公开(公告)号：US09704823B2

公开(公告)日：2017-07-11

申请号：US14927283

申请日：2015-10-29

Applicant: NXP B.V.

Inventor： Tonny Kamphuis ,  Roelf Anco Jacob Groenhuis ,  Leonardus Antonius Elisabeth van Gemert ,  Caroline Catharina Maria Beelen-Hendrikx ,  Jetse de Witte ,  Franciscus Henrikus Martinus Swartjes

IPC: H01L21/00 ,  H01L23/00 ,  H01L23/31 ,  H01L21/56 ,  H01L21/78 ,  H01L21/683 ,  H01L23/544

CPC classification number: H01L24/94 ,  H01L21/304 ,  H01L21/561 ,  H01L21/565 ,  H01L21/568 ,  H01L21/6836 ,  H01L21/78 ,  H01L23/3114 ,  H01L23/3164 ,  H01L23/3178 ,  H01L23/544 ,  H01L24/11 ,  H01L24/14 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2223/54433 ,  H01L2223/5446 ,  H01L2224/1181 ,  H01L2224/11849 ,  H01L2224/13014 ,  H01L2224/13016 ,  H01L2224/13022 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/94 ,  H01L2224/11

Abstract: Consistent with example embodiments, a wafer substrate undergoes processing in which a resilient material is applied to the front-side and back-side surfaces of the wafer substrate. By defining trenches in saw lanes between active device die, additional resilient material may be placed therein. In an example embodiment, after the active device die are separated into individual product devices, the resulting product device has coverage on the front-side surface, back-side surface, and the four vertical faces of the encapsulated active device die. The front-side surface has exposed contact areas so that the product device may be attached to an end user's system circuit board. Further, the resilient coating protects the encapsulated active device die from damage during assembly.

公开(公告)号：US10177111B2

公开(公告)日：2019-01-08

申请号：US15450972

申请日：2017-03-06

Applicant: NXP B.V.

Inventor： Tonny Kamphuis ,  Leonardus Antonius Elisabeth van Gemert ,  Roelf Anco Jacob Groenhuis ,  Caroline Catharina Maria Beelen-Hendrikx ,  Jetse de Witte ,  Franciscus Henrikus Martinus Swartjes

IPC: H01L23/00 ,  H01L23/31 ,  H01L21/56 ,  H01L21/78 ,  H01L21/683 ,  H01L23/544 ,  H01L21/304

Abstract: Consistent with example embodiments, a wafer substrate undergoes processing in which a resilient material is applied to the front-side and back-side surfaces of the wafer substrate. By defining trenches in saw lanes between active device die, additional resilient material may be placed therein. In an example embodiment, after the active device die are separated into individual product devices, the resulting product device has coverage on the front-side surface, back-side surface, and the four vertical faces of the encapsulated active device die. The front-side surface has exposed contact areas so that the product device may be attached to an end user's system circuit board. Further, the resilient coating protects the encapsulated active device die from damage during assembly.

公开(公告)号：US20170179076A1

公开(公告)日：2017-06-22

申请号：US15450972

申请日：2017-03-06

Applicant: NXP B.V.

Inventor： Tonny Kamphuis ,  Leonardus Antonius Elisabeth van Gemert ,  Roelf Anco Jacob Groenhuis ,  Caroline Catharina Maria Beelen-Hendrikx ,  Jetse de Witte ,  Franciscus Henrikus Martinus Swartjes

IPC: H01L23/00 ,  H01L21/683 ,  H01L21/78 ,  H01L21/56 ,  H01L23/544 ,  H01L21/304

CPC classification number: H01L24/94 ,  H01L21/304 ,  H01L21/561 ,  H01L21/565 ,  H01L21/568 ,  H01L21/6836 ,  H01L21/78 ,  H01L23/3114 ,  H01L23/3164 ,  H01L23/3178 ,  H01L23/544 ,  H01L24/11 ,  H01L24/14 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2223/54433 ,  H01L2223/5446 ,  H01L2224/1181 ,  H01L2224/11849 ,  H01L2224/13014 ,  H01L2224/13016 ,  H01L2224/13022 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/94 ,  H01L2224/11

Abstract: Consistent with example embodiments, a wafer substrate undergoes processing in which a resilient material is applied to the front-side and back-side surfaces of the wafer substrate. By defining trenches in saw lanes between active device die, additional resilient material may be placed therein. In an example embodiment, after the active device die are separated into individual product devices, the resulting product device has coverage on the front-side surface, back-side surface, and the four vertical faces of the encapsulated active device die. The front-side surface has exposed contact areas so that the product device may be attached to an end user's system circuit board. Further, the resilient coating protects the encapsulated active device die from damage during assembly.

