公开(公告)号：US4324356A

公开(公告)日：1982-04-13

申请号：US25148

申请日：1979-03-29

申请人： Howard D. Blair ,  Morton E. Milberg

发明人： Howard D. Blair ,  Morton E. Milberg

IPC分类号： B23K35/28 ,  C04B37/00 ,  B23K31/00 ,  B23K35/24 ,  B23K35/38

CPC分类号： C04B35/645 ,  B23K35/286 ,  C04B37/006 ,  C04B2237/121 ,  C04B2237/126 ,  C04B2237/368 ,  C04B2237/54 ,  C04B2237/708 ,  Y10T29/49321

摘要： A method of joining silicon nitride based ceramic bodies is disclosed. At least one interfacing surface of shaped bodies (one or both of which may be hot-pressed or reaction-sintered) receives a layer of metallic aluminum based material. The bodies with the metallic aluminum based material therebetween are subjected to heating at 1400.degree.1900.degree. C. for a period typically 0.5-2 hours in a nitriding atmosphere to effect a chemical bond consisting of a conversion of the interfacing ceramic to a Si--Al--O--N system.

摘要翻译： 公开了一种连接氮化硅基陶瓷体的方法。 成型体（其中一个或两个可以被热压或反应烧结）的至少一个接合表面接收一层金属铝基材料。 具有金属铝基材料的物体在氮化气氛中在1400°1900℃下加热典型为0.5-2小时，以实现由界面陶瓷转化为Si-Al的化学键 -ON系统

公开(公告)号：US4149910A

公开(公告)日：1979-04-17

申请号：US580616

申请日：1975-05-27

申请人： James M. Popplewell

发明人： James M. Popplewell

IPC分类号： C03C27/04 ,  C03C29/00 ,  C04B37/02 ,  C03C27/02

CPC分类号： C04B37/025 ,  C03C27/046 ,  C03C29/00 ,  C04B2237/06 ,  C04B2237/341 ,  C04B2237/406 ,  C04B2237/54 ,  C04B2237/82

摘要： Glass or ceramic-to-metal composites or seals wherein the glass or ceramic is bonded to an iron base alloy consisting essentially of from 1-5% silicon and from 1-10% chromium, remainder iron. The alloy develops a thermal oxide film which consists essentially of chromium oxide and .alpha.Fe.sub.2 O.sub.3 which may comprise from 10 to 100% of the oxide film thickness on the metal. The invention also includes a process of bonding the glass or ceramic to the metal which eliminates the need of a prolonged heat treatment performed in a special atmosphere.

摘要翻译： 玻璃或陶瓷 - 金属复合材料或密封件，其中玻璃或陶瓷结合到基本上由1-5％的硅和1-10％的铬组成的铁基合金，剩余的是铁。 合金形成热氧化膜，其主要由氧化铬和αFe2 O 3组成，其可以包含金属上10至100％的氧化膜厚度。 本发明还包括将玻璃或陶瓷粘合到金属上的方法，其消除了在特殊气氛中进行的长时间热处理的需要。

公开(公告)号：US2717840A

公开(公告)日：1955-09-13

申请号：US27335352

申请日：1952-02-25

申请人： FOX WELLS AND COMPANY

发明人： CARL BOSCH

IPC分类号： C03C17/10 ,  C03C27/02 ,  C04B37/02 ,  H01B1/00

CPC分类号： C04B37/026 ,  C03C17/10 ,  C03C27/02 ,  C04B37/006 ,  C04B37/045 ,  C04B2237/12 ,  C04B2237/126 ,  C04B2237/32 ,  C04B2237/36 ,  C04B2237/402 ,  C04B2237/406 ,  C04B2237/407 ,  C04B2237/52 ,  C04B2237/54 ,  H01B1/00

公开(公告)号：US2564738A

公开(公告)日：1951-08-21

申请号：US75870447

申请日：1947-07-02

申请人： FOERDERUNG FORSCHUNG GMBH

发明人： FRANZ TANK

IPC分类号： C04B37/02

CPC分类号： C04B37/021 ,  C04B35/645 ,  C04B37/025 ,  C04B2235/6562 ,  C04B2235/6567 ,  C04B2235/658 ,  C04B2235/6581 ,  C04B2237/06 ,  C04B2237/341 ,  C04B2237/402 ,  C04B2237/403 ,  C04B2237/405 ,  C04B2237/406 ,  C04B2237/407 ,  C04B2237/408 ,  C04B2237/525 ,  C04B2237/54 ,  Y10T29/435

