/1689 ,  C23C18/38 ,  C23C18/42 ,  C25D3/38 ,  C25D3/46 ,  C25D5/48 ,  C25D5/54 ,  C25D7/00 ,  G03F7/2002 ,  G03F7/40 ,  G06F3/041 ,  G06F3/044 ,  G06F2203/04103 ,  H01L31/1884 ,  H05K1/0274 ,  H05K1/09 ,  H05K3/064 ,  H05K3/067 ,  H05K3/16 ,  H05K3/381 ,  H05K3/388 ,  H05K2201/0108 ,  H05K2201/0326 ,  H05K2201/10128

Abstract: The present disclosure provides a method to provide a conductive bus bar on a patterned transparent conductor, such as ITO taces used for touch screen manufacturing. The method can be a cheaper and a more convenient technique to pattern a conductive metal or metal alloy, such as copper, silver, or a copper/silver/titanium alloy, on ITO electrodes in a roll-to-roll process.

公开(公告)号：US20170130337A1

公开(公告)日：2017-05-11

申请号：US15415493

申请日：2017-01-25

Applicant: TDK CORPORATION

Inventor： Kenichi YOSHIDA ,  Yuhei HORIKAWA ,  Atsushi SATO ,  Hisayuki ABE

IPC: C23C18/16 ,  H01L23/00 ,  C23C18/54 ,  C23C28/02 ,  C23C18/42

CPC classification number: C23C18/1655 ,  C23C18/1637 ,  C23C18/1651 ,  C23C18/32 ,  C23C18/42 ,  C23C18/54 ,  C23C28/02 ,  H01L24/03 ,  H01L24/05 ,  H01L2224/03464 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05083 ,  H01L2224/05139 ,  H01L2224/05144 ,  H01L2224/05147 ,  H01L2224/05164 ,  H01L2224/05644 ,  H01L2924/01015 ,  H01L2924/14 ,  H01L2924/00

Abstract: A method of providing a coating on a conductor. The coating has a first layer containing palladium and a second layer containing gold from the conductor side. The first layer has an inner layer on the conductor side and an outer layer arranged nearer to the second layer than the inner layer, and the outer layer has a higher phosphorus concentration than the inner layer.

公开(公告)号：US09627692B2

公开(公告)日：2017-04-18

申请号：US15117532

申请日：2015-01-06

Applicant: TOYOTA JIDOSHA KABUSHIKI KAISHA

Inventor： Keiichi Kaneko ,  Naoki Takehiro ,  Norimitsu Takeuchi

IPC: H01M4/92 ,  H01M4/86

CPC classification number: H01M4/926 ,  C23C18/1637 ,  C23C18/168 ,  C23C18/1689 ,  C23C18/42 ,  C23C18/54 ,  C25D3/38 ,  C25D5/48 ,  H01M4/8657 ,  H01M4/921

Abstract: The present invention is to provide such a carbon-supported catalyst that an activity expected from a catalytic activity by rotating disk electrode (RDE) evaluation is maintained even after the formation of a membrane electrode assembly (MEA). Disclosed is a carbon-supported catalyst wherein the carbon-supported catalyst includes fine catalyst particles that have a palladium-containing particle and a platinum-containing outermost layer covering at least part of the palladium-containing particle, and a carbon support supporting the fine catalyst particles, and wherein, in a cyclic voltammogram that is obtained by measuring, in an acid solution, the carbon-supported catalyst applied to a measurement electrode made of an electroconductive material, the proportion of the area of a hydrogen adsorption region that appears in a reduction current region to the total area of the hydrogen adsorption region and a hydrogen occlusion region that appears in the reduction current region, is 29% to 36%.

