公开(公告)号：US20160276176A1

公开(公告)日：2016-09-22

申请号：US14927283

申请日：2015-10-29

Applicant: NXP B.V.

Inventor： Tonny Kamphuis ,  Roelf Anco Jacob Groenhuis ,  Leonardus Antonius Elisabeth van Gemert ,  Caroline Catharina Maria Beelen-Hendrikx ,  Jetse de Witte ,  Franciscus Henrikus Martinus Swartjes

IPC: H01L21/56 ,  H01L23/31 ,  H01L21/304 ,  H01L21/78 ,  H01L23/00

CPC classification number: H01L24/94 ,  H01L21/304 ,  H01L21/561 ,  H01L21/565 ,  H01L21/568 ,  H01L21/6836 ,  H01L21/78 ,  H01L23/3114 ,  H01L23/3164 ,  H01L23/3178 ,  H01L23/544 ,  H01L24/11 ,  H01L24/14 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2223/54433 ,  H01L2223/5446 ,  H01L2224/1181 ,  H01L2224/11849 ,  H01L2224/13014 ,  H01L2224/13016 ,  H01L2224/13022 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/94 ,  H01L2224/11

Abstract: Consistent with example embodiments, a wafer substrate undergoes processing in which a resilient material is applied to the front-side and back-side surfaces of the wafer substrate. By defining trenches in saw lanes between active device die, additional resilient material may be placed therein. In an example embodiment, after the active device die are separated into individual product devices, the resulting product device has coverage on the front-side surface, back-side surface, and the four vertical faces of the encapsulated active device die. The front-side surface has exposed contact areas so that the product device may be attached to an end user's system circuit board. Further, the resilient coating protects the encapsulated active device die from damage during assembly.

Abstract translation: 与示例性实施例一致，晶片衬底经历其中将弹性材料施加到晶片衬底的前侧和后侧表面的处理。 通过在活动装置模具之间限定锯槽中的沟槽，可以在其中放置附加的弹性材料。 在示例性实施例中，在有源器件管芯被分离成单个产品器件之后，所得到的产品器件在封装的有源器件管芯的正面，背面和四个垂直面上具有覆盖。 前侧表面具有暴露的接触区域，使得产品装置可以附接到终端用户的系统电路板。 此外，弹性涂层在组装期间保护封装的主动装置模具免受损坏。

公开(公告)号：US09424507B2

公开(公告)日：2016-08-23

申请号：US14242031

申请日：2014-04-01

Applicant: NXP B.V.

Inventor： Christian Zenz ,  Tonny Kamphuis ,  Johannes Wilhelmus van Rijckevorsel ,  Bodin Kasemset ,  David Ceccarelli ,  Boudewijn van Blokland ,  Patrick Schoengrundner

IPC: G06K19/06 ,  G06K19/077

CPC classification number: G06K19/07754 ,  G06K19/07745 ,  G06K19/07769 ,  H01L2224/48091 ,  H01L2224/48228 ,  H01L2224/49109 ,  H01L2224/73265 ,  H01L2224/8592 ,  Y10T29/49018 ,  H01L2924/00014

Abstract: Dual-interface Integrated Circuit (IC) card components and methods for manufacturing the dual-interface IC card components are described. In an embodiment, a dual-interface IC card component includes a single-sided contact base structure, which includes a substrate with an electrical contact layer. On the single-sided contact base structure, one or more antenna contact leads are attached to the single-sided contact base structure to form a dual-interface contact structure, which is a component of a dual-interface IC card. Other embodiments are also described.

Abstract translation: 描述了用于制造双接口IC卡组件的双接口集成电路（IC）卡组件和方法。 在一个实施例中，双接口IC卡部件包括单面接触基部结构，其包括具有电接触层的基板。 在单面接触基体结构上，一个或多个天线接触引线附接到单面接触基底结构以形成双界面接触结构，其是双接口IC卡的组件。 还描述了其它实施例。

公开(公告)号：US20170092636A1

公开(公告)日：2017-03-30

申请号：US14869416

申请日：2015-09-29

Applicant: NXP B.V.

Inventor： Tonny Kamphuis ,  Hans Cobussen ,  Heimo Scheucher ,  Laurentius de Kok

IPC: H01L27/02 ,  H01L21/78 ,  G03F1/44 ,  H01L29/06

CPC classification number: G03F1/44 ,  G03F9/7084 ,  H01L22/30 ,  H01L27/0203

Abstract: Consistent with an example embodiment, there is a semiconductor wafer substrate comprising a plurality of integrated circuits formed in arrays of rows and columns on the wafer substrate. A plurality of integrated circuits are in arrays of rows and columns on the wafer substrate; the rows and the columns have a first width. First and second saw lanes separate the integrated circuits, the first saw lanes are arranged parallel and equidistant with one another in a first direction defined by rows, and the second saw lanes are arranged parallel and equidistant with one another in a second direction defined by the columns. A plurality of process modules (PM) are on the wafer substrate, the PM modules defined in an at least one additional row/column having a second width. The at least one additional row/column is parallel to the plurality of device die in one direction.

