公开(公告)号：US20140239471A1

公开(公告)日：2014-08-28

申请号：US13779889

申请日：2013-02-28

Applicant: NXP B.V.

Inventor： Peeradech Khunpukdee ,  Bodin Kasemset ,  Ernst Eiper ,  Christian Zenz

IPC: H01L23/495 ,  H01L21/768

CPC classification number: H01L23/495 ,  H01L21/76838 ,  H01L23/49541 ,  H01L23/49558 ,  H01L23/49582 ,  H01L23/49586 ,  H01L24/97 ,  H01L2224/32245 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/83192 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/1576 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012

Abstract: Various aspects of the disclosure are directed to integrated circuit (IC) die leadframe packages. In accordance with one or more embodiments, a stainless steel leadframe apparatus has a polymer-based layer that adheres to both stainless steel and IC die encapsulation, with the stainless steel conducting signals/data between respective surfaces for communicating with the packaged IC die. In some embodiments, the apparatus includes the IC die adhered to the polymer-based layer via an adhesive, wire bonds coupled to the stainless steel leadframe for passing the signals/data, and an encapsulation epoxy that encapsulates the IC die and wire bonds.

Abstract translation: 本公开的各个方面涉及集成电路（IC）管芯引线框封装。 根据一个或多个实施例，不锈钢引线框架设备具有粘附于不锈钢和IC管芯封装的基于聚合物的层，其中不锈钢在相应表面之间传导信号/数据以与封装的IC管芯连通。 在一些实施例中，该装置包括通过粘合剂粘附到基于聚合物的层的IC管芯，耦合到用于传递信号/数据的不锈钢引线框架的引线接合，以及封装IC管芯和引线接合的封装环氧树脂。

公开(公告)号：US09424507B2

公开(公告)日：2016-08-23

申请号：US14242031

申请日：2014-04-01

Applicant: NXP B.V.

Inventor： Christian Zenz ,  Tonny Kamphuis ,  Johannes Wilhelmus van Rijckevorsel ,  Bodin Kasemset ,  David Ceccarelli ,  Boudewijn van Blokland ,  Patrick Schoengrundner

IPC: G06K19/06 ,  G06K19/077

CPC classification number: G06K19/07754 ,  G06K19/07745 ,  G06K19/07769 ,  H01L2224/48091 ,  H01L2224/48228 ,  H01L2224/49109 ,  H01L2224/73265 ,  H01L2224/8592 ,  Y10T29/49018 ,  H01L2924/00014

Abstract: Dual-interface Integrated Circuit (IC) card components and methods for manufacturing the dual-interface IC card components are described. In an embodiment, a dual-interface IC card component includes a single-sided contact base structure, which includes a substrate with an electrical contact layer. On the single-sided contact base structure, one or more antenna contact leads are attached to the single-sided contact base structure to form a dual-interface contact structure, which is a component of a dual-interface IC card. Other embodiments are also described.

Abstract translation: 描述了用于制造双接口IC卡组件的双接口集成电路（IC）卡组件和方法。 在一个实施例中，双接口IC卡部件包括单面接触基部结构，其包括具有电接触层的基板。 在单面接触基体结构上，一个或多个天线接触引线附接到单面接触基底结构以形成双界面接触结构，其是双接口IC卡的组件。 还描述了其它实施例。

公开(公告)号：US20160079146A1

公开(公告)日：2016-03-17

申请号：US14486291

申请日：2014-09-15

Applicant: NXP B.V.

Inventor： Bodin Kasemset ,  Peeradech Khunpukdee ,  Krassavan Tantirittisak

IPC: H01L23/495

Abstract: Consistent with an example embodiment, there is a package assembly structure. The structure comprises a lead frame having a topside surface and an opposite under-side surface; the lead frame includes a die attach paddle, wherein a die attach region is defined on the opposite under-side surface. Pad landings surround the die attach region. A plurality of locking pins are arranged at predetermined locations about the die attach paddle, on the top side surface. The plurality of locking pins may be formed integrally in the lead frame and project upward from the top side surface.

Abstract translation: 与示例性实施例一致，存在封装组装结构。 该结构包括具有顶侧表面和相对的下侧表面的引线框架; 引线框架包括管芯附接焊盘，其中管芯附接区域被限定在相对的底侧表面上。 垫片着陆围绕裸片附着区域。 多个锁定销布置在围绕管芯附接板的预定位置处，位于顶侧表面上。 多个锁定销可以一体地形成在引线框架中并从顶侧表面向上突出。

公开(公告)号：US08884415B2

公开(公告)日：2014-11-11

申请号：US13779889

申请日：2013-02-28

Applicant: NXP B.V.