公开(公告)号：US20160359115A1

公开(公告)日：2016-12-08

申请号：US15243146

申请日：2016-08-22

Applicant: NIKON CORPORATION

Inventor： Shohei KOIZUMI ,  Takashi SUGIZAKI ,  Yusuke KAWAKAMI

IPC: H01L51/00 ,  C23C18/42 ,  H01L51/05 ,  C23C18/28 ,  C23C18/20 ,  C23C18/16 ,  C23C18/32

CPC classification number: H01L51/0021 ,  C23C18/1605 ,  C23C18/204 ,  C23C18/2086 ,  C23C18/285 ,  C23C18/30 ,  C23C18/32 ,  C23C18/42 ,  C23C18/54 ,  H01L51/0545 ,  H01L51/055 ,  H01L51/105

Abstract: A wiring pattern production method includes forming, on a substrate, a precursor film for a plating base film including a first formation material having an amino group protected by a photoreactive protecting group, forming a photoresist layer including a photoresist material on a surface of the precursor film, exposing the photoresist layer with a desired pattern of light, exposing the precursor film with a desired pattern of light to form the plating base film, developing the exposed photoresist layer, removing a deprotected protecting group, and depositing an electroless plating catalyst on the exposed surface of the plating base film.

Abstract translation: 布线图案制造方法包括在基板上形成包括具有被光反应保护基保护的氨基的第一形成材料的电镀基膜的前体膜，在前体的表面上形成包含光致抗蚀剂材料的光致抗蚀剂层 膜，以期望的光图案曝光光致抗蚀剂层，以期望的图案曝光前体膜以形成电镀基膜，显影曝光的光致抗蚀剂层，去除去保护的保护基团，以及将化学镀催化剂沉积在 电镀基膜的暴露表面。

公开(公告)号：US09435761B2

公开(公告)日：2016-09-06

申请号：US14506378

申请日：2014-10-03

Applicant: YUTEK TRONIC INC.

Inventor： Chuan-Hsing Huang

IPC: G01N27/327 ,  G01N27/30 ,  C23C18/24 ,  C23C18/32 ,  C23C18/42 ,  C23C18/31 ,  C23C18/16

CPC classification number: C23C18/1651 ,  C23C18/1641 ,  C23C18/24 ,  C23C18/31 ,  C23C18/32 ,  C23C18/42 ,  G01N27/307 ,  G01N27/327 ,  G01N27/3272

Abstract: An electrochemical strip is disclosed. The electrochemical strip includes a substrate and an electrode deposited on the substrate. The electrode includes a conductive paste layer, a first metal layer, a second metal layer, a third metal layer, and a fourth metal layer. The conductive paste is made of a material selected from the group consisting of copper paste, nickel paste, silver paste, and silver-carbon paste. The first metal layer is made of a group VIII metal. The second metal layer is made of nickel. The third metal layer is made of a group VIII metal. The fourth metal layer is made of a material selected from the group consisting of palladium, gold, and platinum.

Abstract translation: 公开了一种电化学条带。 电化学条带包括沉积在基底上的基底和电极。 电极包括导电浆料层，第一金属层，第二金属层，第三金属层和第四金属层。 导电膏由选自铜膏，镍膏，银膏和银 - 碳糊的材料制成。 第一金属层由VIII族金属制成。 第二金属层由镍制成。 第三金属层由VIII族金属制成。 第四金属层由选自钯，金和铂的材料制成。

公开(公告)号：US20160103508A1

公开(公告)日：2016-04-14

申请号：US14555717

申请日：2014-11-28

Applicant: INTERFACE OPTOELECTRONIC (SHENZHEN) CO., LTD. ,  GENERAL INTERFACE SOLUTION LIMITED

Inventor： TEN-HSING JAW ,  CHIN-YANG WU ,  CHIU-CHI CHEN ,  SHIH-WEN PENG ,  TE-JEN TSENG ,  CHENG-HSIN CHUANG

IPC: G06F3/041 ,  G06F1/16 ,  C23C18/42

CPC classification number: C23C18/42 ,  C23C18/1608 ,  C23C18/208 ,  C23C18/30 ,  G06F3/044 ,  G06F2203/04103 ,  G06F2203/04112

Abstract: A transparent conductive film includes a transparent substrate. A support layer is formed on one surface of the substrate. A surface of the support layer away from the substrate defines grooves formed in a mesh pattern. An ink layer is formed at a bottom of the grooves. A conductive layer is formed on the ink layer and in a mesh pattern. A top of the conductive layer protrudes out of the grooves.