公开(公告)号：US09466585B1

公开(公告)日：2016-10-11

申请号：US14927311

申请日：2015-10-29

Applicant: NXP B.V.

Inventor： Tonny Kamphuis ,  Leonardus Antonius Elisabeth van Gemert ,  Roelf Anco Jacob Groenhuis ,  Caroline Catharina Maria Beelen-Hendrikx ,  Franciscus Henrikus Martinus Swartjes ,  Jetse de Witte

IPC: H01L23/31 ,  H01L23/00 ,  H01L21/56 ,  H01L21/304 ,  H01L21/78 ,  H01L21/683 ,  H01L21/3065

CPC classification number: H01L24/94 ,  H01L21/304 ,  H01L21/561 ,  H01L21/565 ,  H01L21/568 ,  H01L21/6836 ,  H01L21/78 ,  H01L23/3114 ,  H01L23/3164 ,  H01L23/3178 ,  H01L23/544 ,  H01L24/11 ,  H01L24/14 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2223/54433 ,  H01L2223/5446 ,  H01L2224/1181 ,  H01L2224/11849 ,  H01L2224/13014 ,  H01L2224/13016 ,  H01L2224/13022 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/94 ,  H01L2224/11

Abstract: Consistent with example embodiments, a wafer substrate undergoes processing in which a resilient material is applied to the front-side and back-side surfaces of the wafer substrate. By defining trenches in saw lanes between active device die, additional resilient material may be placed therein. In an example embodiment, after the active device die are separated into individual product devices, the resulting product device has coverage on the front-side surface, back-side surface, and the four vertical faces of the encapsulated active device die. The front-side surface has exposed contact areas so that the product device may be attached to an end user's system circuit board. Further, the resilient coating protects the encapsulated active device die from damage during assembly.

Abstract translation: 与示例性实施例一致，晶片衬底经历其中将弹性材料施加到晶片衬底的前侧和后侧表面的处理。 通过在活动装置模具之间限定锯槽中的沟槽，可以在其中放置附加的弹性材料。 在示例性实施例中，在有源器件管芯被分离成单个产品器件之后，所得到的产品器件在封装的有源器件管芯的正面，背面和四个垂直面上具有覆盖。 前侧表面具有暴露的接触区域，使得产品装置可以附接到终端用户的系统电路板。 此外，弹性涂层在组装期间保护封装的主动装置模具免受损坏。

公开(公告)号：US20160276306A1

公开(公告)日：2016-09-22

申请号：US14927311

申请日：2015-10-29

Applicant: NXP B.V.

Inventor： Tonny Kamphuis ,  Leonardus Antonius Elisabeth van Gemert ,  Roelf Anco Jacob Groenhuis ,  Caroline Catharina Maria Beelen-Hendrikx ,  Franciscus Henrikus Martinus Swartjes ,  Jetse de Witte

IPC: H01L23/00 ,  H01L21/56 ,  H01L21/3065 ,  H01L21/78 ,  H01L21/683 ,  H01L23/31 ,  H01L21/304

CPC classification number: H01L24/94 ,  H01L21/304 ,  H01L21/561 ,  H01L21/565 ,  H01L21/568 ,  H01L21/6836 ,  H01L21/78 ,  H01L23/3114 ,  H01L23/3164 ,  H01L23/3178 ,  H01L23/544 ,  H01L24/11 ,  H01L24/14 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2223/54433 ,  H01L2223/5446 ,  H01L2224/1181 ,  H01L2224/11849 ,  H01L2224/13014 ,  H01L2224/13016 ,  H01L2224/13022 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/94 ,  H01L2224/11

Abstract: Consistent with example embodiments, a wafer substrate undergoes processing in which a resilient material is applied to the front-side and back-side surfaces of the wafer substrate. By defining trenches in saw lanes between active device die, additional resilient material may be placed therein. In an example embodiment, after the active device die are separated into individual product devices, the resulting product device has coverage on the front-side surface, back-side surface, and the four vertical faces of the encapsulated active device die. The front-side surface has exposed contact areas so that the product device may be attached to an end user's system circuit board. Further, the resilient coating protects the encapsulated active device die from damage during assembly.

Abstract translation: 与示例性实施例一致，晶片衬底经历其中将弹性材料施加到晶片衬底的前侧和后侧表面的处理。 通过在活动装置模具之间限定锯槽中的沟槽，可以在其中放置附加的弹性材料。 在示例性实施例中，在有源器件管芯被分离成单个产品器件之后，所得到的产品器件在封装的有源器件管芯的正面，背面和四个垂直面上具有覆盖。 前侧表面具有暴露的接触区域，使得产品装置可以附接到终端用户的系统电路板。 此外，弹性涂层在组装期间保护封装的主动装置模具免受损坏。

公开(公告)号：US20160005653A1

公开(公告)日：2016-01-07

申请号：US14322304

申请日：2014-07-02

Applicant: NXP B.V.

