公开(公告)号：US10727168B2

公开(公告)日：2020-07-28

申请号：US14486291

申请日：2014-09-15

Applicant: NXP B.V.

Inventor： Bodin Kasemset ,  Peeradech Khunpukdee ,  Krassavan Tantirittisak

IPC: H01L23/48 ,  H01L23/495

Abstract: Consistent with an example embodiment, there is a package assembly structure. The structure comprises a lead frame having a topside surface and an opposite under-side surface; the lead frame includes a die attach paddle, wherein a die attach region is defined on the opposite under-side surface. Pad landings surround the die attach region. A plurality of locking pins are arranged at predetermined locations about the die attach paddle, on the top side surface. The plurality of locking pins may be formed integrally in the lead frame and project upward from the top side surface.

公开(公告)号：US20140239471A1

公开(公告)日：2014-08-28

申请号：US13779889

申请日：2013-02-28

Applicant: NXP B.V.

Inventor： Peeradech Khunpukdee ,  Bodin Kasemset ,  Ernst Eiper ,  Christian Zenz

IPC: H01L23/495 ,  H01L21/768

CPC classification number: H01L23/495 ,  H01L21/76838 ,  H01L23/49541 ,  H01L23/49558 ,  H01L23/49582 ,  H01L23/49586 ,  H01L24/97 ,  H01L2224/32245 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/83192 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/1576 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012

Abstract: Various aspects of the disclosure are directed to integrated circuit (IC) die leadframe packages. In accordance with one or more embodiments, a stainless steel leadframe apparatus has a polymer-based layer that adheres to both stainless steel and IC die encapsulation, with the stainless steel conducting signals/data between respective surfaces for communicating with the packaged IC die. In some embodiments, the apparatus includes the IC die adhered to the polymer-based layer via an adhesive, wire bonds coupled to the stainless steel leadframe for passing the signals/data, and an encapsulation epoxy that encapsulates the IC die and wire bonds.

Abstract translation: 本公开的各个方面涉及集成电路（IC）管芯引线框封装。 根据一个或多个实施例，不锈钢引线框架设备具有粘附于不锈钢和IC管芯封装的基于聚合物的层，其中不锈钢在相应表面之间传导信号/数据以与封装的IC管芯连通。 在一些实施例中，该装置包括通过粘合剂粘附到基于聚合物的层的IC管芯，耦合到用于传递信号/数据的不锈钢引线框架的引线接合，以及封装IC管芯和引线接合的封装环氧树脂。

公开(公告)号：US20160079146A1

公开(公告)日：2016-03-17

申请号：US14486291

申请日：2014-09-15

Applicant: NXP B.V.

Inventor： Bodin Kasemset ,  Peeradech Khunpukdee ,  Krassavan Tantirittisak

IPC: H01L23/495

Abstract: Consistent with an example embodiment, there is a package assembly structure. The structure comprises a lead frame having a topside surface and an opposite under-side surface; the lead frame includes a die attach paddle, wherein a die attach region is defined on the opposite under-side surface. Pad landings surround the die attach region. A plurality of locking pins are arranged at predetermined locations about the die attach paddle, on the top side surface. The plurality of locking pins may be formed integrally in the lead frame and project upward from the top side surface.

Abstract translation: 与示例性实施例一致，存在封装组装结构。 该结构包括具有顶侧表面和相对的下侧表面的引线框架; 引线框架包括管芯附接焊盘，其中管芯附接区域被限定在相对的底侧表面上。 垫片着陆围绕裸片附着区域。 多个锁定销布置在围绕管芯附接板的预定位置处，位于顶侧表面上。 多个锁定销可以一体地形成在引线框架中并从顶侧表面向上突出。

公开(公告)号：US08884415B2

公开(公告)日：2014-11-11

申请号：US13779889

申请日：2013-02-28

Applicant: NXP B.V.

Inventor： Peeradech Khunpukdee ,  Bodin Kasemset ,  Ernst Eiper ,  Christian Zenz

IPC: H01L23/495 ,  H01L21/768

CPC classification number: H01L23/495 ,  H01L21/76838 ,  H01L23/49541 ,  H01L23/49558 ,  H01L23/49582 ,  H01L23/49586 ,  H01L24/97 ,  H01L2224/32245 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/83192 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/1576 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012

Abstract: Various aspects of the disclosure are directed to integrated circuit (IC) die leadframe packages. In accordance with one or more embodiments, a stainless steel leadframe apparatus has a polymer-based layer that adheres to both stainless steel and IC die encapsulation, with the stainless steel conducting signals/data between respective surfaces for communicating with the packaged IC die. In some embodiments, the apparatus includes the IC die adhered to the polymer-based layer via an adhesive, wire bonds coupled to the stainless steel leadframe for passing the signals/data, and an encapsulation epoxy that encapsulates the IC die and wire bonds.

Abstract translation: 本公开的各个方面涉及集成电路（IC）管芯引线框封装。 根据一个或多个实施例，不锈钢引线框架设备具有粘附于不锈钢和IC管芯封装的基于聚合物的层，其中不锈钢在相应表面之间传导信号/数据以与封装的IC管芯连通。 在一些实施例中，该装置包括通过粘合剂粘附到基于聚合物的层的IC管芯，耦合到用于传递信号/数据的不锈钢引线框架的引线接合，以及封装IC管芯和引线接合的封装环氧树脂。