Abstract translation: 透明导电膜包括透明基板。 在基板的一个表面上形成支撑层。 支撑层远离基板的表面限定形成网格图案的凹槽。 在凹槽的底部形成油墨层。 导电层形成在油墨层上并以网状图案形成。 导电层的顶部从凹槽突出。

公开(公告)号：USRE45881E1

公开(公告)日：2016-02-09

申请号：US13463110

申请日：2012-05-03

Applicant: Ronald Redline ,  David Sawoska ,  Peter Kukanskis ,  Donald Ferrier ,  Eric Yakobson

Inventor： Ronald Redline ,  David Sawoska ,  Peter Kukanskis ,  Donald Ferrier ,  Eric Yakobson

IPC: B23K35/00 ,  C25D3/02 ,  C25D3/46 ,  H05K3/24 ,  C23C18/42 ,  B05D5/12 ,  C23C18/54

CPC classification number: B23K35/007 ,  B05D5/12 ,  C23C18/42 ,  C23C18/54 ,  C25D3/46 ,  H05K3/244

Abstract: A method for enhancing the solderability of a metallic surface is disclosed where the metallic surface is plated with an immersion silver plate prior to soldering, which immersion silver plate is treated with an additive selected from the group consisting of fatty amines, fatty amides, quaternary salts, amphateric salts, resinous amines, resinous amides, fatty acids, resinous acids, ethoxylated derivatives of any of the foregoing, and mixtures of any of the foregoing. The immersion silver deposits created are resistant electromigration.

Abstract translation: 公开了一种用于增强金属表面的可焊性的方法，其中金属表面在焊接之前镀有浸银板，该浸渍银板用选自脂肪胺，脂肪酰胺，季铵盐 ，间苯二甲酸盐，树脂胺，树脂酰胺，脂肪酸，树脂酸，上述任何一种的乙氧基化衍生物，以及任何上述物质的混合物。 所产生的沉浸银沉积物是电阻迁移。

公开(公告)号：US20160023292A1

公开(公告)日：2016-01-28

申请号：US14806992

申请日：2015-07-23

Applicant: MITSUBISHI HEAVY INDUSTRIES, LTD.

Inventor： Kosuke NISHIKAWA ,  Hiroyuki KOBAYASHI ,  Hiroyasu MANAKO

IPC: B23K1/00 ,  B23K3/04 ,  B23K35/30 ,  B23K35/32 ,  C25D7/04 ,  C25D5/12 ,  C25D5/50 ,  C25D3/50 ,  C25D3/48 ,  C25D3/46 ,  C25D3/38 ,  C25D3/12 ,  C25D17/02 ,  C23C26/02 ,  C23C18/48 ,  C23C18/42 ,  C23C18/16 ,  B23K1/19

CPC classification number: C23C18/1632 ,  B23K1/19 ,  B23K35/3006 ,  B23K35/3013 ,  B23K35/302 ,  B23K35/3033 ,  B23K35/322 ,  B23K2103/08 ,  B23K2103/12 ,  B23K2103/18 ,  B23K2103/22 ,  C23C18/42 ,  C23C18/48 ,  C23C28/023 ,  C25D3/12 ,  C25D3/38 ,  C25D3/46 ,  C25D3/48 ,  C25D3/50 ,  C25D5/10 ,  C25D5/12 ,  C25D5/50 ,  C25D7/04 ,  C25D17/02

Abstract: A joining method for joining a first member and a second member is provided. The joining method includes a step of providing a first brazing layer on the first member by plating, a step of providing a second brazing layer on the first brazing layer by plating, a step of arranging the first member and the second member to oppose each other across the first brazing layer and the second brazing layer, and a step of melting the first brazing layer and the second brazing layer to join the first member and the second member which are arranged to oppose each other.

Abstract translation: 提供了一种用于接合第一构件和第二构件的接合方法。 接合方法包括通过电镀在第一构件上设置第一钎焊层的步骤，通过电镀在第一钎焊层上提供第二钎焊层的步骤，将第一构件和第二构件布置成彼此相对的步骤 横跨第一钎焊层和第二钎焊层，以及熔化第一钎焊层和第二钎焊层以使第一构件和第二构件彼此相对布置的步骤。

公开(公告)号：US20150176134A1

公开(公告)日：2015-06-25

申请号：US14414655

申请日：2013-07-11

Applicant: TOYO KOHAN CO., LTD.