Inventor： Caroline Catharina Maria Beelen-Hendrikx ,  Tonny Kamphuis ,  Leonardus Antonius Elisabeth van Gemert

IPC: H01L21/78 ,  H01L21/683 ,  H01L23/00 ,  H01L21/304

CPC classification number: H01L21/78 ,  H01L21/304 ,  H01L21/6835 ,  H01L21/6836 ,  H01L23/562 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2224/05008 ,  H01L2224/05569 ,  H01L2224/131 ,  H01L2924/014

Abstract: Consistent with an example embodiment, there is a method for manufacturing integrated circuit (IC) devices from a wafer substrate, the wafer substrate having a front-side surface with active devices and a back-side surface. A temporary covering to the front-side of the wafer substrate is applied. The back-side of the wafer substrate having a pre-grind thickness is ground to a post-grind thickness. To a predetermined thickness, the back-side of the wafer substrate is coated with a resilient coating. The wafer is mounted onto a second carrier tape on its back-side surface. After removing the temporary carrier tape from the front-side of the wafer substrate, the wafer is sawed along active device boundaries and active devices are singulated.

Abstract translation: 与示例性实施例一致，存在从晶片衬底制造集成电路（IC）器件的方法，晶片衬底具有带有有源器件的前侧表面和后侧表面。 施加到晶片衬底的前侧的临时覆盖。 具有预研磨厚度的晶片基板的背面研磨成后研磨厚度。 对于预定的厚度，晶片基板的背面涂覆有弹性涂层。 将晶片安装在其背面上的第二载带上。 在从晶片基板的前侧移除临时载带之后，沿着有源器件边界锯切晶片，并且将有源器件分割。

公开(公告)号：US20150303156A1

公开(公告)日：2015-10-22

申请号：US14255935

申请日：2014-04-17

Applicant: NXP B.V.

Inventor： Tonny Kamphuis ,  Jan Gulpen ,  Jan Willem Bergman

IPC: H01L23/00 ,  H01L23/31 ,  H01L23/29

CPC classification number: H01L24/06 ,  H01L23/293 ,  H01L23/3114 ,  H01L23/49805 ,  H01L23/49838 ,  H01L2224/05005 ,  H01L2224/05012 ,  H01L2224/0612 ,  H01L2224/49171 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/0105 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2224/45099

Abstract: Embodiments of a packaged semiconductor device with no leads are disclosed. One embodiment includes a semiconductor chip and a no leads package structure defining a boundary and having a bottom surface and includes three or more pads exposed at the bottom surface of the package structure. Each of the pads is located in a single inline row.

Abstract translation: 公开了没有引线的封装半导体器件的实施例。 一个实施例包括限定边界并具有底表面的半导体芯片和无引线封装结构，并且包括暴露在封装结构的底表面处的三个或更多个焊盘。 每个垫片都位于一个单列排列中。

公开(公告)号：US08987057B2

公开(公告)日：2015-03-24

申请号：US14021708

申请日：2013-09-09

Applicant: NXP B.V.

Inventor： Leonardus Antonius Elisabeth Van Gemert ,  Tonny Kamphuis ,  Hartmut Buenning ,  Christian Zenz

IPC: H01L21/00 ,  H01L23/544 ,  H01L21/56 ,  H01L21/78 ,  H01L23/28 ,  H01L23/00 ,  H01L23/31

CPC classification number: H01L23/28 ,  H01L21/561 ,  H01L21/568 ,  H01L21/6836 ,  H01L21/78 ,  H01L23/3114 ,  H01L24/96 ,  H01L24/97 ,  H01L41/338 ,  H01L2224/12105 ,  H01L2224/32245 ,  H01L2224/73267 ,  H01L2224/83 ,  H01L2224/97 ,  H01L2924/01322 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/181 ,  H01L2924/00

Abstract: Consistent with an example embodiment, there is semiconductor device assembled to resist mechanical damage. The semiconductor device comprises an active circuit defined on a top surface, contact areas providing electrical connection to the active circuit. There is a pedestal structure upon which the active circuit is mounted on an opposite bottom surface; the pedestal structure has an area smaller than the area of the active device. An encapsulation, consisting of a molding compound, surrounds the sides and the underside of the active device and it surrounds the contact areas. The encapsulation provides a resilient surface protecting the active device from mechanical damage. A feature of the embodiment is that the contact areas may have solder bumps defined thereon.

Abstract translation: 与示例性实施例一致，存在组装以抵抗机械损坏的半导体器件。 半导体器件包括限定在顶表面上的有源电路，提供与有源电路的电连接的接触区域。 有一个基座结构，有源电路安装在基座结构的相对的底面上; 基座结构的面积小于有源器件的面积。 由模制化合物组成的封装围绕有源器件的侧面和下侧并且围绕接触区域。 封装提供了弹性表面，保护有源器件免受机械损坏。 该实施例的特征在于，接触区域可以具有限定在其上的焊料凸块。