公开(公告)号：US11845700B2

公开(公告)日：2023-12-19

申请号：US16768340

申请日：2018-11-21

申请人： Rogers Germany GmbH

发明人： Maximilian Engel ,  Xinhe Tang ,  Stefan Britting

IPC分类号： C04B37/02 ,  B32B9/00

CPC分类号： C04B37/021 ,  B32B9/005 ,  C04B2237/407 ,  C04B2237/54

摘要： A method for producing a semi-finished metal product (2), in particular a semi-finished copper product, for a metal-copper substrate, in particular for a copper-ceramic substrate, including:



providing a first metal layer (11), in particular a first copper layer, and a second metal layer (12), in particular a second copper layer,
joining the first metal layer (11) and the second metal layer (12) to form the semi-finished metal product (2), wherein, chronologically before the first metal layer (11) is joined to the second metal layer (12) by means of different temperature treatments, a grain growth in the first metal layer (11) and/or the second metal layer (12) is initiated in such a way that in the produced semi-finished metal product (2), in particular in the produced metal-copper substrate, a first grain size in the first metal layer (11) differs from a second grain size in the second metal layer (12).

公开(公告)号：US20180190610A1

公开(公告)日：2018-07-05

申请号：US15740785

申请日：2016-06-22

申请人： OSRAM Opto Semiconductors GmbH

发明人： Mathias WENDT

IPC分类号： H01L23/00 ,  C04B37/00 ,  C03C27/08 ,  H01L33/08 ,  H01L33/62

CPC分类号： H01L24/29 ,  C03C27/08 ,  C04B37/003 ,  C04B37/005 ,  C04B37/006 ,  C04B37/025 ,  C04B37/026 ,  C04B37/04 ,  C04B2237/06 ,  C04B2237/12 ,  C04B2237/30 ,  C04B2237/343 ,  C04B2237/36 ,  C04B2237/368 ,  C04B2237/40 ,  C04B2237/54 ,  C04B2237/60 ,  C04B2237/708 ,  C04B2237/72 ,  C23C14/086 ,  H01L24/83 ,  H01L33/0079 ,  H01L33/06 ,  H01L33/08 ,  H01L33/30 ,  H01L33/32 ,  H01L33/62 ,  H01L2224/29187 ,  H01L2224/83896 ,  H01L2933/0066

摘要： The invention relates to a method for connecting at least two components (1, 2), comprising the following steps: A) providing at least a first component (1) and a second component (2), B) applying at least one donor layer (3) to the first and/or the second component (1, 2), wherein the donor layer (3) is enriched with oxygen (31), C) applying a metal layer (4) to the donor layer (3), the first or the second component (1, 2), D) heating at least the metal layer (4) to a first temperature (T1) such that the metal layer (4) is melted and the first component (1) and the second component (2) are connected to one another, and E) heating the arrangement to a second temperature (T2) such that the oxygen (31) passes from the donor layer (3) into the metal layer (4) and the metal layer (4) is converted to form a stable metal oxide layer (5), wherein the metal oxide layer (5) has a higher melting temperature than the metal layer (4), wherein at least the donor layer (3) and the metal oxide layer (5) connect the first component (1) and the second component (2) to one another.

公开(公告)号：US20150140276A1

公开(公告)日：2015-05-21

申请号：US14547318

申请日：2014-11-19

申请人： Berliner Glas KGaA Herbert Kubatz GmbH & Co.