Inventor： Nobuaki Mukai

IPC: C23C18/42 ,  C23C28/02 ,  B32B15/01 ,  C23C18/16

CPC classification number: C23C18/1831 ,  B32B15/01 ,  B32B15/017 ,  B32B15/018 ,  B32B15/043 ,  C22C5/02 ,  C22C19/00 ,  C22C21/06 ,  C23C18/16 ,  C23C18/1633 ,  C23C18/165 ,  C23C18/1651 ,  C23C18/1653 ,  C23C18/32 ,  C23C18/34 ,  C23C18/36 ,  C23C18/38 ,  C23C18/40 ,  C23C18/42 ,  C23C18/44 ,  C23C18/48 ,  C23C18/50 ,  C23C18/52 ,  C23C18/54 ,  C23C28/00 ,  C23C28/02 ,  C23C28/021 ,  C23C30/00 ,  C23C30/005 ,  H01M8/0228 ,  Y10T428/12708 ,  Y10T428/12715 ,  Y10T428/12722 ,  Y10T428/12861 ,  Y10T428/12868 ,  Y10T428/12875 ,  Y10T428/12882 ,  Y10T428/12889 ,  Y10T428/12896 ,  Y10T428/12903 ,  Y10T428/1291 ,  Y10T428/12917 ,  Y10T428/12924 ,  Y10T428/12931 ,  Y10T428/12937 ,  Y10T428/12944 ,  Y10T428/12972 ,  Y10T428/2495 ,  Y10T428/24967 ,  Y10T428/24975

Abstract: There is provided a method of electroless gold plating, wherein the method includes a step of forming an underlying alloy layer on a base material and a step of forming a gold plate layer directly on the underlying alloy layer by means of electroless reduction plating using a cyanide-free gold plating bath, wherein the method is characterized in that the underlying alloy layer is formed of an M1-M2-M3 alloy (where M1 is at least one element selected from Ni, Fe, Co, Cu, Zn and Sn, M2 is at least one element selected from Pd, Re, Pt, Rh, Ag and Ru, and M3 is at least one element selected from P and B).

Abstract translation: 提供了一种无电镀金的方法，其中所述方法包括在基材上形成下面的合金层的步骤，以及通过使用氰化物的无电还原电镀直接在下面的合金层上形成金板层的步骤 其特征在于，下面的合金层由M1-M2-M3合金（其中M1是选自Ni，Fe，Co，Cu，Zn和Sn中的至少一种元素，M2，M2 是选自Pd，Re，Pt，Rh，Ag和Ru中的至少一种元素，M3是选自P和B中的至少一种元素）。

公开(公告)号：US09046511B2

公开(公告)日：2015-06-02

申请号：US13865669

申请日：2013-04-18

Applicant: International Business Machines Corporation

Inventor： Hongbo Peng ,  Stephen M. Rossnagel ,  Ajay K. Royyuru ,  Gustavo A. Stolovitzky ,  Deqiang Wang

IPC: G01N33/487 ,  C12Q1/68 ,  C25D7/12 ,  C23C18/16 ,  C25D5/02 ,  C25D7/00 ,  C25D3/50 ,  C25D21/12 ,  C23C18/42

CPC classification number: G01N33/48721 ,  C12Q1/6869 ,  C23C18/161 ,  C23C18/1644 ,  C23C18/1675 ,  C23C18/42 ,  C25D3/50 ,  C25D5/02 ,  C25D7/00 ,  C25D7/12 ,  C25D21/12

Abstract: A mechanism is provided for forming a nanodevice. A reservoir is filled with a conductive fluid, and a membrane is formed to separate the reservoir in the nanodevice. The membrane includes an electrode layer having a tunneling junction formed therein. The membrane is formed to have a nanopore formed through one or more other layers of the membrane such that the nanopore is aligned with the tunneling junction of the electrode layer. The tunneling junction of the electrode layer is narrowed to a narrowed size by electroplating or electroless deposition. When a voltage is applied to the electrode layer, a tunneling current is generated by a base in the tunneling junction to be measured as a current signature for distinguishing the base. When an organic coating is formed on an inside surface of the tunneling junction, transient bonds are formed between the electrode layer and the base.