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公开(公告)号:US10237985B2
公开(公告)日:2019-03-19
申请号:US15318689
申请日:2015-06-12
Applicant: 3M INNOVATIVE PROPERTIES COMPANY
Inventor: Muthu Sebastian , Fong Liang Tan
IPC: H05K3/46 , G06F3/041 , H01L31/18 , C23C14/00 , H05K3/16 , H05K3/38 , G06F3/044 , C23C14/08 , C23C14/14 , C23C14/34 , C23C18/16 , C23C18/38 , C23C18/42 , C25D3/38 , C25D3/46 , C25D5/48 , C25D5/54 , G03F7/20 , G03F7/40 , H05K1/02 , H05K1/09 , H05K3/06 , C25D7/00
Abstract: The present disclosure provides a method to provide a conductive bus bar on a patterned transparent conductor, such as ITO traces used for touch screen manufacturing. The method can be a cheaper and a more convenient technique to pattern a conductive metal or metal alloy, such as copper, silver, or a copper/silver/titanium alloy, on ITO electrodes in a roll-to-roll process.
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公开(公告)号:US20140124477A1
公开(公告)日:2014-05-08
申请号:US14127277
申请日:2012-07-13
Applicant: 3M INNOVATIVE PROPERTIES COMPANY
Inventor: Muthu Sebastian , Fong Liang Tan
IPC: C23F1/30
Abstract: A double ITO structure, containing sequential layers of indium tin oxide (ITO), silicon dioxide (SiO2) (which may include a dopant material) and ITO, is selectively protected by a patterned photo-resist mask. The sequential layers are etched together in a single etching step using an etchant composition which is an acidic solution containing a transition metal chloride and hydrochloric acid (HCl). Thus, the double ITO structure is etched using a substantially fluoride-free etchant composition.
Abstract translation: 包含铟锡氧化物(ITO),二氧化硅(SiO 2)(其可以包括掺杂剂材料)和ITO的顺序层的双ITO结构被图案化的光刻胶掩模选择性地保护。 使用蚀刻剂组合物在单个蚀刻步骤中将顺序层蚀刻在一起,该蚀刻剂组合物是含有过渡金属氯化物和盐酸(HCl)的酸性溶液。 因此,使用基本上不含氟化物的蚀刻剂组合物来蚀刻双ITO结构。
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公开(公告)号:US20170290212A1
公开(公告)日:2017-10-05
申请号:US15626373
申请日:2017-06-19
Applicant: 3M INNOVATIVE PROPERTIES COMPANY
Inventor: Ravi Palaniswamy , Arokiaraj Jesudoss , Alejandro Aldrin II Agacaoili Narag , Siang Sin Foo , Fong Liang Tan , Wei Meng Pee , Andrew J. Ouderkirk , Justine A. Mooney
IPC: H01L23/498 , H01L33/62
CPC classification number: H01L23/4985 , H01L23/498 , H01L23/49838 , H01L23/49872 , H01L24/17 , H01L33/486 , H01L33/62 , H01L33/641 , H01L33/647 , H01L2224/16225 , H01L2224/48091 , H01L2924/00 , H01L2924/00014 , H01L2924/01322 , H01L2924/01327 , H01L2924/12032 , H01L2924/12041 , H01L2924/12042 , H01L2924/1461 , H01L2924/15747 , H01L2924/15787 , H01L2924/181 , H01L2924/351 , H05K1/112 , H05K1/189 , H05K2201/10106
Abstract: A flexible polymeric dielectric layer has first and second major surfaces. The first major surface has a conductive layer thereon. The dielectric layer has at least one cavity extending from the second major surface toward the first major surface. The conductive layer includes electrically separated first and second portions configured to support and electrically connect a light emitting semiconductor device to the conductive layer.
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公开(公告)号:US20170135229A1
公开(公告)日:2017-05-11
申请号:US15318689
申请日:2015-06-12
Applicant: 3M INNOVATIVE PROPERTIES COMPANY
Inventor: Muthu Sebastian , Fong Liang Tan
IPC: H05K3/46 , H05K1/02 , H05K1/09 , C23C14/14 , C23C14/08 , C23C14/34 , C23C18/38 , C23C18/42 , C23C18/16 , C25D3/38 , C25D3/46 , C25D5/54 , C25D5/48 , G03F7/20 , G03F7/40 , G06F3/044 , H05K3/06
CPC classification number: H05K3/467 , C23C14/00 , C23C14/083 , C23C14/14 , C23C14/34 , C23C18/165 , C23C18/1689 , C23C18/38 , C23C18/42 , C25D3/38 , C25D3/46 , C25D5/48 , C25D5/54 , C25D7/00 , G03F7/2002 , G03F7/40 , G06F3/041 , G06F3/044 , G06F2203/04103 , H01L31/1884 , H05K1/0274 , H05K1/09 , H05K3/064 , H05K3/067 , H05K3/16 , H05K3/381 , H05K3/388 , H05K2201/0108 , H05K2201/0326 , H05K2201/10128
Abstract: The present disclosure provides a method to provide a conductive bus bar on a patterned transparent conductor, such as ITO taces used for touch screen manufacturing. The method can be a cheaper and a more convenient technique to pattern a conductive metal or metal alloy, such as copper, silver, or a copper/silver/titanium alloy, on ITO electrodes in a roll-to-roll process.
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公开(公告)号:US09564568B2
公开(公告)日:2017-02-07
申请号:US14859512
申请日:2015-09-21
Applicant: 3M INNOVATIVE PROPERTIES COMPANY
Inventor: Ravi Palaniswamy , Arokiaraj Jesudoss , Alejandro Aldrin II Agcaoili Narag , Siang Sin Foo , Fong Liang Tan , Andrew J. Ouderkirk , Justine A. Mooney
CPC classification number: H01L33/647 , H01L24/17 , H01L33/486 , H01L33/60 , H01L33/62 , H01L33/64 , H01L2924/01029 , H01L2924/01322 , H01L2924/01327 , H01L2924/07802 , H01L2924/12032 , H01L2924/12041 , H01L2924/12042 , H01L2924/1461 , H01L2924/15787 , H01L2924/181 , H01L2924/351 , H05K1/0203 , H05K1/0277 , H05K1/183 , H05K1/189 , H05K2201/10106 , H05K2201/2054 , H01L2924/00
Abstract: An article includes a flexible polymeric dielectric layer having first and second major surfaces. The first major surface has a conductive layer thereon and at least one cavity therein. The at least one cavity contains a conductive material including electrically separated first and second portions supporting and electrically connecting a light emitting semiconductor device to the conductive layer on the first major surface.
Abstract translation: 一种制品包括具有第一和第二主表面的柔性聚合物电介质层。 第一主表面上具有导电层,其中至少有一个空腔。 所述至少一个腔包含导电材料,所述导电材料包括电分离的第一和第二部分,所述第一和第二部分支撑并将发光半导体器件电连接到第一主表面上的导电层。
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