公开(公告)号：US20160276176A1

公开(公告)日：2016-09-22

申请号：US14927283

申请日：2015-10-29

Applicant: NXP B.V.

Inventor： Tonny Kamphuis ,  Roelf Anco Jacob Groenhuis ,  Leonardus Antonius Elisabeth van Gemert ,  Caroline Catharina Maria Beelen-Hendrikx ,  Jetse de Witte ,  Franciscus Henrikus Martinus Swartjes

IPC: H01L21/56 ,  H01L23/31 ,  H01L21/304 ,  H01L21/78 ,  H01L23/00

CPC classification number: H01L24/94 ,  H01L21/304 ,  H01L21/561 ,  H01L21/565 ,  H01L21/568 ,  H01L21/6836 ,  H01L21/78 ,  H01L23/3114 ,  H01L23/3164 ,  H01L23/3178 ,  H01L23/544 ,  H01L24/11 ,  H01L24/14 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2223/54433 ,  H01L2223/5446 ,  H01L2224/1181 ,  H01L2224/11849 ,  H01L2224/13014 ,  H01L2224/13016 ,  H01L2224/13022 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/94 ,  H01L2224/11

Abstract: Consistent with example embodiments, a wafer substrate undergoes processing in which a resilient material is applied to the front-side and back-side surfaces of the wafer substrate. By defining trenches in saw lanes between active device die, additional resilient material may be placed therein. In an example embodiment, after the active device die are separated into individual product devices, the resulting product device has coverage on the front-side surface, back-side surface, and the four vertical faces of the encapsulated active device die. The front-side surface has exposed contact areas so that the product device may be attached to an end user's system circuit board. Further, the resilient coating protects the encapsulated active device die from damage during assembly.

Abstract translation: 与示例性实施例一致，晶片衬底经历其中将弹性材料施加到晶片衬底的前侧和后侧表面的处理。 通过在活动装置模具之间限定锯槽中的沟槽，可以在其中放置附加的弹性材料。 在示例性实施例中，在有源器件管芯被分离成单个产品器件之后，所得到的产品器件在封装的有源器件管芯的正面，背面和四个垂直面上具有覆盖。 前侧表面具有暴露的接触区域，使得产品装置可以附接到终端用户的系统电路板。 此外，弹性涂层在组装期间保护封装的主动装置模具免受损坏。

公开(公告)号：US20230137977A1

公开(公告)日：2023-05-04

申请号：US17452905

申请日：2021-10-29

Applicant: NXP B.V.

Inventor： Akhilesh Kumar Singh ,  Chee Seng Foong ,  Franciscus Henrikus Martinus Swartjes ,  Andrew Jefferson Mawer

IPC: H01L25/10 ,  H01L25/00 ,  H01L23/00 ,  H01L23/31

Abstract: There is disclosed a semiconductor package assembly comprising: a substrate having a top substrate surface and a substrate bottom surface; a first semiconductor die, partially over the substrate and having a die bottom surface having first and second pluralities of I/O pads thereon; a first plurality of localised electrical connection components (LECCs), affixed between the die bottom surface and the substrate top surface and providing electrical connections between the substrate and the first plurality of I/O pads; a second plurality of LECCs, affixed to the substrate bottom surface, and for providing electrical connection between the substrate and a circuit board; wherein the second plurality of I/O pads are arranged for providing electrical connections to a chip-scale-package unit to be affixed to the first semiconductor die by a third plurality of LECCs, and to be positioned in a same horizonal plane as the substrate. Corresponding methods are also disclosed.

公开(公告)号：US09466585B1

公开(公告)日：2016-10-11

申请号：US14927311

申请日：2015-10-29

Applicant: NXP B.V.