发明人： Carsten PAMPUCH ,  Khaldoun HALALO ,  Volker SCHMIDT

IPC分类号： G02B5/10 ,  B32B17/06 ,  B32B38/10 ,  B32B18/00 ,  B32B37/10 ,  B32B38/00

CPC分类号： G02B5/10 ,  B32B17/00 ,  B32B17/06 ,  B32B18/00 ,  B32B37/10 ,  B32B38/0008 ,  B32B38/0012 ,  B32B38/10 ,  B32B38/1866 ,  B32B2309/02 ,  B32B2315/02 ,  B32B2551/00 ,  C04B37/042 ,  C04B37/045 ,  C04B2237/062 ,  C04B2237/365 ,  C04B2237/52 ,  C04B2237/54 ,  C04B2237/70 ,  C04B2237/76 ,  C04B2237/84 ,  Y10T156/10 ,  Y10T156/1028 ,  Y10T428/24521

摘要： In a method for solid body joining of a carrier body (10) and a cover layer (20), in particular by anodic bonding, the cover layer (20) is pressed with a pressing force against a curved carrier body surface (11), wherein the pressing force during the solid body joining is distributed by way of a pressure intermediary device (30) areally and simultaneously over the whole cover layer (20) and is directed perpendicularly to the curvature of the carrier body surface (11). A composite component comprising a carrier body (10) and a cover layer (20) is also disclosed, wherein a curved areal joining region (13) is formed between a cover layer surface (21) and a carrier body surface (11).

摘要翻译： 特别是通过阳极接合的承载体（10）和覆盖层（20）的固体接合方法中，覆盖层（20）以对弯曲载体体表面（11）的挤压力被按压， 其中，所述固体接合期间的按压力通过压力中间装置（30）分布并且同时在整个覆盖层（20）上分布，并垂直于载体主体表面（11）的曲率。 还公开了一种包括载体主体（10）和覆盖层（20）的复合部件，其中在覆盖层表面（21）和载体主体表面（11）之间形成弯曲的面接合区域（13）。

公开(公告)号：US20130042763A1

公开(公告)日：2013-02-21

申请号：US13393444

申请日：2010-08-25

申请人： Steffen Schirrmeister ,  Bernd Langanke ,  Thomas Schiestel ,  Björn Hoting

发明人： Steffen Schirrmeister ,  Bernd Langanke ,  Thomas Schiestel ,  Björn Hoting

IPC分类号： B01D71/04 ,  B05D3/00 ,  B01D69/08

CPC分类号： C04B37/005 ,  B01D53/22 ,  B01D63/022 ,  B01D63/023 ,  B01D71/024 ,  B01J19/2475 ,  C01B13/0255 ,  C01B2210/0046 ,  C03C8/04 ,  C03C8/06 ,  C03C8/24 ,  C04B37/025 ,  C04B37/045 ,  C04B2235/656 ,  C04B2235/6562 ,  C04B2235/6584 ,  C04B2237/10 ,  C04B2237/54

摘要： A modular element having a high-temperature stable main body, including at least one metallic or ceramic plate, which has at least one through-going aperture for the insertion of a ceramic capillary membrane and at least one potting in the form of a sufficiently gas-tight and high-temperature stable joint between the metallic or ceramic plate and the ceramic capillary membrane. The through-going aperture of the metallic or ceramic plate having an extension for accommodating the sufficiently gas-tight and high-temperature stable joint on at least one side of the metallic or ceramic plate.

摘要翻译： 具有高温稳定主体的模块化元件，包括至少一个金属或陶瓷板，该金属或陶瓷板具有用于插入陶瓷毛细管膜的至少一个贯通孔和至少一个充分气体形式的灌封 金属或陶瓷板与陶瓷毛细管膜之间的高温稳定接头。 金属或陶瓷板的贯穿孔具有用于在金属或陶瓷板的至少一侧容纳充分气密且高温稳定的接头的延伸部。

