公开(公告)号：US09595455B1

公开(公告)日：2017-03-14

申请号：US15178329

申请日：2016-06-09

Applicant: NXP B.V.

Inventor： Bodin Kasemset ,  Peeradech Kunpukdee

IPC: H01L23/495 ,  H01L21/56 ,  H01L23/29 ,  H01L23/31 ,  G06K19/077

CPC classification number: H01L21/56 ,  G06K19/07745 ,  H01L21/568 ,  H01L23/3107 ,  H01L23/49513 ,  H01L23/4952 ,  H01L23/49548 ,  H01L23/49579 ,  H01L2224/04042 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/83005 ,  H01L2224/85005 ,  H01L2224/92247 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/00

Abstract: Integrated circuit (IC) modules and methods for manufacturing the IC modules are described. In an embodiment, an IC module includes a substrate with contact gaps on which an IC die is attached with electrical connections between the IC die and the substrate. The IC module further include an encapsulation that encloses the IC die and fills first portions of the contact gaps, where the first portions of the contact gaps are located within an area of the substrate defined by the encapsulation. Second portions of the contact gaps, which are located outside of the area of substrate defined by the encapsulation, are filled with a filling material.

Abstract translation: 描述了用于制造IC模块的集成电路（IC）模块和方法。 在一个实施例中，IC模块包括具有接触间隙的基板，IC芯片上安装有IC芯片和IC芯片与基板之间的电连接。 IC模块还包括封装IC管芯并填充接触间隙的第一部分的封装，其中接触间隙的第一部分位于由封装限定的衬底的区域内。 位于由封装限定的衬底区域之外的接触间隙的第二部分填充有填充材料。