Inventor： Tonny Kamphuis ,  Leonardus Antonius Elisabeth van Gemert ,  Roelf Anco Jacob Groenhuis ,  Caroline Catharina Maria Beelen-Hendrikx ,  Franciscus Henrikus Martinus Swartjes ,  Jetse de Witte

IPC: H01L23/31 ,  H01L23/00 ,  H01L21/56 ,  H01L21/304 ,  H01L21/78 ,  H01L21/683 ,  H01L21/3065

CPC classification number: H01L24/94 ,  H01L21/304 ,  H01L21/561 ,  H01L21/565 ,  H01L21/568 ,  H01L21/6836 ,  H01L21/78 ,  H01L23/3114 ,  H01L23/3164 ,  H01L23/3178 ,  H01L23/544 ,  H01L24/11 ,  H01L24/14 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2223/54433 ,  H01L2223/5446 ,  H01L2224/1181 ,  H01L2224/11849 ,  H01L2224/13014 ,  H01L2224/13016 ,  H01L2224/13022 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/94 ,  H01L2224/11

Abstract: Consistent with example embodiments, a wafer substrate undergoes processing in which a resilient material is applied to the front-side and back-side surfaces of the wafer substrate. By defining trenches in saw lanes between active device die, additional resilient material may be placed therein. In an example embodiment, after the active device die are separated into individual product devices, the resulting product device has coverage on the front-side surface, back-side surface, and the four vertical faces of the encapsulated active device die. The front-side surface has exposed contact areas so that the product device may be attached to an end user's system circuit board. Further, the resilient coating protects the encapsulated active device die from damage during assembly.

Abstract translation: 与示例性实施例一致，晶片衬底经历其中将弹性材料施加到晶片衬底的前侧和后侧表面的处理。 通过在活动装置模具之间限定锯槽中的沟槽，可以在其中放置附加的弹性材料。 在示例性实施例中，在有源器件管芯被分离成单个产品器件之后，所得到的产品器件在封装的有源器件管芯的正面，背面和四个垂直面上具有覆盖。 前侧表面具有暴露的接触区域，使得产品装置可以附接到终端用户的系统电路板。 此外，弹性涂层在组装期间保护封装的主动装置模具免受损坏。

公开(公告)号：US20160276306A1

公开(公告)日：2016-09-22

申请号：US14927311

申请日：2015-10-29

Applicant: NXP B.V.

Inventor： Tonny Kamphuis ,  Leonardus Antonius Elisabeth van Gemert ,  Roelf Anco Jacob Groenhuis ,  Caroline Catharina Maria Beelen-Hendrikx ,  Franciscus Henrikus Martinus Swartjes ,  Jetse de Witte

IPC: H01L23/00 ,  H01L21/56 ,  H01L21/3065 ,  H01L21/78 ,  H01L21/683 ,  H01L23/31 ,  H01L21/304

CPC classification number: H01L24/94 ,  H01L21/304 ,  H01L21/561 ,  H01L21/565 ,  H01L21/568 ,  H01L21/6836 ,  H01L21/78 ,  H01L23/3114 ,  H01L23/3164 ,  H01L23/3178 ,  H01L23/544 ,  H01L24/11 ,  H01L24/14 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2223/54433 ,  H01L2223/5446 ,  H01L2224/1181 ,  H01L2224/11849 ,  H01L2224/13014 ,  H01L2224/13016 ,  H01L2224/13022 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/94 ,  H01L2224/11

Abstract: Consistent with example embodiments, a wafer substrate undergoes processing in which a resilient material is applied to the front-side and back-side surfaces of the wafer substrate. By defining trenches in saw lanes between active device die, additional resilient material may be placed therein. In an example embodiment, after the active device die are separated into individual product devices, the resulting product device has coverage on the front-side surface, back-side surface, and the four vertical faces of the encapsulated active device die. The front-side surface has exposed contact areas so that the product device may be attached to an end user's system circuit board. Further, the resilient coating protects the encapsulated active device die from damage during assembly.

Abstract translation: 与示例性实施例一致，晶片衬底经历其中将弹性材料施加到晶片衬底的前侧和后侧表面的处理。 通过在活动装置模具之间限定锯槽中的沟槽，可以在其中放置附加的弹性材料。 在示例性实施例中，在有源器件管芯被分离成单个产品器件之后，所得到的产品器件在封装的有源器件管芯的正面，背面和四个垂直面上具有覆盖。 前侧表面具有暴露的接触区域，使得产品装置可以附接到终端用户的系统电路板。 此外，弹性涂层在组装期间保护封装的主动装置模具免受损坏。