公开(公告)号：US20110250382A1

公开(公告)日：2011-10-13

申请号：US13022544

申请日：2011-02-07

申请人： Takahiko IDO ,  Yoshihiro Koga ,  Takumi Asanuma ,  Takashi Ito

发明人： Takahiko IDO ,  Yoshihiro Koga ,  Takumi Asanuma ,  Takashi Ito

IPC分类号： B32B3/12 ,  C04B14/00

CPC分类号： C04B35/565 ,  B01D46/2425 ,  B01D2046/2433 ,  B01J35/04 ,  C04B35/63416 ,  C04B35/6365 ,  C04B37/005 ,  C04B38/0009 ,  C04B38/0019 ,  C04B38/0074 ,  C04B41/5071 ,  C04B41/5096 ,  C04B2235/3873 ,  C04B2235/3891 ,  C04B2235/428 ,  C04B2235/483 ,  C04B2235/522 ,  C04B2235/5224 ,  C04B2235/5228 ,  C04B2235/5232 ,  C04B2235/5244 ,  C04B2235/616 ,  C04B2235/656 ,  C04B2235/66 ,  C04B2235/663 ,  C04B2237/083 ,  C04B2237/09 ,  C04B2237/54 ,  C04B2237/68 ,  C04B2237/708 ,  F01N3/2026 ,  F01N3/2828 ,  F01N2330/60 ,  F01N2370/04 ,  F01N2450/28 ,  Y02T10/26 ,  Y10T428/131 ,  Y10T428/24149 ,  C04B26/285 ,  C04B28/001 ,  C04B28/005

摘要： A honeycomb structure includes at least one pillar-shaped honeycomb unit and a pair of electrodes. The pillar-shaped honeycomb unit includes an outer peripheral wall and cell walls. The cell walls extend along a longitudinal direction of the honeycomb unit to define cells. The cell walls are composed of a ceramic aggregate having pores. The cell walls contain a substance having an electrical resistivity lower than an electrical resistivity of ceramic forming the ceramic aggregate. The pair of electrodes is arranged at the cell walls and/or the outer peripheral wall.

摘要翻译： 蜂窝结构体包括至少一个柱状蜂窝单元和一对电极。 柱状蜂窝单元包括外周壁和单元壁。 细胞壁沿着蜂窝单元的纵向方向延伸以限定细胞。 细胞壁由具有孔的陶瓷骨料组成。 细胞壁含有电阻率低于形成陶瓷骨料的陶瓷的电阻率的物质。 一对电极布置在细胞壁和/或外周壁处。

公开(公告)号：US20070261778A1

公开(公告)日：2007-11-15

申请号：US11666426

申请日：2005-05-05

申请人： Jurgen Schulz-Harder ,  Andreas Frischmann ,  Alexander Rogg ,  Karl Exel

发明人： Jurgen Schulz-Harder ,  Andreas Frischmann ,  Alexander Rogg ,  Karl Exel

IPC分类号： C04B37/02

CPC分类号： C04B37/021 ,  B32B18/00 ,  B32B2311/12 ,  B32B2315/02 ,  C04B2235/6584 ,  C04B2235/9607 ,  C04B2237/341 ,  C04B2237/343 ,  C04B2237/365 ,  C04B2237/407 ,  C04B2237/54 ,  C04B2237/56 ,  C04B2237/562 ,  C04B2237/704 ,  H01L23/3735 ,  H01L2924/0002 ,  H05K1/0306 ,  H05K3/022 ,  H05K2201/0116 ,  H05K2201/0355 ,  H05K2203/016 ,  H01L2924/00

摘要： A method is disclosed for producing metal-ceramic substrates that are metallized on both sides by using the direct bonding process. According to the method, at least one DCB stack made from first and a second metal layer and a ceramic layer located between said metal layers is formed on a separating layer of a support by heating to a direct bonding temperature. At least one of the metal layers rests against the separating layer during the bonding process, said separating layer being composed of a porous layer or coating made of a separating layer material from the group comprising mullite, Al2O3, TiO3, ZrO2, MgO, CaO CaCO2 or a mixture of at least two of said materials.

摘要翻译： 公开了一种用于制造通过使用直接粘合工艺在两侧金属化的金属陶瓷基板的方法。 根据该方法，通过加热到直接接合温度，在支撑体的分离层上形成由第一和第二金属层制成的至少一个DCB堆叠和位于所述金属层之间的陶瓷层。 在接合过程中，至少一层金属层靠着分离层，所述分离层由多孔层或由包括莫来石Al 2 O 3的组分分离层材料制成的涂层组成 3/3，TiO 3，ZrO 2，MgO，CaO CaCO 2，或所述的至少两种所述的混合物 材料