公开(公告)号：US10727168B2

公开(公告)日：2020-07-28

申请号：US14486291

申请日：2014-09-15

Applicant: NXP B.V.

Inventor： Bodin Kasemset ,  Peeradech Khunpukdee ,  Krassavan Tantirittisak

IPC: H01L23/48 ,  H01L23/495

Abstract: Consistent with an example embodiment, there is a package assembly structure. The structure comprises a lead frame having a topside surface and an opposite under-side surface; the lead frame includes a die attach paddle, wherein a die attach region is defined on the opposite under-side surface. Pad landings surround the die attach region. A plurality of locking pins are arranged at predetermined locations about the die attach paddle, on the top side surface. The plurality of locking pins may be formed integrally in the lead frame and project upward from the top side surface.

公开(公告)号：US20160079146A1

公开(公告)日：2016-03-17

申请号：US14486291

申请日：2014-09-15

Applicant: NXP B.V.

Inventor： Bodin Kasemset ,  Peeradech Khunpukdee ,  Krassavan Tantirittisak

IPC: H01L23/495

Abstract: Consistent with an example embodiment, there is a package assembly structure. The structure comprises a lead frame having a topside surface and an opposite under-side surface; the lead frame includes a die attach paddle, wherein a die attach region is defined on the opposite under-side surface. Pad landings surround the die attach region. A plurality of locking pins are arranged at predetermined locations about the die attach paddle, on the top side surface. The plurality of locking pins may be formed integrally in the lead frame and project upward from the top side surface.

Abstract translation: 与示例性实施例一致，存在封装组装结构。 该结构包括具有顶侧表面和相对的下侧表面的引线框架; 引线框架包括管芯附接焊盘，其中管芯附接区域被限定在相对的底侧表面上。 垫片着陆围绕裸片附着区域。 多个锁定销布置在围绕管芯附接板的预定位置处，位于顶侧表面上。 多个锁定销可以一体地形成在引线框架中并从顶侧表面向上突出。