Inventor： Peeradech Khunpukdee ,  Bodin Kasemset ,  Ernst Eiper ,  Christian Zenz

IPC: H01L23/495 ,  H01L21/768

CPC classification number: H01L23/495 ,  H01L21/76838 ,  H01L23/49541 ,  H01L23/49558 ,  H01L23/49582 ,  H01L23/49586 ,  H01L24/97 ,  H01L2224/32245 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/83192 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/1576 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012

Abstract: Various aspects of the disclosure are directed to integrated circuit (IC) die leadframe packages. In accordance with one or more embodiments, a stainless steel leadframe apparatus has a polymer-based layer that adheres to both stainless steel and IC die encapsulation, with the stainless steel conducting signals/data between respective surfaces for communicating with the packaged IC die. In some embodiments, the apparatus includes the IC die adhered to the polymer-based layer via an adhesive, wire bonds coupled to the stainless steel leadframe for passing the signals/data, and an encapsulation epoxy that encapsulates the IC die and wire bonds.

Abstract translation: 本公开的各个方面涉及集成电路（IC）管芯引线框封装。 根据一个或多个实施例，不锈钢引线框架设备具有粘附于不锈钢和IC管芯封装的基于聚合物的层，其中不锈钢在相应表面之间传导信号/数据以与封装的IC管芯连通。 在一些实施例中，该装置包括通过粘合剂粘附到基于聚合物的层的IC管芯，耦合到用于传递信号/数据的不锈钢引线框架的引线接合，以及封装IC管芯和引线接合的封装环氧树脂。

公开(公告)号：US10727168B2

公开(公告)日：2020-07-28

申请号：US14486291

申请日：2014-09-15

Applicant: NXP B.V.

Inventor： Bodin Kasemset ,  Peeradech Khunpukdee ,  Krassavan Tantirittisak

IPC: H01L23/48 ,  H01L23/495

Abstract: Consistent with an example embodiment, there is a package assembly structure. The structure comprises a lead frame having a topside surface and an opposite under-side surface; the lead frame includes a die attach paddle, wherein a die attach region is defined on the opposite under-side surface. Pad landings surround the die attach region. A plurality of locking pins are arranged at predetermined locations about the die attach paddle, on the top side surface. The plurality of locking pins may be formed integrally in the lead frame and project upward from the top side surface.

公开(公告)号：US09595455B1

公开(公告)日：2017-03-14

申请号：US15178329

申请日：2016-06-09

Applicant: NXP B.V.

Inventor： Bodin Kasemset ,  Peeradech Kunpukdee

IPC: H01L23/495 ,  H01L21/56 ,  H01L23/29 ,  H01L23/31 ,  G06K19/077

CPC classification number: H01L21/56 ,  G06K19/07745 ,  H01L21/568 ,  H01L23/3107 ,  H01L23/49513 ,  H01L23/4952 ,  H01L23/49548 ,  H01L23/49579 ,  H01L2224/04042 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/83005 ,  H01L2224/85005 ,  H01L2224/92247 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/00

Abstract: Integrated circuit (IC) modules and methods for manufacturing the IC modules are described. In an embodiment, an IC module includes a substrate with contact gaps on which an IC die is attached with electrical connections between the IC die and the substrate. The IC module further include an encapsulation that encloses the IC die and fills first portions of the contact gaps, where the first portions of the contact gaps are located within an area of the substrate defined by the encapsulation. Second portions of the contact gaps, which are located outside of the area of substrate defined by the encapsulation, are filled with a filling material.

Abstract translation: 描述了用于制造IC模块的集成电路（IC）模块和方法。 在一个实施例中，IC模块包括具有接触间隙的基板，IC芯片上安装有IC芯片和IC芯片与基板之间的电连接。 IC模块还包括封装IC管芯并填充接触间隙的第一部分的封装，其中接触间隙的第一部分位于由封装限定的衬底的区域内。 位于由封装限定的衬底区域之外的接触间隙的第二部分填充有填充材料。

公开(公告)号：US20150278673A1

公开(公告)日：2015-10-01

申请号：US14242031

申请日：2014-04-01

Applicant: NXP B.V.

Inventor： Christian Zenz ,  Tonny Kamphuis ,  Johannes Wilhelmus van Rijckevorsel ,  Bodin Kasemset ,  David Ceccarelli ,  Boudewijn van Blokland ,  Patrick Schoengrundner

IPC: G06K19/077

CPC classification number: G06K19/07754 ,  G06K19/07745 ,  G06K19/07769 ,  H01L2224/48091 ,  H01L2224/48228 ,  H01L2224/49109 ,  H01L2224/73265 ,  H01L2224/8592 ,  Y10T29/49018 ,  H01L2924/00014

Abstract: Dual-interface Integrated Circuit (IC) card components and methods for manufacturing the dual-interface IC card components are described. In an embodiment, a dual-interface IC card component includes a single-sided contact base structure, which includes a substrate with an electrical contact layer. On the single-sided contact base structure, one or more antenna contact leads are attached to the single-sided contact base structure to form a dual-interface contact structure, which is a component of a dual-interface IC card. Other embodiments are also described.

Abstract translation: 描述了用于制造双接口IC卡组件的双接口集成电路（IC）卡组件和方法。 在一个实施例中，双接口IC卡部件包括单面接触基部结构，其包括具有电接触层的基板。 在单面接触基体结构上，一个或多个天线接触引线附接到单面接触基底结构以形成双界面接触结构，其是双接口IC卡的组件。 还描述了其它实施例。